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Method for supporting a bond pad in a multilevel interconnect structure and support structure formed thereby

  • US 20040245637A1
  • Filed: 06/05/2003
  • Published: 12/09/2004
  • Est. Priority Date: 06/05/2003
  • Status: Active Grant
First Claim
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1. A method for manufacturing a multi-level interconnect structure with structural support for a bond pad, comprising:

  • applying a mandrel material to a substrate;

    forming a damascene pattern in the mandrel material by removing portions of the mandrel material, the damascene pattern including a closed channel surrounding a core of the mandrel material;

    filling the damascene pattern with a conductive material to create a plurality of features having the mandrel material disposed between adjacent features and a support pillar defined by conductive material filling the closed channel and surrounding the core of the mandrel material; and

    removing the mandrel material between adjacent features to leave air-filled voids between adjacent features, the support pillar providing vertical support to an overlying bond pad that is electrically coupled with at least one of the features.

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