Interferometric modulation of radiation
First Claim
Patent Images
1. An interferometric modulator comprising a cavity defined by two walls, at least two arms connecting the two walls to permit motion of the walls relative to each other, the two arms being configured and attached to a first one of the walls in a manner that enables mechanical stress in the first wall to be relieved by motion of the first wall essentially within the plane of the first wall.
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Abstract
Improvements in an interferometric modulator that cavity defined by two walls.
441 Citations
37 Claims
- 1. An interferometric modulator comprising a cavity defined by two walls, at least two arms connecting the two walls to permit motion of the walls relative to each other, the two arms being configured and attached to a first one of the walls in a manner that enables mechanical stress in the first wall to be relieved by motion of the first wall essentially within the plane of the first wall.
- 13. An array of interferometric modulators, each of the interferometric modulators comprising a cavity defined by two walls, at least two arms connecting the two walls to permit motion of the walls relative to each other, the walls and arms of different ones of the modulators being configured to achieve different spring constants associated with motion of the walls relative to each other.
- 15. A method of fabricating an interferometric modulator comprising forming two walls of a cavity connected by at least two arms and, after the forming, permitting the a first one of the walls to rotate in the plane of the first wall relative to the arms to relieve mechanical stress in the first wall.
- 16. An interferometric modulator comprising three walls that are generally parallel to one another, the walls being supported for movement of at least one of the walls relative to the other two, and control circuitry for driving at least one of the walls to discrete positions representing three discrete states of operation of the modulator.
- 19. An interference modulator comprising a cavity defined by two walls that are movable relative to one another to and from a contact position in which the two walls are essentially adjacent to one another, and spacers mounted to form part of one of the walls to reduce the surface area over which the two walls touch in the contact position.
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21. An interference modulator comprising a cavity defined by two walls that are separated by a fluid-filled gap, the two walls being movable relative to each other to change the volume of the gap, and an aperture in one of the walls configured to control the damping effect of fluid moving into or out of the gap as the volume of the gap changes.
- 23. An interference modulator comprising at least two walls that are movable relative to each other to define a cavity between them, the relative positions of the walls defining two modes, one in which the modulator reflects incident light and appears white and another in which the modulator absorbs incident light and appears black.
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25. An interferometric modulator comprising a cavity defined by two walls, at least two arms connecting the two walls to permit motion of the walls relative to each other, with the response time of the modulator being controlled to a predetermined value by a combination of at least two of:
- the lengths of the arms, the locations at which the arms are connected to the walls, the thickness of one of the walls, the thickness of the arms, the presence and dimensions of damping holes, and the ambient gas pressure in the vicinity of the modulator.
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26. An interferometric modulator comprising a cavity defined by two walls, at least two arms connecting the two walls to permit motion of the walls relative to each and a charge deposition mitigating device comprising at least one of actuation rails or the application of alternating polarity drive voltages.
- 27. An interferometric modulator comprising a cavity defined by two walls held by a support comprising two materials such that the electrical or mechanical properties of the mechanical support differ at different locations in a cross-section of the mechanical support.
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31. A method for use in fabricating a microelectromechanical structure, comprising
using a gas phase etchant to remove a deposited sacrificial layer.
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34. A method of making arrays of microelectromechanical structure on a production line comprising
forming electronic features on a surface of a glass or plastic substrate that is at least as large as 14″ - ×
16″
, andmicromachining electromechanical structures on the substrate. - View Dependent Claims (35, 36, 37)
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Specification