Electrode structure and methods for producing and using the same

• US 20040256146A1
• Filed: 06/17/2004
• Published: 12/23/2004
• Est. Priority Date: 06/17/2003
• Status: Abandoned Application

• Current Assignee: Heraeus Precious Metals GmbH & Co. KG (Einhorn Verwaltungsgesellschaft mbH)
• Original Assignee: Heraeus Holding GMBH
• Inventors: Frericks, Matthias, Kruger, Frank
• Application Number:
  US10/870,807
• Publication Number:
  US 20040256146A1
• Time in Patent Office: Days
• US Class Current: 174/254
• CPC Class Codes: A61N 1/0541 Cochlear electrodes
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2203/0143 Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
• CPC Class Codes: H05K 2203/0353 Making conductive layer thin, e.g. by etching
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths

Abstract

A method is provided for producing electrode structures which have a supply line and a contact surface connected thereto, wherein a planar electrode material is roll bonded onto a planar carrier material and the thickness of the electrode material and carrier material is reduced by rolling. The electrode material is then structured with formation of contact surfaces and supply lines in its surface, and predefined parts of the electrode material are removed. Then, electrode material located on the carrier material is coated with a sealing compound or a foil, and the carrier material is then removed. The structure may be used in medical implants for neuro stimulation and/or muscular stimulation, for example in a cochlear implant, a retina implant, or a cortical electrode.

Claims

1. A method for producing electrode structures which have a supply line and a contact surface connected to the supply line, comprising roll bonding a planar electrode material onto a planar carrier material, reducing a thickness of the electrode material and the carrier material by rolling, then structuring the electrode material with formation of contact surfaces and supply lines in a surface of the planar electrode material, removing predefined parts of the electrode material, then coating the electrode material located on the carrier material with a sealing compound or a foil, and then removing the carrier material.

2. The method according to claim 1, wherein the roll bonding and the rolling to reduce the thickness are performed simultaneously.

3. The method according to claim 1, wherein the electrode material comprises a metal selected from the group consisting of Pt, Ir, Au, W, Ta, Nb, and alloys with at least one of these metals.

4. The method according to one of claim 1, wherein the carrier material comprises a material selected from the group consisting of a metal, an alloy, and a plastic.

5. The method according to one of claim 4, wherein the carrier material comprises a metal or an alloy selected from the group consisting of Cu, Fe and their alloys.

6. The method according to one of claim 1, wherein the structuring is performed by a photolithographic process, and the predefined parts of the electrode material are removed by subsequent etching.

7. The method according to claim 6, wherein the photolithographic process uses a photoresistive material in a form of a foil or a liquid.

8. The method according to claim 6, wherein the etching is performed as chemical etching, electrochemical etching, or dry etching.

9. A method for producing electrode structures which have a supply line and a contact surface connected to the supply line, comprising applying a planar electrode material to a planar carrier material, then structuring the electrode material with formation of contact surfaces and supply lines in a surface of the planar electrode material, removing predefined parts of the electrode material by dry etching, then coating the electrode material located on the carrier material with a sealing compound or a foil, and then removing the carrier material.

10. The method according to claim 9, wherein the electrode material forming the supply lines and contact surfaces comorises a material selected from the group consisting of platinum alloys, gold, gold alloys, tantalum, tantalum alloys, niobium, niobium alloys, cobalt-chromium-nickel alloys, stainless steel, and nickel-titanium alloys, wherein the platinum alloy is formed from at least one metal selected from the group consisting of gold, tungsten, and iridium.

11. An electrode structure comprising a plurality of electrodes electrically insulated from each other, each electrode having supply lines and contact surfaces connected thereto, wherein the supply lines and associated contact surfaces are each formed of one piece from a material selected from the group consisting of platinum alloys, gold, gold alloys, tantalum, tantalum alloys, niobium, niobium alloys, cobalt-chromium-nickel alloys, stainless steel, and nickel-titanium alloys.

12. The electrode structure according to claim 11, wherein the platinum alloy is formed from at least one metal selected from the group consisting of gold, tungsten, and iridium.

13. The electrode structure according to claim 11, wherein the niobium alloy is formed with zirconium.

14. The electrode structure according to claim 11, wherein the supply lines are held at least partially in a common electrically non-conductive matrix.

15. The electrode structure according to claim 14, wherein the matrix comprises a flexible material.

16. The electrode structure according to claim 11, wherein the electrodes are formed with a planar shape.

17. The electrode structure according to claim 11, wherein the electrodes have a thickness of greater than 3 μ

m up to approximately 15 μ

m.

18. The electrode structure according to claim 11, wherein the electrodes have a thickness of approximately 0.1 μ

m up to 3 μ

m.

19. The electrode structure according to claim 11, wherein the supply lines have a width of greater than 20 μ

m up to approximately 60 μ

m.

20. The electrode structure according to claim 11, wherein the supply lines have a width of approximately 2 μ

m up to 20 μ

m.

21. The electrode structure according to claim 11, wherein the width of the contact surfaces is greater than or equal to the width of the supply lines.

22. The electrode structure according to claim 11, wherein the structure is at least part of a medical implant.

23. The electrode structure according to claim 22, wherein the structure is adapted for neurostimulation and/or for muscle stimulation.

24. The electrode structure according to claim 22, wherein the structure is at least part of a cochlear implant, a retina implant, or a cortical electrode.