CMOS type image sensor module having transparent polymeric encapsulation material
First Claim
1. A CMOS type of image sensor module comprising:
- a substrate, and a circuit pattern integral therewith;
a first semiconductor chip, having a CMOS sensor capable of picking up an optical image, mounted on an upper one of said sides of the substrate and wire-bonded to the circuit pattern;
a second semiconductor chip, capable of processing a digital signal, mounted on a lower one of said sides of the substrate and wire-bonded to the circuit pattern; and
a resin sealing unit comprising transparent polymeric material integrated with said substrate and encapsulating at least one of said first and second semiconductor chips.
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Accused Products
Abstract
A CMOS type of image sensor module for use in a mobile camera or a PC camera includes an image sensoring semiconductor chip encapsulated in a transparent block of polymeric material on a substrate having a circuit to which the ship is connected. The image sensoring semiconductor chip is disposed on an upper surface of the substrate as spaced vertically from a digital signal processing second semiconductor chip mounted on a lower surface of the substrate. The transparent polymeric encapsulation material constitutes a sealing resin unit. The digital signal processing second semiconductor chip may also be encapsulated by the sealing resin unit. The sealing transfer unit can be formed by injection and/or transfer molding. The forming of the sealing resin unit by a single molding process keeps production costs low.
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Citations
36 Claims
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1. A CMOS type of image sensor module comprising:
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a substrate, and a circuit pattern integral therewith;
a first semiconductor chip, having a CMOS sensor capable of picking up an optical image, mounted on an upper one of said sides of the substrate and wire-bonded to the circuit pattern;
a second semiconductor chip, capable of processing a digital signal, mounted on a lower one of said sides of the substrate and wire-bonded to the circuit pattern; and
a resin sealing unit comprising transparent polymeric material integrated with said substrate and encapsulating at least one of said first and second semiconductor chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method of manufacturing a CMOS type of image sensor module, the method comprising:
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providing a substrate having a circuit pattern integral therewith;
mounting a digital signal processing semiconductor chip, capable of processing a digital signal, and a passive electronic device on a lower one of the sides of the substrate;
wire-bonding the digital signal processing semiconductor chip to the circuit pattern at the lower one of the sides of the substrate to electrically connect the digital signal processing semiconductor chip to the circuit pattern;
molding an epoxy molding compound to the lower one of the sides of the substrate over the digital signal processing semiconductor chip;
mounting an image sensoring semiconductor chip, having a CMOS image sensor capable of picking up an optical image, on an upper one of the sides of the substrate, and wire-bonding the image sensoring semiconductor chip to the circuit pattern to electrically connect the image sensoring semiconductor chip to the circuit pattern; and
molding a transparent polymeric material to the upper one of the sides of the substrate over the entirety of the image sensoring semiconductor chip to thereby form a sealing resin unit in which the image sensoring semiconductor chip is encapsulated by the polymeric material. - View Dependent Claims (24, 25, 26, 27, 28, 29)
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30. A method of manufacturing a CMOS type of image sensor module, comprising:
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providing a substrate having a circuit pattern at both sides thereof;
mounting a digital signal processing semiconductor chip, capable of processing a digital signal, and a passive electronic device on a lower one of the sides of the substrate;
wire-bonding the digital signal processing semiconductor chip to the circuit pattern to electrically connect the digital signal processing semiconductor chip to the substrate;
mounting an image sensoring semiconductor chip, having a CMOS image sensor capable of picking up an optical image, on an upper one of the sides of the substrate, and wire-bonding the image sensoring semiconductor chip to the circuit pattern to electrically connect the image sensoring semiconductor chip to the circuit pattern; and
molding a transparent polymeric material to the upper and lower sides of the substrate over the entirety of the image sensoring semiconductor chip and over the digital signal processing semiconductor chip to thereby form a sealing resin unit in which the chips are encapsulated by the polymeric material. - View Dependent Claims (31, 32, 33, 34, 35, 36)
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Specification