Method and system for sensing IC package orientation in sockets

• US 20040242054A1
• Filed: 07/08/2004
• Published: 12/02/2004
• Est. Priority Date: 04/21/2003
• Status: Abandoned Application

• Current Assignee: John A. Benavides, Richard W. Adkisson
• Original Assignee: John A. Benavides, Richard W. Adkisson
• Inventors: Adkisson, Richard W., Benavides, John A.
• Application Number:
  US10/888,897
• Publication Number:
  US 20040242054A1
• Time in Patent Office: Days
• US Class Current: 439/490
• CPC Class Codes: H05K 7/1092 with built-in components, e.g. intelligent sockets

Abstract

An embodiment of this invention provides a system and method for indicating the orientation of a packaged IC in a socket. An LED is physically mounted to a socket. One lead of the LED is electrically connected to a positive voltage through a socket hole on the socket. When the orientation of the IC package in the socket is correct, the other lead of the LED is connected to a ground path on the packaged IC. As a result, the LED is activated indicating the orientation of the packaged IC is correct.

Claims

1. ) A system for indicating orientation of a packaged IC comprising:

a) a socket;

b) an audio source, the audio source physically and electrically connected to the socket;

c) wherein the audio source is activated when the packaged IC is correctly inserted in the socket.

2. ) A system for indicating orientation of a packaged IC comprising:

a) a socket;

b) an audio source, the audio source physically and electrically connected to the socket;

c) wherein the audio source is activated when the packaged IC is incorrectly inserted in the socket.

3. ) A system for indicating orientation of a packaged IC comprising:

a) a socket;

b) an audio source, the audio source physically mounted to the socket and electrically connected between a first socket hole and a second socket hole on the socket;

c) wherein the audio source is activated when the packaged IC is correctly inserted in the socket.

4. ) A system for indicating orientation of a packaged IC comprising:

a) a socket;

b) an audio source, the audio source physically mounted to the socket and electrically connected between a first socket hole and a second socket hole on the socket;

c) wherein the audio source is activated when the packaged IC is incorrectly inserted in the socket.

5. ) A system for indicating orientation of a packaged IC comprising:

a) a socket;

b) an audio source, the audio source physically mounted to the socket and electrically connected between a first socket hole and second socket hole on the socket;

c) wherein the first socket hole is connected to a positive voltage;

d) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented correctly;

e) wherein the audio source is activated when the packaged IC is oriented correctly.

6. ) The system in claim 5 wherein the audio source is a piezo-electric buzzer.

7. ) The system in claim 5 wherein the socket is a ZIF socket.

8. ) A system for indicating orientation of a packaged IC comprising:

a) a socket;

b) an audio source, the audio source physically mounted to the socket and electrically connected between a first socket hole and second socket hole on the socket;

c) wherein the first socket hole is connected to a positive voltage;

d) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented incorrectly;

e) wherein the audio source is activated when the packaged IC is oriented incorrectly.

9. ) The system in claim 8 wherein the audio source is a piezo-electric buzzer.

10. ) The system in claim 8 wherein the socket is a ZIF socket.

11. ) A method for indicating orientation of a packaged IC comprising:

a) physically mounting an audio source to a socket;

b) electrically connecting the audio source between a first socket hole and a second socket hole on the socket;

c) inserting the packaged IC in the socket;

d) providing a positive voltage to the first socket hole;

e) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented correctly;

f) wherein the audio source is activated when the packaged IC is oriented correctly.

12. ) The method in claim 11 wherein the audio source is a piezo-electric buzzer.

13. ) The method in claim 11 wherein the socket is a ZIF socket.

14. ) A method for indicating orientation of a packaged IC comprising:

a) physically mounting an audio source to a socket;

b) electrically connecting the audio source between a first socket hole and a second socket hole on the socket;

c) inserting the packaged IC in the socket;

d) providing a positive voltage to the first socket hole;

e) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented incorrectly;

f) wherein the audio source is activated when the packaged IC is oriented incorrectly.

15. ) The method in claim 14 wherein the audio source is a piezo-electric buzzer.

16. ) The method in claim 14 wherein the socket is a ZIF socket.