Temperature controlled shield ring

• US 20040244949A1
• Filed: 03/26/2004
• Published: 12/09/2004
• Est. Priority Date: 05/30/2003
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Fink, Steven T.
• Application Number:
  US10/809,436
• Publication Number:
  US 20040244949A1
• Time in Patent Office: Days
• US Class Current: 165/80.5
• CPC Class Codes: H01J 37/32724 Temperature
• CPC Class Codes: H01L 21/67109 mainly by convection

Abstract

A method and apparatus for transferring heat from an outer edge of a substrate holder to a temperature-controlled shield ring surrounding the substrate in a plasma reactor. Additionally, heat may be transferred from an edge of the substrate to the shield ring as well.

Claims

1. A temperature-controlled shield ring, comprising:

a shield ring for surrounding a substrate holder; and

coolant passageways within a portion of the shield ring for controlling a temperature of the shield ring by passing a coolant through the coolant passageways.

2. The temperature-controlled shield ring according to claim 1, wherein the shield ring comprises:

a cap; and

a heat conducting element connected between the cap and a location where a substrate would rest during processing, the heat conducting element configured to transfer heat from the substrate to the cap.

3. The temperature-controlled shield ring according to claim 2, wherein the cap comprises a ceramic material.

4. The temperature-controlled shield ring according to claim 2, wherein the cap comprises anodized aluminum.

5. The temperature-controlled shield ring according to claim 1, wherein the coolant comprises a dielectric fluid.

6. The temperature-controlled shield ring according to claim 1, further comprising an insulator housed between the shield ring and the substrate holder.

7. The temperature-controlled shield ring according to claim 1, further comprising an adapter for connecting to a cooling system of the substrate to provide coolant exchange between the shield ring and the substrate holder.

8. The temperature-controlled shield ring according to claim 1, wherein the shield ring is configured to attach to the substrate holder without the use of fasteners.