DRAM cell arrangement with vertical MOS transistors, and method for its fabrication
First Claim
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1. A method for fabricating a DRAM cell arrangement with vertical MOS transistors, comprising:
- forming a source/drain material on a substrate;
etching trenches to form a plurality of parallel ribs having strips of the source/drain material disposed thereon, wherein the strips provide sites for a plurality of upper source/drain regions of the vertical MOS transistors;
depositing a covering layer on a floor of the trenches;
depositing a gate dielectric layer on the surfaces of the ribs;
filling the trenches, whereby gate electrodes for the vertical MOS transistors are produced on either side of the ribs;
forming a plurality of word lines over, and cross-wise with respect to, the ribs;
depositing a first auxiliary layer, capable of wafer bonding, on the plurality of word lines;
attaching a first auxiliary carrier substrate to the first auxiliary layer;
removing at least the substrate;
forming a plurality of lower source/drain regions on the ribs, wherein portions of the ribs disposed between the plurality of lower source/drain regions and the plurality of upper source/drain regions define channel regions for the vertical MOS transistors; and
forming shallow isolation trenches to isolate the plurality of lower source/drain regions.
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Abstract
DRAM cell arrangement with vertical MOS transistors, and method for its fabrication. Channel regions arranged along one of the columns of a memory cell matrix are parts of a rib which is surrounded by a gate dielectric layer. Gate electrodes of the MOS transistors belonging to one row are parts of a strip-like word line, so that at each crossing point of the memory cell matrix there is a vertical dual-gate MOS transistor with gate electrodes of the associated word line formed in the trenches on both sides of the associated rib.
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Citations
24 Claims
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1. A method for fabricating a DRAM cell arrangement with vertical MOS transistors, comprising:
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forming a source/drain material on a substrate;
etching trenches to form a plurality of parallel ribs having strips of the source/drain material disposed thereon, wherein the strips provide sites for a plurality of upper source/drain regions of the vertical MOS transistors;
depositing a covering layer on a floor of the trenches;
depositing a gate dielectric layer on the surfaces of the ribs;
filling the trenches, whereby gate electrodes for the vertical MOS transistors are produced on either side of the ribs;
forming a plurality of word lines over, and cross-wise with respect to, the ribs;
depositing a first auxiliary layer, capable of wafer bonding, on the plurality of word lines;
attaching a first auxiliary carrier substrate to the first auxiliary layer;
removing at least the substrate;
forming a plurality of lower source/drain regions on the ribs, wherein portions of the ribs disposed between the plurality of lower source/drain regions and the plurality of upper source/drain regions define channel regions for the vertical MOS transistors; and
forming shallow isolation trenches to isolate the plurality of lower source/drain regions. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A DRAM cell arrangement with vertical MOS transistors, comprising:
a matrix of memory cells defined by a plurality of spaced-apart parallel word lines and a plurality of spaced-apart parallel ribs disposed in a cross-wise direction with respect to the word lines, wherein a memory cell is defined at each cross point defined by an intersection of a word line and a rib, wherein each memory cell comprises a vertical dual-gate MOS transistor each comprising;
an upper source/drain region, a lower source/drain region and a channel region disposed between the source/drain regions;
wherein the channel region is formed in one of the ribs; and
a pair of gate electrodes formed on opposite sides of the channel region. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A DRAM cell arrangement with vertical MOS transistors, comprising:
a matrix of memory cells defined by the collective intersections of a plurality of spaced-apart parallel word lines and a plurality of spaced-apart parallel ribs disposed in a cross-wise direction with respect to the word lines, the ribs being covered with a gate dielectric material to form gate electrodes on each side of a respective rib and wherein the ribs are separated by trenches filled with conductive material in contact with the word lines, wherein each memory cell comprises a capacitor and a vertical dual-gate MOS transistor in stacked relation to one another and electrically connected, each vertical dual-gate MOS transistor comprising;
an upper source/drain region, a lower source/drain region and a channel region disposed between the source/drain regions;
wherein the upper and lower source/drain regions are formed as strips of doped material traversing the lengths of their respective rib, and wherein the channel region is formed in one of the ribs and is grounded to at least reduce floating body effects.- View Dependent Claims (19, 20, 21, 22, 23, 24)
Specification