Electrode structure and methods for producing and using the same
First Claim
1. A method for producing electrode structures which have a supply line and a contact surface connected to the supply line, comprising roll bonding a planar electrode material onto a planar carrier material, reducing a thickness of the electrode material and the carrier material by rolling, then structuring the electrode material with formation of contact surfaces and supply lines in a surface of the planar electrode material, removing predefined parts of the electrode material, then coating the electrode material located on the carrier material with a sealing compound or a foil, and then removing the carrier material.
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Accused Products
Abstract
A method is provided for producing electrode structures which have a supply line and a contact surface connected thereto, wherein a planar electrode material is roll bonded onto a planar carrier material and the thickness of the electrode material and carrier material is reduced by rolling. The electrode material is then structured with formation of contact surfaces and supply lines in its surface, and predefined parts of the electrode material are removed. Then, electrode material located on the carrier material is coated with a sealing compound or a foil, and the carrier material is then removed. The structure may be used in medical implants for neuro stimulation and/or muscular stimulation, for example in a cochlear implant, a retina implant, or a cortical electrode.
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Citations
24 Claims
- 1. A method for producing electrode structures which have a supply line and a contact surface connected to the supply line, comprising roll bonding a planar electrode material onto a planar carrier material, reducing a thickness of the electrode material and the carrier material by rolling, then structuring the electrode material with formation of contact surfaces and supply lines in a surface of the planar electrode material, removing predefined parts of the electrode material, then coating the electrode material located on the carrier material with a sealing compound or a foil, and then removing the carrier material.
- 9. A method for producing electrode structures which have a supply line and a contact surface connected to the supply line, comprising applying a planar electrode material to a planar carrier material, then structuring the electrode material with formation of contact surfaces and supply lines in a surface of the planar electrode material, removing predefined parts of the electrode material by dry etching, then coating the electrode material located on the carrier material with a sealing compound or a foil, and then removing the carrier material.
- 11. An electrode structure comprising a plurality of electrodes electrically insulated from each other, each electrode having supply lines and contact surfaces connected thereto, wherein the supply lines and associated contact surfaces are each formed of one piece from a material selected from the group consisting of platinum alloys, gold, gold alloys, tantalum, tantalum alloys, niobium, niobium alloys, cobalt-chromium-nickel alloys, stainless steel, and nickel-titanium alloys.
Specification