Multi-computer system

• US 20040252467A1
• Filed: 06/11/2003
• Published: 12/16/2004
• Est. Priority Date: 06/11/2003
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Barsun, Stephan K., Somervill, Kevin M., Dobbs, Robert W.
• Granted Patent: US 7,136,283 B2
• Time in Patent Office: Days
• US Class Current: 361/752
• CPC Class Codes: G06F 1/16 Constructional details or arrangements
• CPC Class Codes: G06F 1/18 Packaging or power distribution
• CPC Class Codes: H05K 7/20736 within cabinets for removing heat from server blades

Abstract

A multi-computer system includes a chassis and a plurality of computers within the chassis operable independent of one another. Each computer has a plurality of subassemblies. The subassemblies of different computers are physically grouped together within the chassis based upon at least one of size, function or configuration.

Claims

1. A multi-computer system comprising:

a chassis;

a first computer within the chassis having a first function subassembly configured to perform at least one function of the computer; and

a second computer within the chassis and operable independent of the first computer, the second computer including a second function subassembly configured to perform the same at least one function for the second computer that the first function subassembly performs, wherein the first function subassembly and the second function subassembly are grouped together within the chassis.

2. The system of claim 1, wherein the first function subassembly and the second function subassembly are identical to one other.

3. The system of claim 1, wherein the first function subassembly and the second function subassembly extend adjacent one another within the chassis.

4. The system of claim 1, wherein the at least one function is providing a plurality of input/output cards.

5. The system of claim 1, wherein the at least one function is providing at least one processor.

6. The system of claim 5, wherein the at least one function is providing a plurality of memory cards.

7. The system of claim 1, wherein the at least one function is providing a plurality of memory cards.

8. The system of claim 1, wherein the at least one function is providing power.

9. The system of claim 1, wherein the first function subassembly and the second function subassembly each include:

an I/O backplane; and

a plurality of I/O cards extending parallel to one another and connected to the I/O backplane.

10. The system of claim 9, wherein the I/O backplane of the first subassembly and the I/O backplane of the second subassembly extend in a single plane within the chassis.

11. The system of claim 10, wherein the I/O backplane of the first subassembly extends in a vertical plane within the chassis.

12. The system of claim 9, wherein the I/O backplane of the first subassembly extends in a vertical plane within the chassis.

13. The system of claim 9, wherein each of the plurality of I/O cards has a major length and a minor width, wherein each card includes a connection bulkhead extending along the width and wherein each I/O card is connected to the I/O backplane along the length.

14. The system of claim 9, wherein each I/O card of the plurality of I/O cards has a connection bulkhead facing upwardly.

15. The system of claim 14, wherein each I/O card is a standard PCI/PCI-X card.

16. The system of claim 14, wherein the chassis is stepped to form a shoulder and wherein each connection bulkhead extends along the shoulder.

17. The system of claim 9, wherein the I/O backplane of the first function subassembly and the I/O backplane of the second function subassembly each have a major dimension and a minor dimension, wherein the major dimension extends vertically within the chassis.

18. The system of claim 17, wherein the first computer includes a third function subassembly and wherein the second computer includes a fourth function subassembly, wherein the third function subassembly and the fourth function subassembly perform at least one substantially identical function for the first computer and the second computer, respectively.

19. The system of claim 18, wherein the third function subassembly and the fourth function subassembly are substantially identical.

20. The system of claim 19, wherein the third function subassembly and the fourth function subassembly are grouped together within the chassis.

21. The system of claim 20, wherein the third function subassembly and the fourth function subassembly extend adjacent to one another within the chassis.

22. The system of claim 18, wherein the first computer includes a fifth function subassembly and wherein the second computer includes a sixth function subassembly and wherein the fifth and sixth function subassemblies perform substantially the same functions for the first computer and the second computer, respectively.

23. The system of claim 22, wherein the fifth function subassembly and the sixth function subassembly are grouped together within the chassis.

24. The system of claim 23, wherein the fifth function subassembly and the sixth function subassembly are substantially identical to one another.

25. The system of claim 22, wherein the fifth function subassembly and the sixth function subassembly each comprise power supplies.

26. The system of claim 20, wherein the third function subassembly and the fourth function subassembly each include:

a processor-memory (PM) backplane;

a plurality of memory cards coupled to the PM backplane; and

a plurality of processors coupled to the PM backplane.

27. The system of claim 26 including a memory circuit board connected to the PM backplane, wherein the plurality of memory cards are connected to the memory circuit board.

28. The system of claim 27 including a processor circuit board connected to the PM backplane, wherein the plurality of processors are connected to the processor circuit board.

29. The system of claim 26, wherein the PM backplane of the third function subassembly and the PM backplane of the fourth function subassembly extend in a single plane.

30. The system of claim 29, wherein the PM backplane of the third function subassembly extends in a horizontal plane.

31. The system of claim 26, wherein the PM backplane of the third function subassembly extends in a horizontal plane.

32. The system of claim 30, wherein the I/O backplane of the first function subassembly and the PM backplane of the third function subassembly are separated by a space.

33. The system of claim 32, wherein the system includes a fan within the chassis configured to blow air through the first function subassembly, from the first function subassembly through the space to the second function subassembly and through the second function subassembly.

34. The system of claim 32 including a cable connecting the I/O backplane of the first function subassembly to the PM backplane of the first function subassembly.

35. The system of claim 30 including a cable connecting the I/O backplane of the first function subassembly to the PM backplane of the second function subassembly.

36. The system of claim 22, wherein the fifth and sixth function subassembly each include a disk drive and wherein the third function subassembly and the fourth function subassembly each include:

a processor memory (PM) backplane;

a plurality of memory cards coupled to the PM backplane; and

a plurality of processors coupled to the PM backplane.

37. The system of claim 1, wherein the first function subassembly and the second function subassembly each include:

a processor-memory (PM) backplane;

a plurality of memory cards coupled to the PM backplane; and

a plurality of processors coupled to the PM backplane.

38. The system of claim 37 including a processor circuit board connected to the PM backplane, wherein the plurality of processors are connected to the processor circuit board.

39. The system of claim 38 including a memory circuit board connected to the PM backplane, wherein the plurality of memory cards are connected to the memory circuit board.

40. The system of claim 37, wherein the PM backplane of the first function subassembly and the PM backplane of the second function subassembly extend in a single plane.

41. The system of claim 40, wherein the PM backplane of the first function subassembly extends in a horizontal plane.

42. The system of claim 37, wherein the PM backplane of the first function subassembly extends in a horizontal plane.

43. The system of claim 1 including a third computer within the chassis and operable independent of the first computer and the second computer, wherein the third computer has a third function subassembly that performs the same functions as the first function subassembly and the second function subassembly and wherein the third function subassembly is grouped with the first function subassembly and the second function subassembly within the chassis.

44. The system of claim 43, wherein the third function subassembly is identical to the first function subassembly and identical to the second function subassembly.

45. The system of claim 43, wherein the first function subassembly, the second function subassembly and the third function subassembly each include:

an input-output (I/O) backplane; and

a plurality of I/O cards connected to the I/O backplane.

46. The system of claim 45, wherein the I/O backplane of the first function subassembly, the second function subassembly and third function subassembly each extend in a single plane within the chassis.

47. The system of claim 46, wherein the I/O backplane of the first function subassembly, the second function subassembly and the third function subassembly each extend in a vertical plane within the chassis.

48. The system of claim 46, wherein the I/O backplane of the first function subassembly, the second function subassembly and the third function subassembly each have a major dimension and a minor dimension and wherein the major dimension extends vertically within the chassis.

49. The system of claim 45, wherein the first, second and third computers include a fourth, fifth and sixth function subassembly, respectively, and wherein the fourth function subassembly, the fifth function subassembly and the sixth function subassembly are grouped together within the chassis.

50. The system of claim 49, wherein the fourth, fifth and sixth function subassemblies each include:

a processor-memory (PM) backplane;

a plurality of memory cards coupled to the PM backplane; and

a plurality of processors coupled to the PM backplane.

51. The system of claim 50, wherein the PM backplane of the fourth, fifth and sixth function subassemblies extend in a single plane.

52. The system of claim 50, wherein the PM backplane of the fourth, fifth and sixth function subassemblies each extend in a horizontal plane.

53. The system of claim 50, wherein the PM backplane of the fourth, fifth and sixth function subassemblies and the I/O backplane of the first, second and third function subassemblies are separated by a space.

54. The system of claim 53 including at least one fan configured to blow air through the first function subassembly, the second function subassembly and the third function subassembly, from the first function subassembly, the second function subassembly and the third function subassembly through the space to the fourth function subassembly, the fifth function subassembly and the sixth function subassembly and through the fourth function subassembly, the fifth function subassembly and the sixth function subassembly.

55. The system of claim 52 including cabling connecting the I/O backplane of the first function subassembly, the second function subassembly and the third function subassembly to the PM backplane of the fourth function subassembly, the fifth function subassembly and the sixth function subassembly, respectively.

56. The system of claim 45, wherein the first, second and third computers include a fourth, a fifth and a sixth function subassembly, respectively, and wherein the fourth, fifth and sixth function subassemblies each include:

a processor-memory (PM) backplane;

a memory circuit board connected, to the PM backplane;

a plurality of memory cards connected to the memory circuit board;

a processor circuit board connected to the PM backplane; and

a plurality of processors connected to the processor circuit board;

wherein the first, second and third computers include a seventh, eighth and ninth function subassembly, respectively, each of the seventh, eighth and ninth function subassemblies including a fan system, wherein the fourth, fifth and sixth function subassemblies are horizontally between the first, second and third function subassemblies and the seventh, eighth and ninth function subassemblies.

57. The system of claim 56, wherein the chassis has a maximum depth of 20 inches.

58. The system of claim 56, wherein the third, fourth and fifth function subassemblies are vertically stacked adjacent one another.

59. The system of claim 58 including at least one power supply and at least one disk drive vertically positioned above or below the vertically stacked third, fourth and fifth function subassemblies.

60. The system of claim 59, wherein the chassis has a maximum height of 26 inches.

61. The system of claim 60, wherein the chassis has a maximum depth of 20 inches.

62. The system of claim 61, wherein the chassis has a maximum width of 17.5 inches.

63. A multi-computer system comprising:

a chassis; and

a plurality of computers within the chassis operable independent of one another, each computer having a plurality of subassemblies, wherein the subassemblies of different computers are physically grouped together within the chassis based upon at least one of size, function or configuration.

64. A multi-computer system comprising:

at least three independently operable computers; and

a chassis enclosing the at least three independently operable computers, the chassis having a maximum depth of 20 inches.

65. The system of claim 64, wherein the chassis has a maximum height of 26 inches.

66. The system of claim 65, wherein the chassis has a maximum width of 17.5 inches.

67. A multi-computer system comprising:

a chassis;

a plurality of independently operable computers within the chassis, each computer having a first backplane with a major dimension and a minor dimension, wherein the major dimension extends in one of a vertical direction and a horizontal direction; and

a second backplane having a major dimension and a minor dimension, wherein the major dimension extends in the other of the vertical direction and the horizontal direction.

68. The system of claim 67, wherein the first backplane of each of the plurality of computers extends in a common plane.

69. The system of claim 68, wherein the second backplane of each of the plurality of computers extends in a common plane.

70. The system of claim 67, wherein the second backplane of each of the plurality of computers extends in a common plane.

71. The system of claim 67 including a plurality of input-output (I/O) cards connected to the first backplane, wherein each card of the plurality of I/O cards has a major dimension and a minor dimension and wherein the major dimension extends in said one of the vertical direction and the horizontal direction.

72. The system of claim 67 including a plurality of cables connecting the first backplane of each of the plurality of computers to the second backplane of each of the plurality of computers.