Monolithic integrated circuit arrangement

• US 20040246647A1
• Filed: 03/05/2004
• Published: 12/09/2004
• Est. Priority Date: 03/07/2003
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Schindler, Gunther
• Granted Patent: US 7,211,909 B2
• Time in Patent Office: Days
• US Class Current: 361/147
• CPC Class Codes: H02K 35/02 with moving magnets and stationary coil systems

Abstract

A monolithic integrated circuit arrangement containing a substrate, a functional unit formed in and/or on the substrate, and an energy supply unit, which is formed in and/or on the substrate and is coupled to the functional unit and has an inductance and a permanent magnet. The inductance and the permanent magnet are arranged such that, under a vibration on the circuit arrangement, the permanent magnet is moved relative to the inductance such that an electrical induced voltage for supplying the functional unit with electrical energy is induced by the inductance.

Claims

1-20. -20. (Canceled)

21. :

A monolithic integrated circuit arrangement comprising;

a substrate;

a functional unit formed in and/or on the substrate;

an energy supply unit, which is formed in and/or on the substrate and is coupled to the functional unit, includes an inductance and a permanent magnet having one or a plurality of comb or tongue structures,

wherein, under a vibration on the circuit arrangement, the permanent magnet is moved relative to the inductance such that an electrical induced voltage for supplying the functional unit with electrical energy is induced by the inductance.

22. The monolithic integrated circuit arrangement as claimed in claim 21, wherein the substrate is a semiconductor substrate.

23. :

The monolithic integrated circuit arrangement as claimed in claim 21, wherein the functional unit is a sensor.

24. :

The monolithic integrated circuit arrangement as claimed in claim 23, wherein the sensor is one or more of a rotational speed sensor, a temperature sensor, a pressure sensor, a chemical sensor, a gas sensor, a biosensor, a radiation sensor, and a sensor for detecting a vibration frequency.

25. :

The monolithic integrated circuit arrangement as claimed in claim 21, wherein the monolithic integrated circuit arrangement is fitted to a vibration source.

26. :

The monolithic integrated circuit arrangement as claimed in claim 25, wherein the vibration source has a motor.

27. :

The monolithic integrated circuit arrangement as claimed in claim 21, further comprising a communication interface for contactless communication with an external control unit.

28. :

The monolithic integrated circuit arrangement as claimed in claim 21, wherein the energy supply unit has a rectifier device that rectifies an induced voltage of the inductance, for supplying the functional unit with a DC voltage.

29. :

The monolithic integrated circuit arrangement as claimed in claim 21, wherein the energy supply unit has an energy storage unit, in which electrical charge carriers generated by the induced voltage can be buffer-stored.

30. :

The monolithic integrated circuit arrangement as claimed in claim 29, wherein the energy storage unit is formed from a capacitance.

31. :

The monolithic integrated circuit arrangement as claimed in claim 21, wherein the inductance is an electrically conductive meander structure.

32. :

The monolithic integrated circuit arrangement as claimed in claim 21, wherein the inductance is an arrangement of a plurality of electrically conductive meander structures formed in the substrate plane one next to another and/or vertically one above another with respect to the substrate plane.

33. :

The monolithic integrated circuit arrangement as claimed in claim 21, wherein the inductance is an electrically conductive spiral structure.

34. :

The monolithic integrated circuit arrangement as claimed in claim 21, wherein the inductance is an arrangement of a plurality of electrically conductive spiral structures formed in the substrate plane one next another and/or vertically above another with respect to the substrate plane.

35. :

The monolithic integrated circuit arrangement as claimed in claim 21, wherein the permanent magnet is suspended freely above the substrate and is coupled to the substrate by at least one elastic spring element.

36. :

The monolithic integrated circuit arrangement as claimed in claim 21, wherein the permanent magnet'"'"'s magnetization direction extends essentially orthogonally with respect to the surface of the substrate.

37. :

The monolithic integrated circuit arrangement as claimed in claim 35, wherein the at least one elastic spring element and the permanent magnet together are adapted to a predetermined resonant frequency.

38. :

The monolithic integrated circuit arrangement as claimed in claim 35, further comprising a plurality of elastic spring elements, wherein the plurality of elastic spring elements and the permanent magnet together are adapted to a plurality of different predetermined resonant frequencies or at least one predetermined band of resonant frequencies.

39. :

The monolithic integrated circuit arrangement as claimed in claim 21, wherein the permanent magnet is moved relative to the inductance in two mutually orthogonal directions in the substrate plane.

40. :

The monolithic integrated circuit arrangement as claimed in claim 21, further comprising a magnetic field shielding region formed between the substrate and a combination of the permanent magnet and the inductance, wherein the magnetic field shielding region shields a magnetic field of the permanent magnet in the substrate.