Film carrier tape for mounting electronic devices thereon and final defect marking method using the same

• US 20040256701A1
• Filed: 01/28/2004
• Published: 12/23/2004
• Est. Priority Date: 01/28/2003
• Status: Active Grant

• Current Assignee: Mitsui Mining and Smelting Company Limited
• Original Assignee: Mitsui Mining and Smelting Company Limited
• Inventors: Kiriyama, Tatsuya
• Granted Patent: US 6,953,989 B2
• Time in Patent Office: Days
• US Class Current: 257/668
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15173 in a single layer of the multilayer substrate
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/005 Punching of holes
• CPC Class Codes: H05K 3/225 Correcting or repairing of printed circuits H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence

Abstract

A film carrier tape for mounting electronic devices thereon having a mounting unit in which a wiring pattern is formed by etching on a base material, wherein the mounting unit has a target mark to be a reference of an alignment for carrying.out final defect marking in a target position on the mounting unit by marking means as a pattern formed on the base material by the etching, and a defect marking method using the same are provided.,

Claims

1. A film carrier tape for mounting electronic devices thereon having a mounting unit in which a wiring pattern is formed by etching on a base material, wherein the mounting unit has a target mark to be a reference of an alignment for carrying out final defect marking in a target position on the mounting unit by marking means as a pattern formed on the base material by the etching.

2. The film carrier tape for mounting electronic devices thereon according to claim 1, wherein the target mark is not electrically connected to the wiring pattern.

3. The film carrier tape for mounting electronic devices thereon according to claim 1, wherein the target mark is formed to be clearly indicated by a wiring shape of the wiring pattern.

4. The film carrier tape for mounting electronic devices thereon according to any of claims 1 to 3claim 1, wherein the target mark takes an almost identical shape to a marking shape of the marking means.

5. The film carrier tape for mounting electronic devices thereon according to claim 1, wherein the target mark is formed in an optional position A₂ on a base material which is placed apart from a target position Al for execution of final defect marking and is not provided with a wiring pattern, and an optional position A₂′

on a base material which is not provided with the wiring pattern over a line which is perpendicular to a line connecting the positions A₁ and A₂ and passes through the position Al or a position A₂”

which is not provided with the wiring pattern on a projection of the position A₂ with respect to the position Al.

6. The film carrier tape for mounting electronic devices thereon according to claims 1, wherein the mounting unit does not have a device hole.

11. The film carrier tape for mounting electronic devices thereon according to claim 2, wherein the target mark takes an almost identical shape to a marking shape of the marking means.

12. The film carrier tape for mounting electronic devices thereon according to claim 3, wherein the target mark takes an almost identical shape to a marking shape of the marking means.

13. The film carrier tape for mounting electronic devices thereon according to claim 2, wherein the mounting unit does not have a device hole.

14. The film carrier tape for mounting electronic devices thereon according to claim 3, wherein the mounting unit does not have a device hole.

15. The film carrier tape for mounting electronic devices thereon according to claim 4, wherein the mounting unit does not have a device hole.

16. The film carrier tape for mounting electronic devices thereon according to claim 5, wherein the mounting unit does not have a device hole.

7. A film carrier tape for mounting electronic devices thereon which has a plurality of mounting units provided with a wiring pattern by etching on a base material and is subjected to a final defect marking step, wherein the mounting units decided to be normal at a quality inspecting step have target marks formed in predetermined positions on the units as a pattern formed by the etching so as to be a reference of an alignment for carrying out final defect marking in target positions on the units by marking means if the units are decided to be defective at the quality inspecting step, and the mounting units decided to be defective at the quality inspecting step have final defect marking carried out in predetermined positions based on the target marks.

8. The film carrier tape for mounting electronic devices thereon according to claim 7, wherein the mounting unit does not have a device hole.

9. A final defect marking method of a film carrier tape for mounting electronic devices thereon having a mounting unit provided with a wiring pattern by etching on a base material which serves to carry out final marking on the mounting unit decided to be defective at a quality inspecting step, wherein defect marking is carried out in a marking position determined by aligning marking means with the mounting unit based on a position of a target mark formed as a pattern on the base material by the etching.

10. The final defect marking method of a film carrier tape for mounting electronic devices thereon according to claim 9, wherein the mounting unit does not have a device hole.