Method, system, and apparatus for high volume assembly of compact discs and volume assembly of compact discs and digital video discs incorporating radio frequency identification tag technology

• US 20040251541A1
• Filed: 06/14/2004
• Published: 12/16/2004
• Est. Priority Date: 06/12/2003
• Status: Active Grant

• Current Assignee: Symbol Technologies, LLC (Zebra Technologies Corporation)
• Original Assignee: Matrics Incorporated (Zebra Technologies Corporation)
• Inventors: Bandy, William R., Arneson, Michael R.
• Granted Patent: US 7,404,199 B2
• Time in Patent Office: Days
• US Class Current: 257/728
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/045 the record carrier being of the non-contact type, e.g. RFID, and being specially adapted for attachment to a disc, e.g. a CD or DVD
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 7/0095 Testing the sensing arrangement, e.g. testing if a magnetic card reader, bar code reader, RFID interrogator or smart card reader functions properly testing of electrical circuits G01R31/28
• CPC Class Codes: G11B 23/0021 discs
• CPC Class Codes: G11B 23/0042 with provision for auxiliary features sensing such features G11B17/00, G11B19/02
• CPC Class Codes: G11B 7/26 Apparatus or processes specially adapted for the manufacture of record carriers
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10S 438/976 : Temporary protective layer
• CPC Class Codes: Y10T 156/1075 : of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1142 : Changing dimension during delaminating [e.g., crushing, expanding, warping, etc.]
• CPC Class Codes: Y10T 156/1179 : with poking during delaminating [e.g., jabbing, etc.]
• CPC Class Codes: Y10T 156/1906 : Delaminating means responsive to feed or shape at delamination
• CPC Class Codes: Y10T 156/1978 : Delaminating bending means
• CPC Class Codes: Y10T 156/1983 : Poking delaminating means
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49798 : Dividing sequentially from leading end, e.g., by cutting or breaking
• CPC Class Codes: Y10T 29/49833 : Punching, piercing or reaming part by surface of second part
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53187 : Multiple station assembly apparatus
• CPC Class Codes: Y10T 29/5327 : Means to fasten by deforming
• CPC Class Codes: Y10T 29/53422 : by deforming

Abstract

Methods, systems, and apparatuses for forming a radio frequency identifiable disc medium storage device are described. A metal layer is deposited onto a disc. At least one metal trace on the disc is connected to the metal layer. An adhesive interposer is attached to the disc around an opening in the center of the disc. The interposer includes an integrated circuit die. Pads of the integrated circuit die are coupled to the at least one pair of metal traces by the interposer. The interposer further includes a matching network. A coating is formed on the disc to encapsulate the metal layer, interposer, and integrated circuit die.

Claims

1. A method for forming a radio frequency identifiable disc medium storage device, comprising:

(a) depositing a metal layer onto a disc that has a centrally located opening, including the step of forming at least one pair of metal traces on the disc connected to the metal layer;

(b) applying an adhesive interposer to the disc around the opening, wherein the interposer mounts an integrated circuit die and includes a patterned matching network, including the step of coupling pads of the integrated circuit die to the at least one pair of metal traces; and

(c) forming a coating on the disc to encapsulate the metal layer, interposer, and integrated circuit die.

2. The method of claim 1, wherein step (a) comprises:

positioning the metal traces of the at least one pair are positioned on opposite sides of the opening.

3. The method of claim 1, wherein said coupling step comprises the step of:

coupling the pads of the integrated circuit die to the at least one pair of metal traces through the matching network formed on the interposer.

4. The method of claim 1, wherein the disc medium storage device is a digital video disc (DVD).

5. The method of claim 1, wherein the disc medium storage device is a compact disc (CD).

6. The method of claim 1, wherein step (a) comprises:

applying a disc hub to the disc; and

forming the metal traces on the disc through feed lines in the disc hub.

7. A radio frequency identifiable disc medium, comprising:

a disc substrate;

a metal layer on the disc substrate including digitally encoded tracks of information;

at least one metal trace on the disc substrate coupled to said metal layer;

an interposer attached to said disc substrate, wherein said interposer includes;

an integrated circuit die;

a patterned matching network; and

an electrical connection that couples said die with said at least one metal trace.

8. A disc hub used during the manufacture of a radio frequency identifiable disc medium, comprising:

a circular body having

a central bore open at first and second ends of said body, and

at least one feed line through said body that is open at said first end of said body;

wherein said first end of said body is configured to couple to a disc substrate;

whereby a metal can be applied to the disc substrate when the body is coupled to a disc substrate to form a metal layer on the disc substrate around the body and at least one metal trace on the disc substrate through the at least one feed line.

9. The disc hub of claim 8, wherein said plurality of perimeter located feed lines includes:

at least one circumferential feed line located along an edge of said disc hub; and

at least one radial feed line between an outer edge of the body and said at least one circumferential feed line.

10. The disc hub of claim 9, further comprising:

a collar ring around said circular body.

11. An interposer for providing radio frequency identification capability to a disc medium, comprising:

a substrate having opposing first and second surfaces

an integrated circuit die mounted to said first surface of said substrate, said die storing an identification number;

a matching network patterned on said substrate and coupled to said die;

a conductive ring along an outer edge of said substrate; and

an electrical connection that couples said die with said conductive ring.

12. The interposer of claim 11, further comprising:

an electrically conductive adhesive material on said conductive ring.

13. The interposer of claim 11, further comprising:

an adhesive material on said substrate.