Sputter target

• US 20040253382A1
• Filed: 03/11/2004
• Published: 12/16/2004
• Est. Priority Date: 08/13/2001
• Status: Abandoned Application

• Current Assignee: NV Bekaert SA
• Original Assignee: NV Bekaert SA
• Inventors: De Bosscher, Wilmert, Delrue, Hilde, Vanderstraeten, Johan
• Application Number:
  US10/486,649
• Publication Number:
  US 20040253382A1
• Time in Patent Office: Days
• US Class Current: 427/376.7
• CPC Class Codes: C23C 14/3414 Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
• CPC Class Codes: C23C 2/26 After-treatment C23C2/14 takes precedence
• CPC Class Codes: C23C 26/00 Coating not provided for in groups C23C2/00 - C23C24/00
• CPC Class Codes: C23C 4/18 After-treatment
• CPC Class Codes: Y02T 50/60 Efficient propulsion technologies, e.g. for aircraft

Abstract

The invention relates to a sputter target and more particularly to a zinc sputter target. The target comprises a target holder having an outer surface and a target material formed on said outer surface. The target material has a relative density higher than 92% of the theoretical density of the metal or metal alloy. Furthermore the invention relates to a process for the manufacturing of a sputter target.

Claims

1. A sputter target comprising a target holder having an outer surface and a target material formed on said outer surface, said target material comprising a metal, a metal alloy or a metal oxide;

said target material having a relative density higher than 92% of the theoretical density of the metal or metal alloy.

2. A sputter target according to claim 1, whereby said target material has a relative density higher than 95% of the theoretical density of said metal or metal alloy.

3. A sputter target according to claim 1, whereby said target material has a relative density higher than 98% of the theoretical density of said metal or metal alloy.

4. A sputter target according to claim 1, whereby the grains of said target material have an orientation parallel or substantially parallel to the longitudinal axis of said target holder.

5. A sputter target according to claim 1, whereby the grains of said target material have an orientation perpendicular or substantially perpendicular to the longitudinal axis of said target holder.

6. A sputter target according to claim 1 whereby said target material comprises zinc or a zinc alloy.

7. A sputter target according to claim 1, whereby a diffusion layer is present between the target holder and the target material.

8. A sputter target according to claim 1, whereby said target holder is a plate.

9. A sputter target according to claim 1, whereby said target holder is a tube.

10. A sputter target according to claim 9, whereby said target holder is a stainless steel tube.

11. A process of manufacturing a sputter target according to claim 1, said process comprising the steps of

providing a target holder;

applying a target material on said target holders, said target material comprising a metal, a metal alloy or a metal oxide;

applying a top layer on top of said target material;

said top layer comprising a material having a melting point which is higher than the melting point of said target material;

heating the target holder coated with said target material and said top layer.

12. A process according to claim 11, whereby said process comprises the step of

applying a release layer between said target material and said top layer.

13. A process according to claim 11, whereby said process further comprises the step of

removing the top layer.

14. A process according to claim 11, whereby said target material is applied by spraying or dipping.

15. A process according to claim 11, whereby said target material is applied by coiling at least one wire, strip or foil around said target holder or by applying segments on said target holder.

16. A process according to claim 11, whereby said target material comprises sprayed zinc or a sprayed zinc alloy.

17. A process according to claim 11, whereby said material of the top layer comprises a metal, a metal alloy or a metal oxide.

18. A process according to claim 11, whereby said top layer is applied by spraying or dipping.

19. A process according to claim 11, whereby said top layer is a stainless steel layer which is sprayed on top of the target material layer.

20. A process according to claim 12, whereby said release layer comprises a metal oxide.

21. A process according to claim 11, whereby the heating comprises heating to a temperature which is equal or higher than the melting point of the target material.

22. A process according to claim 11, whereby the heating comprises heating to a temperature that allows to obtain a diffusion between two or more components of the target material.

23. A process according to claim 1, whereby the heating comprises induction heating.