Multi-surface mounting member and electronic device

• US 20040244510A1
• Filed: 06/05/2003
• Published: 12/09/2004
• Est. Priority Date: 06/05/2003
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Harney, Kieran P., Felton, Lawrence E., Long, Lewis
• Granted Patent: US 7,040,922 B2
• Time in Patent Office: Days
• US Class Current: 73/866.5
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: G01C 21/166 Mechanical, construction or arrangement details of inertial navigation systems
• CPC Class Codes: Y10S 439/913 Condition determining device, e.g. oxygen sensor, accelerometer, ionizer chamber, thermocouple

Abstract

A motion sensor has a mounting member with a plurality of mounting surfaces, and a plurality of motion sensor devices mounted to two or more of the mounting surfaces.

Claims

1. A motion sensor comprising:

a unitary mounting member having a plurality of mounting surfaces; and

a plurality of motion sensor devices mounted to two or more of the mounting surfaces.

2. The motion sensor as defined by claim 1 wherein the plurality of mounting surfaces include two orthogonal mounting surfaces.

3. The motion sensor as defined by claim 1 wherein the mounting member is a cuboid.

4. The motion sensor as defined by claim 1 wherein the mounting member is a flexible circuit.

5. The motion sensor as defined by claim 1 wherein the mounting member has a hollow interior with a set of interior mounting surfaces, the set of interior mounting surfaces having sensor devices mounted thereon.

6. The motion sensor as defined by claim 1 wherein the plurality of sensor devices includes at least one of gyroscopes and accelerometers.

7. The motion sensor as defined by claim 1 wherein at least one of the sensor devices include an unpackaged capped die.

8. The motion sensor as defined by claim 1 wherein the mounting member has a contiguous electrical path extending across three of the plurality of mounting surfaces.

9. A motion sensor as defined by claim 1 wherein the plurality of mounting surfaces includes a first pair of orthogonal surfaces and a second pair of orthogonal surfaces, the first pair having a first conductive path between its two surfaces, the second pair having a second conductive path between its two surfaces.

10. An electronic device comprising:

a unitary mounting member having a plurality of mounting surfaces in different planes; and

a plurality of integrated circuits mounted to two or more of the mounting surfaces.

11. The apparatus as defined by claim 10 wherein the integrated circuits includes at least one of a gyroscope and an accelerometer.

12. The apparatus as defined by claim 10 wherein the plurality of integrated circuits includes at least one integrated circuit that is flip chip bonded to the mounting member.

13. The apparatus as defined by claim 10 wherein the mounting member defines a hollow interior, the plurality of sides including at least one side within the hollow interior.

14. An electrical interconnect apparatus comprising:

a mounting member having a plurality of sides,

the plurality of sides including an interface side,

at least two of the plurality of sides being in electrical communication with the interface side.

15. The electrical interconnect apparatus as defined by claim 14 wherein the mounting member has a contiguous electrical path extending across the surfaces of three of the plurality of sides.

16. The electrical interconnect apparatus as defined by claim 15 wherein the contiguous electrical path extends from the interface side.

17. The electrical interconnect apparatus as defined by claim 14 wherein the plurality of sides includes a first pair of orthogonal sides and a second pair of orthogonal sides, the first pair having a first conductive path between its two sides, the second pair having a second conductive path between its two sides.

18. The electrical interconnect apparatus as defined by claim 14 wherein the mounting member is formed from an insulator as a cuboid.

19. The electrical interconnect apparatus as defined by claim 14 wherein the interface side is capable of connecting with a circuit board.

20. The electrical interconnect apparatus as defined by claim 14 wherein the mounting member is formed from a flexible circuit.

21. The electrical interconnect apparatus as defined by claim 14 further comprising a plurality of sensor devices coupled with at least two of the sides of the mounting member.