Apparatus employing heat sink
1 Assignment
0 Petitions
Accused Products
Abstract
The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.
25 Citations
48 Claims
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1-24. -24. (Cancelled).
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25. Apparatus comprising:
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a printed circuit board having a heat releasing semiconductor package mounted thereon and a heat sink engaging said semiconductor package;
a power supply configured to supply power to said printed circuit board; and
a chassis which houses said power supply and said circuit board;
said heat sink having;
a body of heat transferring material having opposing first and second broad surfaces;
a first body of fins affixed to said first broad surface and defining a first array of a plurality of elongate tubular channels directing heat transfer fluid flow; and
a second body of fins affixed to said second broad surface and defining a second array of a plurality of elongate tubular channels directing heat transfer fluid flow. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32)
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33. Apparatus comprising:
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a chassis which provides a plurality of slots;
a power module which is housed in said chassis and which provides power to at least two of the slots provided by said chassis;
a printed circuit board configured for removable insertion into a slot provided by said chassis and powered by said power module, the printed circuit board having a heat releasing semiconductor package mounted thereon and a heat sink engaging said semiconductor package to transfer heat therefrom;
said heat sink having;
a body of heat transferring material having a broad surface; and
an array of fins affixed to said broad surface, the array of fins having a plurality of elongate tubular channels which direct heat transfer fluid flow. - View Dependent Claims (34, 35, 36, 37, 38)
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39. Apparatus comprising:
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a chassis which provides a plurality of slots;
a power module which is housed in said chassis and which provides power to at least two of the slots provided by said chassis;
at least two blades configured for removable insertion into slots provided by said chassis and powered by said power module, the blades having a heat releasing semiconductor package mounted thereon and a heat sink engaging said semiconductor package to transfer heat therefrom;
said heat sink having;
a body of heat transferring material having a first broad surface; and
a first array of fins affixed to said first broad surface, the first array of fins having a plurality of elongate tubular channels which direct heat transfer fluid flow. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46, 47, 48)
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Specification