×

Processing copper-magnesium alloys and improved copper alloy wire

  • US 20040238086A1
  • Filed: 05/27/2003
  • Published: 12/02/2004
  • Est. Priority Date: 05/27/2003
  • Status: Abandoned Application
First Claim
Patent Images

1. A copper alloy wire having high strength and high conductivity which comprises a copper alloy containing from 0.05 to 0.9 wt % magnesium and more than 15 ppm impurities in total, said wire having a single end diameter less than 0.010 inches, a tensile strength of at least 100 ksi, and an electrical conductivity greater than 60% IACS.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×