Heat pipe with temperature control

• US 20040244963A1
• Filed: 06/05/2003
• Published: 12/09/2004
• Est. Priority Date: 06/05/2003
• Status: Abandoned Application

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Hazelton, Andrew J.
• Application Number:
  US10/455,004
• Publication Number:
  US 20040244963A1
• Time in Patent Office: Days
• US Class Current: 165/272
• CPC Class Codes: F28D 15/06 Control arrangements therefor
• CPC Class Codes: G03F 7/70758 Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
• CPC Class Codes: G03F 7/70858 Environment aspects, e.g. pressure of beam-path gas, temperature pollution aspects G03F7/70916

Abstract

Methods and apparatus for controlling the boiling temperature of a fluid within a heat pipe are disclosed. According to one aspect of the present invention, a method for controlling a temperature associated with a heat pipe that contains a fluid and has an evaporator end includes measuring the temperature associated with the heat pipe and determining when the temperature associated with the heat pipe is at a desired level. The method also includes changing a pressure within the heat pipe when it is determined that the temperature associated with the heat pipe is not at a desired level. Changing the pressure within the heat pipe causes the temperature associated with the heat pipe to change.

Claims

1. A method for controlling a temperature associated with a heat pipe, the heat pipe being arranged to contain a fluid, the heat pipe having an evaporator end, the evaporator end being arranged to be in the vicinity of a heat source, the method comprising:

measuring the temperature associated with the heat pipe;

determining when the temperature associated with the heat pipe is at a desired level; and

changing a pressure within the heat pipe when it is determined that the temperature associated with the heat pipe is not at a desired level, wherein changing the pressure within the heat pipe changes a boiling temperature of the fluid and causes the temperature associated with the heat pipe to change.

2. The method of claim 1 wherein changing the pressure within the heat pipe includes increasing the pressure within the heat pipe to cause the temperature associated with the heat pipe to be raised.

3. The method of claim 1 wherein the heat pipe includes a pressure control mechanism, and changing the pressure within the heat pipe includes operating the pressure control mechanism.

4. The method of claim 3 wherein the pressure control mechanism includes a piston assembly, and changing the pressure within the heat pipe includes applying a controlled pressure using the piston assembly.

5. The method of claim 4 wherein the piston assembly is actuated by an electromagnetic actuator, and changing the pressure within the heat pipe includes applying a controlled force to the piston assembly using the electromagnetic actuator.

6. The method of claim 4 wherein the piston assembly is actuated by an air bellows, and changing the pressure within the heat pipe includes applying a controlled force to the piston assembly using the air bellows.

7. The method of claim 1 wherein measuring the temperature associated with the heat pipe includes measuring the temperature at the evaporator end.

8. The method of claim 7 wherein the temperature measured at the evaporator end is a boiling temperature of the fluid.

9. A method for operating an exposure apparatus comprising the method for controlling the temperature of claim 1.

10. A method for making an object including at least a photolithography process, wherein the photolithography process utilizes the method of operating an exposure apparatus of claim 9.

11. A method for making a wafer utilizing the method of operating an exposure apparatus of claim 9.

12. A heat pipe comprising:

an evaporator end;

a fluid; and

a pressure control mechanism, wherein the pressure control mechanism is arranged to change a pressure within the heat pipe such that a boiling temperature of the fluid is changed.

13. The heat pipe of claim 12 wherein the pressure control mechanism is arranged to change the pressure by increasing the pressure such that the boiling temperature of the fluid is increased.

14. The heat pipe of claim 12 wherein the pressure control mechanism includes a piston arrangement, the piston arrangement being arranged to apply a control pressure to change the pressure within the heat pipe.

15. The heat pipe of claim 14 wherein the pressure control mechanism further includes an actuator, the actuator being arranged to apply a control force to the piston arrangement such that the piston arrangement applies the control pressure to change the pressure within the heat pipe.

16. The heat pipe of claim 14 wherein the pressure control mechanism further includes an air bellows, the air bellows being arranged to cause the piston arrangement to apply the control pressure to change the pressure within the heat pipe.

17. The heat pipe of claim 14 further including:

a temperature sensor, the temperature sensor being arranged to measure the boiling temperature of the fluid.

18. The heat pipe of claim 17 wherein the measured boiling temperature is provided to the pressure control mechanism, the pressure control mechanism being arranged to change the pressure by an amount determined using the measured boiling temperature.

19. The heat pipe of claim 17 wherein the temperature sensor is arranged at the evaporator end.

20. The heat pipe of claim 12 further including:

a condenser end, wherein the pressure control mechanism is positioned near the condenser end of the heat pipe.

21. The heat pipe of claim 12 wherein the evaporator end is arranged to be positioned near an external heat source.

22. The heat pipe of claim 21 wherein the external heat source is a coil of a linear motor within a stage apparatus.

23. An exposure apparatus comprising the stage apparatus of claim 22.

24. A device manufactured with the exposure apparatus of claim 23.

25. A wafer on which an image has been formed by the exposure apparatus of claim 23.

26. A method for controlling a temperature of an actuator within a stage apparatus, the stage apparatus being in communication with an evaporator end of a heat pipe, the method comprising:

determining a desired temperature for the actuator; and

adjusting a mechanism within the heat pipe to achieve the desired temperature for the actuator, wherein adjusting the mechanism causes a boiling temperature of a fluid within the heat pipe to be adjusted such that a temperature of the heat pipe is adjusted.

27. The method of claim 26 wherein adjusting the pressure within the heat pipe includes applying a control force of a first amount to a piston arrangement of the heat pipe, wherein the control force of the first amount is arranged to cause the piston arrangement to change the pressure within the heat pipe.

28. The method of claim 27 further including:

determining when the temperature of the actuator is the desired temperature for the actuator, wherein when it is determined that the temperature of the actuator is the desired temperature for the actuator, the control force is maintained at the first amount.

29. The method of claim 28 wherein when it is determined that the temperature of the actuator is not the desired temperature for the actuator, adjusting the pressure within the heat pipe to achieve the desired temperature for the actuator further includes applying a control force of a second amount to the piston arrangement, wherein the control force of the second amount is arranged to cause the piston arrangement to change the pressure within the heat pipe, the second amount being different from the first amount.

30. The method of claim 26 further including:

determining a corresponding desired temperature for a section of the heat pipe using the desired temperature for the actuator, wherein adjusting the mechanism to achieve the desired temperature for the heat pipe includes adjusting the mechanism to achieve the corresponding desired temperature for the section of the heat pipe.

31. The method of claim 30 wherein the section is the evaporator end.

32. A method for operating an exposure apparatus comprising the method for controlling the temperature of claim 26.

33. A method for making an object including at least a photolithography process, wherein the photolithography process utilizes the method of operating an exposure apparatus of claim 32.

34. A method for making a wafer utilizing the method of operating an exposure apparatus of claim 32.

35. A method for controlling a temperature of an actuator within a stage apparatus, the stage apparatus being in communication with an evaporator end of a heat pipe, the heat pipe including a piston arrangement, the method comprising:

determining a desired temperature for the actuator; and

adjusting the piston arrangement to achieve the desired temperature for the actuator, wherein adjusting the piston arrangement causes a boiling temperature of a fluid within the heat pipe to be changed such that a temperature of the actuator is changed.

36. The method of claim 35 wherein adjusting the piston arrangement includes adjusting an internal pressure of the heat pipe to change the temperature of the actuator.

37. The method of claim 35 wherein adjusting the piston arrangement includes adjusting an internal volume of the heat pipe to change the temperature of the actuator.

38. The method of claim 35 wherein adjusting the piston arrangement includes applying a control force to the piston arrangement.

39. The method of claim 38 wherein applying the control force to the piston arrangement causes a control pressure to be applied using the piston arrangement, the control pressure being arranged to cause the boiling temperature of the fluid to be changed.

40. The method of claim 35 further including:

determining a corresponding desired temperature for a section of the heat pipe using the desired temperature for the actuator.

41. The method of claim 40 wherein the section is the evaporator end.

42. A method for operating an exposure apparatus comprising the method for controlling the temperature of claim 35.

43. A method for making an object including at least a photolithography process, wherein the photolithography process utilizes the method of operating an exposure apparatus of claim 42.

44. A method for making a wafer utilizing the method of operating an exposure apparatus of claim 42.

45. A cooling device comprising:

a heat pipe having an end portion that is arranged to be in vicinity of a heat source;

a fluid that is contained in the heat pipe; and

a pressure control mechanism connected to the heat pipe, the pressure control mechanism being arranged to change a pressure within the heat pipe such that a boiling temperature of the fluid is changed.

46. The cooling device of claim 45, wherein the heat pipe has an evaporator end and a condenser end, and the evaporator end is located on the end portion.

47. A heat transfer apparatus comprising:

a flow passage;

at least one heat receiving section where heat is transferred from a heat source, the at least one heat receiving section being disposed on the way of the flow passage;

a heat transfer medium filled within said flow passage, the heat transfer medium being circulated within the flow passage; and

a temperature setting device connected to the flow passage, the temperature setting device being arranged to change a state-shift temperature of the heat transfer medium.

48. The heat transfer apparatus of claim 47, wherein the temperature setting device changes a boiling temperature of the heat transfer medium.

49. The heat transfer apparatus of claim 47, wherein the temperature setting device changes a pressure within the flow passage.

50. The heat transfer apparatus of claim 47, wherein the heat source is a part of an actuator within a stage apparatus.

51. An exposure apparatus comprising the stage apparatus of claim 50.

52. A method for controlling a temperature associated with a heat transfer apparatus, the method comprising:

circulating a heat transfer medium within a flow passage, the flow passage including at least one heat receiving section where heat is transferred from a heat source; and

changing a state-shift temperature of the heat transfer medium circulating within the flow passage.

53. The method of claim 52, wherein changing a state-shift temperature includes changing a boiling temperature of the heat transfer medium.

54. The method of claim 52, wherein changing a state-shift temperature includes changing a pressure within the flow passage.

55. A method for operating a stage device comprising the method for controlling the temperature of claim 52.

56. A method for operating an exposure apparatus comprising the method for controlling the temperature of claim 52.

57. A method for making an object including at least a photolithography process, wherein the photolithography process utilizes the method of operating an exposure apparatus of claim 56.

58. A method for making a wafer utilizing the method for operating an exposure apparatus of claim 56.