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Method and composition for the chemical-vibrational-mechanical planarization of copper

  • US 20040259366A1
  • Filed: 10/02/2003
  • Published: 12/23/2004
  • Est. Priority Date: 06/20/2003
  • Status: Abandoned Application
First Claim
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1. A method for the removal of an excess copper-containing material from a substrate comprising a copper layer, the process comprising:

  • providing the substrate comprising the copper layer and the excess copper-containing material disposed thereupon;

    introducing the substrate into a vessel containing a chemical mechanical polishing mixture comprising a solution and a plurality of particles wherein the solution comprises an etchant, a modifier, and a surfactant and wherein an average particle diameter of the particles ranges from 100 to 3000 μ

    m; and

    agitating the vessel with the substrate contained therein to remove the excess copper-containing material from the substrate.

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