Heat pipe circuit board

• US 20040257750A1
• Filed: 07/16/2004
• Published: 12/23/2004
• Est. Priority Date: 05/10/2002
• Status: Abandoned Application

• Current Assignee: Keiji Mashimo, Yukihiro Saita
• Original Assignee: Keiji Mashimo, Yukihiro Saita
• Inventors: Mashimo, Keiji, Saita, Yukihiro
• Application Number:
  US10/893,737
• Publication Number:
  US 20040257750A1
• Time in Patent Office: Days
• US Class Current: 361/600
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28F 2275/20 with threaded elements
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps

Abstract

A heat pipe circuit board comprising: a heat pipe; at least one insulating layer; a circuit pattern provided on a surface of or inside the at least one insulating layer; and electronic components being mounted on the heat pipe through the insulating layer. The heat pipe is formed by jointing two plate members by friction stir welding, at least one of the two plate members being provided with a recess portion which is a fluid channel of a working fluid.

Claims

1-9. -9. (Canceled)

10. A heat pipe circuit board comprising:

a heat pipe, said heat pipe being formed by jointing two plate members by friction stir welding, at least one of said two plate members being provided with a recess portion which is a fluid channel of a working fluid;

at least one insulating layer;

a circuit pattern provided on a surface of or inside said at least one insulating layer; and

electronic components being mounted on said heat pipe through said insulating layer.

11. The heat pipe circuit board as claimed in claim 10, wherein said at least one insulating layer takes the shape of a sheet or a plate.

12. The heat pipe circuit board as claimed in claim 10, wherein said at least one insulating layer is formed by a coating.

13. The heat pipe circuit board as claimed in claim 10, wherein said at least one insulating layer is strong enough to support said electronic components by itself.

14. The heat pipe circuit board as claimed in claim 10, wherein said electronic components are mounted on said two plate members via said at least one insulating member.

15. The heat pipe circuit board as claimed in claim 10, wherein said electronic components are mounted on either of said two plate members via said at least one insulating member.

16. A heat pipe circuit board manufacturing method wherein two plate members are prepared, at least one of the plate members being provided with a recess portion which is a fluid channel of a working fluid, electronic components being mounted on at least one of the plate members via an insulating layer, and then, the plate members being jointed by friction stir welding.