Reinforced substrates with face-mount connectors

• US 20040248438A1
• Filed: 06/05/2003
• Published: 12/09/2004
• Est. Priority Date: 06/05/2003
• Status: Abandoned Application

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Wong, Marvin Glenn
• Application Number:
  US10/455,026
• Publication Number:
  US 20040248438A1
• Time in Patent Office: Days
• US Class Current: 439/83
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 43/205 with a panel or printed circuit board
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/09809 Coaxial layout
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/10553 Component over metal, i.e. metal plate in between bottom of component and surface of PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

Devices and methods are disclosed for reinforcing substrates with face-mount connectors. In one embodiment, the device comprises a fragile substrate including a signal trace, a reinforcement plate bonded to the fragile substrate, and a face-mount connector mated with the reinforcement plate and electrically coupled to the signal trace.

Claims

1. :

A device comprising;

a fragile substrate including a signal trace;

a reinforcement plate bonded to the fragile substrate; and

a face-mount connector mated with the reinforcement plate and electrically coupled to the signal trace.

2. :

The device of claim 1, wherein the fragile substrate comprises a ceramic substrate.

3. :

The device of claim 1, further comprising solder to solder the reinforcement plate to the face-mount connector.

4. :

The device of claim 1, further comprising adhesive to adhere the reinforcement plate to the face-mount connector.

5. :

The device of claim 4, wherein the adhesive comprises a conductive adhesive.

6. :

The device of claim 1, wherein the reinforcement plate is grounded to the face-mount connector.

7. :

The device of claim 1, further comprising adhesive to bond the fragile substrate to the reinforcement plate.

8. :

The device of claim 1, further comprising solder to bond the fragile substrate to the reinforcement plate.

9. :

The device of claim 1, further comprising solder to electrically couple the face-mount connector to the signal trace.

10. :

The device of claim 1, further comprising adhesive to electrically couple the face-mount connector to the signal trace.

11. :

The device of claim 1, further comprising ribbon wirebond to create a ribbon wirebonded connection between the face-mount connector and the signal trace.

12. :

The device of claim 1, wherein the fragile substrate further comprises a conductive via to electrically couple the face-mount connector to the signal trace.

13. :

A method for reinforcing a fragile substrate, the method comprising;

bonding a reinforcement plate to the fragile substrate, the fragile substrate including a signal trace; and

mating a face-mount connector to the reinforcement plate; and

mating the face-mount connector to the signal trace.

14. :

The method of claim 13, wherein mating the face-mount connector to the reinforcement plate comprises soldering the reinforcement plate to the face-mount connector.

15. :

The method of claim 13, wherein mating the face-mount connector to the reinforcement plate comprises applying an adhesive to at least one of the reinforcement plate and the face-mount connector, and adhering the reinforcement plate to the face-mount connector.

16. :

The method of claim 15, wherein the adhesive comprises a conductive adhesive.

17. :

The method of claim 13, wherein the substrate comprises a ceramic substrate.

18. :

The method of claim 13, wherein mating the face-mount connector to the signal trace comprises soldering the signal trace to the face-mount connector.

19. :

The method of claim 13, wherein mating the face-mount connector to the signal trace comprises mating the signal trace to the face-mount connector using ribbon wirebond.