Apparatus employing heat sink
1 Assignment
0 Petitions
Accused Products
Abstract
The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.
25 Citations
46 Claims
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1-24. -24. (Cancelled).
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25. Apparatus comprising:
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a printed circuit board having a heat releasing semiconductor package mounted thereon and a heat sink engaging said semiconductor package to transfer heat therefrom;
a power supply configured to supply power to said printed circuit board; and
a chassis which houses said power supply and said circuit board;
said heat sink having;
a rectilinear body of heat transferring material having opposing first and second planar surfaces;
a first body of fins affixed to said first planar surface and defining a first array of a plurality of elongate tubular channels directing heat transfer fluid flow; and
a second body of fins affixed to said second planar surface and defining a second array of a plurality of elongate tubular channels directing heat transfer fluid flow. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32)
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33. Apparatus comprising:
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a chassis which provides a plurality of slots;
a power module which is housed in said chassis and which provides power to at least two of the slots provided by said chassis;
a printed circuit board configured for removable insertion into a slot provided by said chassis and powered by said power module, the printed circuit board having a heat releasing semiconductor package mounted thereon and a heat sink engaging said semiconductor package to transfer heat therefrom;
said heat sink having;
a rectilinear body of heat transferring material having opposing first and second planar surfaces;
a first body of fins affixed to said first planar surface and defining a first array of a plurality of elongate tubular channels directing heat transfer fluid flow; and
a second body of fins affixed to said second planar surface and defining a second array of a plurality of elongate tubular channels directing heat transfer fluid flow. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41, 44, 46)
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42. Apparatus comprising:
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a printed circuit board having a heat releasing semiconductor package mounted thereon and a heat sink engaging said semiconductor package to transfer heat therefrom;
a power supply configured to supply power to said printed circuit board; and
a chassis which houses said power supply and said circuit board;
said heat sink having;
a rectilinear body of heat transferring material having opposing first and second planar surfaces, said planar surfaces extending parallel to said printed circuit board;
a first body of fins affixed to said first planar surface so as to extend away from said printed circuit board and defining a first array of a plurality of elongate tubular channels directing heat transfer fluid flow;
a second body of fins affixed to said second planar surface so as to extend toward said printed circuit board and defining a second array of a plurality of elongate tubular channels directing heat transfer fluid flow.
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43. Apparatus comprising:
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a chassis which provides a plurality of slots;
a power module which is housed in said chassis and which provides power to at least two of the slots provided by said chassis;
a printed circuit board configured for removable insertion into a slot provided by said chassis and powered by said power module, the printed circuit board having a heat releasing semiconductor package mounted thereon and a heat sink engaging said semiconductor package to transfer heat therefrom;
said heat sink having;
a rectilinear body of heat transferring material having opposing first and second planar surfaces, said planar surfaces extending parallel to said printed circuit board;
a first body of fins affixed to said first planar surface so as to extend away from said printed circuit board and defining a first array of a plurality of elongate tubular channels directing heat transfer fluid flow; and
a second body of fins affixed to said second planar surface so as to extend toward said printed circuit board and defining a second array of a plurality of elongate tubular channels directing heat transfer fluid flow.
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45. Apparatus comprising:
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a chassis which provides a plurality of slots;
a power module which is housed in said chassis and which provides power to at least two of the slots provided by said chassis;
a printed circuit board configured for removable insertion into a slot provided by said chassis and powered by said power module, the printed circuit board having a heat releasing semiconductor package mounted thereon and a heat sink engaging said semiconductor package to transfer heat therefrom;
said heat sink having;
a plate of heat transferring material having opposing first and second planar surfaces;
a first body of fins affixed to said first planar surface and defining a first array of a plurality of elongate tubular channels directing heat transfer fluid flow parallel to said circuit board ; and
a second body of fins affixed to said second planar surface and defining a second array of a plurality of elongate tubular channels directing heat transfer fluid flow parallel to said circuit board, said second body of fins extending over a only portion of said second planar surface to define a residual area which engages said heat-transfer surface of said semiconductor package for heat transfer.
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Specification