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CMOS type image sensor module having transparent polymeric encapsulation material

  • US 20040251509A1
  • Filed: 05/27/2004
  • Published: 12/16/2004
  • Est. Priority Date: 06/11/2003
  • Status: Active Grant
First Claim
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1. A CMOS type of image sensor module comprising:

  • a substrate, and a circuit pattern integral therewith;

    a first semiconductor chip, having a CMOS sensor capable of picking up an optical image, mounted on an upper one of said sides of the substrate and wire-bonded to the circuit pattern;

    a second semiconductor chip, capable of processing a digital signal, mounted on a lower one of said sides of the substrate and wire-bonded to the circuit pattern; and

    a resin sealing unit comprising transparent polymeric material integrated with said substrate and encapsulating at least one of said first and second semiconductor chips.

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