Component handling device having a film insert molded RFID tag

• US 20040238623A1
• Filed: 05/05/2004
• Published: 12/02/2004
• Est. Priority Date: 05/09/2003
• Status: Abandoned Application

• Current Assignee: Entegris Incorporated
• Original Assignee: Entegris Incorporated
• Inventors: Asp, Wayne
• Application Number:
  US10/839,803
• Publication Number:
  US 20040238623A1
• Time in Patent Office: Days
• US Class Current: 235/380
• CPC Class Codes: B29C 2045/14844 Layers protecting the insert from injected material
• CPC Class Codes: B29C 2045/14852 incorporating articles with a data carrier, e.g. chips memory cards, chip cards B29L2017/006
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 45/14811 Multilayered articles B29C45/14827 takes precedence
• CPC Class Codes: B29C 45/14836 Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage B29C45/14434 takes precedence
• CPC Class Codes: B29K 2995/002 Coloured
• CPC Class Codes: B29K 2995/0087 Wear resistance
• CPC Class Codes: B29L 2007/004 Tags; Tickets labels B29L2031/744

Abstract

A system and method for including a thin and flexible RFID tag in the molding process for handlers, transporters, carriers, trays and like handling devices utilized in the semiconductor and sensitive electronic component processing and handling industries. The RFID tag of predetermined size and shape is generally bonded or encapsulated between two thermopolymer film layers to create an RFID tag laminate. This RFID tag laminate is selectively placed along a shaping surface in a mold cavity for alignment with a desired target surface of a moldable molten resin material such that upon completion of the film insert molding process, the RFID tag laminate is integrally bonded to at least a portion of the molded handling device, or handling device component/part.

Claims

1. A wafer container having a Radio Frequency Identification (“

RFID”

) tag integrated therein, comprising;

an enclosure portion made from thermoplastic polymer material and adapted for holding at least one wafer; and

an RFID film laminate member integrally molded in a surface of the enclosure portion by way of film insert molding, the RFID film member including a first thin flexible film layer, a second thin flexible film layer, and an RFID tag encapsulated between the first and second thin flexible film layers, and wherein the first thin flexible film layer provides a barrier layer between the RFID tag and the enclosure portion during the film insert molding.

2. The wafer container of claim 1, wherein at least one of the first and second thin flexible film layers is less than or equal to approximately 0.020 inches.

3. The wafer container of claim 1, wherein the RFID tag is encapsulated between the first and second thin flexible film layers with an adhesive.

4. The wafer container of claim 1, wherein at least one of the first and second thin flexible film layers includes a recess adapted to receive the RFID tag therein.

5. The wafer container of claim 1, wherein at least one of the first and second thin flexible film layers includes a thermoformed indentation adapted to receive the RFID tag therein.

6. The wafer container of claim 1, wherein at least one of the first and second thin flexible film layers is constructed of a multi-layer thin flexible film laminate.

7. The wafer container of claim 6, wherein the multi-layer thin flexible film laminate comprises a first film layer and a second film layer, with each layer being substantially constructed of a different thermoplastic polymer.

8. The wafer container of claim 1, wherein at least one of the first and second thin flexible film layers of the RFID laminate member further includes indicia marked thereon.

9. The wafer container of claim 8, wherein the indicia is marked on the second thin flexible film layer.

10. The wafer container of claim 8, wherein the indicia is graphical indicia that generally visually covers the RFID tag encapsulated within the RFID laminate member.

11. The wafer container of claim 1, wherein the first and second thin flexible film layers are generally the same size and shape.

12. The wafer container of claim 1, wherein the first and second thin flexible film layers are generally of different size and shape.

13. The wafer container of claim 1, wherein at least one of the first and second thin flexible film layers is constructed substantially of a material selected from the group consisting of:

polyester, polypropylene, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinyldiene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.

14. The wafer container of claim 1, wherein at least one of the first and second thin flexible film layers includes at least one perforation therein to provide a gas evacuation channel therethrough.

15. A method of making a wafer container having a Radio Frequency Identification (“

RFID”

) tag integrated therein, the method comprising the steps of;

forming an RFID film laminate member from a first thin flexible film layer, a second thin flexible film layer, and an RFID tag encapsulated between the first and second thin flexible film layers;

positioning the RFID film laminate member on a shaping surface of a mold such that the second thin flexible film layer is confronting the shaping surface; and

molding thermoplastic polymer material over the shaping surface of the mold to form an enclosure portion of the wafer container, the RFID film laminate member being thereby integrally bonded in the enclosure portion, with the first thin flexible film layer serving as a protective barrier from the thermoplastic polymer material during molding.

16. The method of claim 15, wherein forming the RFID film laminate member includes providing graphical indicia on at least one of the first and second thin flexible film layers.

17. The method of claim 15, wherein forming the RFID film laminate member includes providing at least one perforation in at least one of the first and second thin flexible film layers to provide a gas evacuation channel during molding.

18. A chip handling tray having a Radio Frequency Identification (“

RFID”

) tag integrated therein, comprising;

a tray portion made from thermoplastic polymer material; and

an RFID film laminate member integrally molded in a surface of the tray portion by way of film insert molding, the RFID film member including a first thin flexible film layer, a second thin flexible film layer, and an RFID tag encapsulated between the first and second thin flexible film layers, and wherein the first thin flexible film layer provides a barrier layer between the RFID tag and the tray portion during the film insert molding.

19. The chip handling tray of claim 18, wherein at least one of the first and second thin flexible film layers is less than or equal to approximately 0.020 inches.

20. The chip handling tray of claim 18, wherein the RFID tag is encapsulated between the first and second thin flexible film layers with an adhesive.

21. The chip handling tray of claim 18, wherein at least one of the first and second thin flexible film layers includes a recess adapted to receive the RFID tag therein.

22. The chip handling tray of claim 18, wherein at least one of the first and second thin flexible film layers includes a thermoformed indentation adapted to receive the RFID tag therein.

23. The chip handling tray of claim 18, wherein at least one of the first and second thin flexible film layers is constructed of a multi-layer thin flexible film laminate.

24. The chip handling tray of claim 23, wherein the multi-layer thin flexible film laminate comprises a first film layer and a second film layer, with each layer being substantially constructed of a different thermoplastic polymer.

25. The chip handling tray of claim 18, wherein at least one of the first and second thin flexible film layers of the RFID laminate member further includes indicia marked thereon.

26. The chip handling tray of claim 25, wherein the indicia is marked on a surface of the second thin flexible film layer.

27. The chip handling tray of claim 25, wherein the indicia is graphical indicia that generally visually covers the RFID tag encapsulated within the RFID laminate member.

28. The chip handling tray of claim 18, wherein the first and second thin flexible film layers are generally the same size and shape.

29. The chip handling tray of claim 18, wherein the first and second thin flexible film layers are generally of different size and shape.

30. The chip handling tray of claim 18 wherein at least one of the first and second thin flexible film layers is constructed substantially of a material selected from the group consisting of:

polyester, polypropylene, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinyldiene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.

31. The chip handling tray of claim 18, wherein at least one of the first and second thin flexible film layers includes at least one perforation therein to provide a gas evacuation channel therethrough.

32. A method of making a chip handling tray having a Radio Frequency Identification (“

RFID”

) tag integrated therein, the method comprising the steps of;

forming an RFID film laminate member from a first thin flexible film layer, a second thin flexible film layer, and an RFID tag encapsulated between the first and second thin flexible film layers;

positioning the RFID film laminate member on a shaping surface of a mold such that the second thin flexible film layer is confronting the shaping surface; and

molding thermoplastic polymer material over the shaping surface of the mold to form a tray portion of the chip handling tray, the RFID film laminate member being thereby integrally bonded in the tray portion, with the first thin flexible film layer serving as a protective barrier from the thermoplastic polymer material during molding.

33. A semiconductor component handling device having a Radio Frequency Identification (“

RFID”

) tag integrated therein, comprising;

an handler housing portion made from thermoplastic polymer material and adapted for housing at least one semiconductor component; and

an RFID film laminate member integrally molded in a surface of the handler housing portion by way of film insert molding, the RFID film member including a first thin flexible film layer, a second thin flexible film layer, and an RFID tag encapsulated between the first and second thin flexible film layers, and wherein the first thin flexible film layer provides a barrier layer between the RFID tag and the handler housing portion during the film insert molding.

34. The handling device of claim 33, wherein at least one of the first and second thin flexible film layers of the RFID laminate member further includes indicia marked thereon.

35. The handling device of claim 33, wherein at least one of the first and second thin flexible film layers includes at least one perforation therein to provide a gas evacuation channel therethrough.

36. A semiconductor component handling device having a Radio Frequency Identification (“

RFID”

) tag integrated therein, comprising;

means for housing at least one semiconductor component, made from thermoplastic polymer material; and

means for laminating an RFID tag being integrally molded in a surface of the means for housing by way of film insert molding such that the RFID tag is encapsulated to provide barrier protection for the RFID tag during integral bonding of the means for laminating an RFID tag to the means for housing during the film insert molding.

37. A method of film insert molding a Radio Frequency Identification (“

RFID”

) tag to a semiconductor component handling device, comprising the steps of;

forming an RFID tag film laminate of a first thin flexible film layer, a second thin flexible film layer, and the RFID tag encapsulated between the first and second thin flexible film layer;

accessing a molding unit having a mold cavity, the mold cavity including at least one shaping surface;

positioning the RFID tag film laminate within the cavity of the molding unit along at least a portion of the at least one shaping surface;

injecting a substantially molten thermoplastic material into the cavity of the molding unit, over the positioned RFID tag film laminate, to conform to the shape of the at least one shaping surface;

waiting a cooling period wherein the thermoplastic material substantially solidifies to matably bond with the RFID tag film laminate to create at least a portion of the component handling device; and

ejecting the at least a portion of the component handling device, with the RFID tag film laminate integrated thereto, from the molding unit.

38. The method of claim 37, wherein forming the RFID film laminate includes providing graphical indicia on at least one of the first and second thin flexible film layers.

39. The method of claim 37, wherein forming the RFID film laminate includes providing at least one perforation in at least one of the first and second thin flexible film layers to provide a gas evacuation channel during molding.