Land grid array assembly using a compressive load

• US 20040252462A1
• Filed: 06/11/2003
• Published: 12/16/2004
• Est. Priority Date: 06/11/2003
• Status: Active Grant

• Current Assignee: Valtrus Innovations Limited (f/k/a Dolya Holdco 9 Limited) (Key Patent Innovations Limited)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Cromwell, Stephen D., Augustin, Thomas J.
• Granted Patent: US 6,930,884 B2
• Time in Patent Office: Days
• US Class Current: 361/719
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/12 Resilient or clamping means for holding component to structure

Abstract

Disclosed is land grid array (LGA) assembly using a compressive load. An LGA assembly includes a first component located on the top of the LGA assembly; a center load screw coupled to the first component; and a second component, wherein the center load screw is received on the second component upon turning the center load screw in a first direction. Further turning of the center load screw in the first direction after the center load screw is received on the second component, operates the first component to apply a compressive load within the LGA assembly.

Claims

1. A land grid array (LGA) assembly using a compressive load comprising:

a first component located on the top of the LGA assembly;

a center load screw coupled to the first component; and

a second component, wherein the center load screw is received on the second component upon turning the center load screw in a first direction, wherein further turning of the center load screw in the first direction after the center load screw is received on the second component operates the first component to apply a compressive load on one or more of a plurality of components of the LGA assembly.

2. The LGA assembly of claim 1, further comprising:

a circuit board;

a receiving apparatus, wherein the receiving apparatus positions a modular processor apparatus for connection of a processor to the circuit board;

a modular processor apparatus comprising a processor;

a heat sink, wherein the heat sink is located on top of and in contact with the modular processor apparatus, wherein the heat sink is the second component;

a load plate assembly, wherein the load plate assembly is located on top of the heat sink, wherein the load plate assembly is the first component; and

a plurality of load studs, wherein the load studs attach the load plate assembly, the heat sink, the modular processor apparatus and the receiving apparatus to the circuit board.

3. The LGA assembly of claim 2, wherein the center load screw is inserted through a threaded center hole in the load plate assembly.

4. The LGA assembly of claim 2, wherein the receiving apparatus comprises:

an insulator, and

a bolster plate assembly that attaches to the circuit board, wherein the insulator is located between the bolster plate assembly and the circuit board.

5. The LGA assembly of claim 2, wherein the modular processor apparatus further comprises:

a LGA socket, wherein the LGA socket enables electrical connection between the circuit board and the processor, wherein the processor is located on a top surface of the LGA socket, and

a frame assembly that attaches to the circuit board, wherein the processor and LGA socket are located in the frame assembly, wherein the frame assembly and the LGA socket lie on a top surface of the circuit board.

6. The LGA assembly of claim 5 further comprising one or more gaskets, wherein the gasket and frame assembly attenuate electromagnetic interference generated by the processor.

7. The LGA assembly of claim 2 further comprising a thermal interface material located on a top face of the processor, wherein the thermal interface material enhances thermal conduction from the processor to the heat sink.

8. The LGA assembly of claim 2, wherein the load plate assembly comprises a plurality of compression plates, wherein the compression plates are convex in shape.

9. The LGA assembly of claim 2, wherein the load plate assembly comprises a plurality of holes, wherein each hole comprises a wide opening and a narrow slot.

10. The LGA assembly of claim 2, wherein the heat sink comprises a seat, wherein the center load screw is received on the seat.

11. The LGA assembly of claim 1, wherein a predetermined number of turns of the center load screw results in a desired compressive load.

12. The LGA assembly of claim 1, wherein the center load screw comprises a spherically shaped tip.

13. A method for land grid array (LGA) assembly using a compressive load, comprising the steps of:

setting a first component on the top of the LGA assembly;

coupling a center load screw to the first component;

setting a second component, wherein the center load screw is received on the second component upon turning the center load screw in a first direction; and

turning the center load screw in the first direction, wherein the center load screw is received on the second component and the first component is operated to apply a compressive load on one or more of a plurality of components of the LGA assembly.

14. The method of claim 13, further comprising:

setting a receiving apparatus on a bottom surface of a circuit board, wherein the receiving apparatus positions a modular processor apparatus for connection of a processor to the circuit board;

setting a modular processor apparatus on a top surface of the circuit board over the receiving apparatus, wherein the modular processor apparatus comprises a processor;

inserting a plurality of load studs through the modular processor apparatus and the circuit board and into the receiving apparatus;

setting a heat sink over the load studs, wherein the load studs are inserted through a plurality of holes in the heat sink, wherein the heat sink is in contact with the modular processor apparatus, wherein the heat sink is the second component; and

setting a load plate assembly on top of the heat sink, wherein the load plate assembly is shuttled onto the load studs through a plurality of holes in the load plate assembly, wherein the load plate assembly is the first component.

15. The method of claim 14, wherein the center load screw is inserted through a threaded center hole in the load plate assembly.

16. The method of claim 14, wherein the receiving apparatus comprises:

an insulator, and

a bolster plate assembly that attaches to the circuit board, wherein the insulator is located between the bolster plate assembly and the circuit board, wherein the bolster plate assembly comprises a plurality of sockets.

17. The method of claim 14, wherein the modular processor apparatus further comprises:

a land grid array (LGA) socket, wherein the LGA socket enables electrical connection between the circuit board and the processor, wherein the processor is located on a top surface of the LGA socket, and

a frame assembly that attaches to the circuit board, wherein the processor and LGA socket are located in the frame assembly, wherein the frame assembly and the LGA socket lie on a top surface of the circuit board, wherein the frame assembly and the circuit board comprise a plurality of holes.

18. The method of claim 14, wherein the load plate assembly comprises a plurality of compression plates, wherein the compression plates are convex in shape.

19. The method of claim 14, wherein the heat sink comprises a seat, wherein the center load screw is received on the seat.

20. The method of claim 13, wherein the center load screw comprises a spherically shaped tip.

21. The method of claim 13, wherein a predetermined number of turns of the center load screw results in a desired compressive load.