Multi-layered structures and methods for manufacturing the multi-layered structures
First Claim
Patent Images
1. A method of forming a multi-layered laminate for use in an in-mold process, the method comprising:
- shaping the substrate into a desired shape;
applying a decorative feature to at least one surface of a substrate; and
depositing a metal layer onto at least one surface of the decorated and shaped substrate.
0 Assignments
0 Petitions
Accused Products
Abstract
Multi-layered molds and methods for manufacturing multi-layered molds. A metallized layer can be deposited on at least one side of a substrate. The substrate can be shaped and then the metal layer can be deposited onto the shaped substrate. Optionally, an injection molded resin can be deposited onto the substrate and/or metal layer.
104 Citations
74 Claims
-
1. A method of forming a multi-layered laminate for use in an in-mold process, the method comprising:
-
shaping the substrate into a desired shape;
applying a decorative feature to at least one surface of a substrate; and
depositing a metal layer onto at least one surface of the decorated and shaped substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
-
15. A method of forming a multi-layered structure, the method comprising:
-
placing a pre-shaped metallized insert into an injection molding chamber; and
injection molding a resin on the metallized insert. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
-
-
33. A method of forming a multi-layered structure, the method comprising:
-
shaping a substrate into a desired shape;
depositing a metal layer onto at least one surface of the shaped substrate. placing a metallized substrate into an injection molding chamber; and
injection molding a resin on the metallized substrate. - View Dependent Claims (34, 35, 36, 37, 38, 39)
-
-
40. A method of forming a multi-layered structure, the method comprising:
-
applying a decorative layer to at least one side of a substrate;
shaping the decorated substrate into a desired shape;
depositing a metal layer onto at least one surface of the decorated and shaped substrate. placing a metallized substrate into an injection molding chamber; and
injection molding a resin on the metallized substrate.
-
-
41. A multi-layered insert for an in-mold manufacturing process, the insert comprising:
-
a shaped substrate comprising a decorative feature along at least one surface; and
a metallized layer disposed over at least one of the substrate surface and the decorative feature. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49, 50)
-
-
51. A multi-layered laminate comprising:
-
a pre-shaped film;
a metal layer coupled to the pre-shaped film, the metal layer having a thickness sufficient to shield electromagnetic interference; and
an injection molded plastic structure coupled to at least one of the pre-shaped film and metal layer. - View Dependent Claims (52, 53, 54, 55, 56, 57, 58)
-
-
59. A shielded plastic housing for an electronic component, the housing comprising:
-
an injection molded layer;
a thermoform layer comprising a metal layer that has a thickness sufficient to block transmission of electromagnetic interference, wherein one of the metal layer and thermoform layer is coupled to the injection molded layer; and
a decorative layer coupled to one of the injection molded layer, the thermoform layer and the metal layer. - View Dependent Claims (60, 61)
-
-
62. An electronic device comprising:
-
a plastic housing comprising;
an injection molded layer;
a thermoform layer comprising a metal layer that has a thickness sufficient to block transmission of electromagnetic interference, wherein one of the metal layer and thermoform layer is coupled to the injection molded layer; and
a printed circuit board disposed within the plastic housing. - View Dependent Claims (63, 64, 65, 66, 67)
-
-
68. A method of shielding an electronic component of a printed circuit board, the method comprising:
-
providing a printed circuit board having an electronic component and a ground trace;
placing an electronic housing around the electronic component;
conforming a polymer insert comprising a metal shielding layer to the electronic housing; and
grounding the metal shielding layer of the polymer insert with the ground trace on the printed circuit board. - View Dependent Claims (69, 70, 71, 72)
-
-
73. A method of shielding an electronic component of a printed circuit board, the method comprising:
-
providing a printed circuit board having an electronic component and a ground trace;
placing a housing comprising a metal shielding layer around the electronic component; and
creating a via through a portion of the housing;
positioning the via over the ground trace; and
depositing at least one of a conductive adhesive and a solder in the via to conductively ground the metal layer in the housing to the ground trace. - View Dependent Claims (74)
-
Specification