Processing method and processing system

• US 20040260420A1
• Filed: 06/18/2004
• Published: 12/23/2004
• Est. Priority Date: 06/20/2003
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Ohno, Tsuyoshi, Moriya, Machi, Saita, Yoshitaka, Kikuchi, Toshihiko
• Application Number:
  US10/869,913
• Publication Number:
  US 20040260420A1
• Time in Patent Office: Days
• US Class Current: 700/121
• CPC Class Codes: G01N 21/211 Ellipsometry optical thickness measurement G01B11/06

Abstract

The present invention is a processing method including a processing step of performing predetermined processing for a workpiece; an unnecessary portion removal step of removing an unnecessary portion produced on a surface of the workpiece due to the predetermined processing; and a surface structure evaluation step of evaluating a surface structure of the workpiece from which the unnecessary portion has been removed by the unnecessary portion removal step.

Claims

1. A method for processing a workpiece, comprising:

a processing step of performing predetermined processing for the workpiece;

an unnecessary portion removal step of removing an unnecessary portion produced on a surface of the workpiece due to the predetermined processing; and

a surface structure evaluation step of evaluating a surface structure of the workpiece from which the unnecessary portion has been removed by said unnecessary portion removal step.

2. The processing method as set forth in claim 1, further comprising:

a control step of controlling at least one of parameters of a processing condition of the predetermined processing based on the surface structure of the workpiece evaluated by said surface structure evaluation step.

3. The processing method as set forth in claim 1, wherein

the predetermined processing is an etching processing of etching the workpiece using a resist as a mask to form a predetermined pattern in the surface of the workpiece.

4. The processing method as set forth in claim 3, wherein

said unnecessary portion removal step is a step of removing a deteriorated layer and/or a hard layer formed in the resist in the etching processing.

5. The processing method as set forth in claim 3, wherein

said unnecessary portion removal step is a step of removing a damaged layer formed within a surface region of the predetermined pattern in the etching processing.

6. The processing method as set forth in claim 3, wherein

said unnecessary portion removal step is a step of removing a polymer attached to the surface of the workpiece in the etching processing.

7. The processing method as set forth in claim 3, wherein

said unnecessary portion removal step is a step of removing a resist having a cross-sectional shape changed by the etching processing.

8. The processing method as set forth in claim 1, wherein

said surface structure evaluation step is a step of measuring by Scatterometry a predetermined physical quantity of the workpiece from which the unnecessary portion has been removed by said unnecessary portion removal step and estimating the surface structure of the workpiece from the measured predetermined physical quantity.

9. A method for processing a workpiece, comprising:

a processing step of performing predetermined processing for the workpiece;

an unnecessary portion removal step of removing an unnecessary portion produced on a surface of the workpiece due to the predetermined processing; and

a surface structure evaluation step of evaluating a first surface structure of the workpiece from which the unnecessary portion has been removed by said unnecessary portion removal step,

wherein subsequent to said processing step of performing predetermined processing, said first surface structure evaluation step is performed, and if the evaluation in said first surface structure evaluation step is a failure, said unnecessary portion removal step is performed, and a second surface structure evaluation step is performed for the workpiece from which the unnecessary portion has been removed.

10. The processing method as set forth in claim 9, further comprising:

a data switching step of switching from data used in said first surface structure evaluation step to data based on a shape after the unnecessary portion removal in said second surface structure evaluation step.

11. A system for processing a workpiece, comprising:

a processing apparatus for performing predetermined processing for the workpiece;

an unnecessary portion removal apparatus for removing an unnecessary portion produced on a surface of the workpiece for which the predetermined processing has been performed;

a surface structure evaluation apparatus for evaluating a surface structure of the workpiece from which the unnecessary portion has been removed by said unnecessary portion removal apparatus;

a carrier apparatus for carrying the workpiece into/out of each of said apparatuses; and

a control apparatus for controlling said processing apparatus, said unnecessary portion removal apparatus, said surface structure evaluation apparatus, and said carrier apparatus.

12. The processing system as set forth in claim 11, wherein

said processing apparatus for performing the predetermined processing is a plasma etching apparatus.

13. The processing system as set forth in claim 11, wherein

said unnecessary portion removal apparatus for removing an unnecessary portion is a wet processing apparatus.

14. The processing system as set forth in claim 11, wherein

said surface structure evaluation apparatus for evaluating a surface structure of the workpiece performs evaluation by Scatterometry.

15. The processing system as set forth in claim 11, wherein

said control apparatus controls at least one of parameters of a processing condition of the predetermined processing based on the surface structure of the workpiece evaluated by said surface structure evaluation apparatus.

16. The processing system as set forth in claim 11, wherein

said control apparatus monitors an evaluation operation in said surface structure evaluation apparatus and conducts a control such that if said control apparatus determines that the evaluation operation is a failure, said control apparatus carries a workpiece under processing at the time of the determination of the failure into said unnecessary portion removal apparatus for removal of the unnecessary portion and carries the workpiece again into said surface structure evaluation apparatus for evaluation of the surface structure.

17. The processing system as set forth in claim 16, wherein

said control apparatus determines that the evaluation operation is a failure if the evaluation in said surface structure evaluation apparatus has failed to derive an optimum solution within a predetermined period.

18. The processing system as set forth in claim 16, wherein

said control apparatus determines that the evaluation operation is a failure if the evaluation in said surface structure evaluation apparatus has failed to derive an optimum solution from a library.

19. The processing system as set forth in claim 16, wherein

when said control apparatus makes the determination of the failure, said control apparatus stops processing or operation in each of said apparatuses for workpieces other than said workpiece.

20. A system for processing a workpiece, comprising:

a processing apparatus for performing predetermined processing for the workpiece and removing an unnecessary portion produced on a surface of the workpiece due to the predetermined processing;

a surface structure evaluation apparatus for evaluating a surface structure of the workpiece from which the unnecessary portion has been removed by said processing apparatus;

a carrier apparatus for carrying the workpiece into/out of each of said apparatuses; and

a control apparatus for controlling said processing apparatus, said surface structure evaluation apparatus, and said carrier apparatus.

21. The processing system as set forth in claim 20, wherein

said processing apparatus for performing the predetermined processing is a plasma etching apparatus.

22. The processing system as set forth in claim 20, wherein

said unnecessary portion removal apparatus for removing an unnecessary portion is a wet processing apparatus.

23. The processing system as set forth in claim 20, wherein

said surface structure evaluation apparatus for evaluating a surface structure of the workpiece performs evaluation by Scatterometry.

24. The processing system as set forth in claim 20, wherein

said control apparatus controls at least one of parameters of a processing condition of the predetermined processing based on the surface structure of the workpiece evaluated by said surface structure evaluation apparatus.

25. The processing system as set forth in claim 20, wherein

said control apparatus monitors an evaluation operation in said surface structure evaluation apparatus and conducts a control such that if said control apparatus determines that the evaluation operation is a failure, said control apparatus carries a workpiece under processing at the time of the determination of the failure into said unnecessary portion removal apparatus for removal of the unnecessary portion and carries the workpiece again into said surface structure evaluation apparatus for evaluation of the surface structure.

26. The processing system as set forth in claim 25, wherein

said control apparatus determines that the evaluation operation is a failure if the evaluation in said surface structure evaluation apparatus has failed to derive an optimum solution within a predetermined period.

27. The processing system as set forth in claim 25, wherein

said control apparatus determines that the evaluation operation is a failure if the evaluation in said surface structure evaluation apparatus has failed to derive an optimum solution from a library.

28. The processing system as set forth in claim 25, wherein

when said control apparatus makes the determination of the failure, said control apparatus stops processing or operation in each of said apparatuses for workpieces other than said workpiece.

29. A method for processing a workpiece, comprising:

an etching step of performing an etching processing for the workpiece;

a surface structure measurement step of measuring using Scatterometry a dimension of a surface structure of the workpiece processed in said etching step; and

a step of comparing the dimension of the surface structure measured in said surface structure measurement step to a previously set permissible value and deciding continuation or suspension of the etching processing based on the comparison result.

30. The processing method as set forth in claim 29, wherein

said surface structure measurement step measures dimensions at least in two dimensional directions of the surface structure of the workpiece.

31. The processing method as set forth in claim 30, wherein

said surface structure measurement step measures dimensions in a depth direction and a horizontal direction of the surface structure of the workpiece.

32. The processing method as set forth in claim 29, wherein

said etching step and said surface structure measurement step are performed using a test workpiece having a structure simpler than that of a workpiece to be a product.

33. A system for processing a workpiece, comprising:

an etching processing apparatus for performing an etching processing for the workpiece;

a surface structure measurement apparatus for measuring using Scatterometry a dimension of a surface structure of the workpiece for which the etching processing has been performed; and

a control apparatus for comparing the measured dimension of the surface structure to a previously set permissible value and deciding continuation or suspension of the etching processing in said etching processing apparatus based on the comparison result.

34. The processing system as set forth in claim 33, wherein

said surface structure measurement apparatus measures dimensions at least in two dimensional directions of the surface structure of the workpiece.

35. The processing system as set forth in claim 34, wherein

said surface structure measurement apparatus measures dimensions in a depth direction and a horizontal direction of the surface structure of the workpiece.

36. The processing system as set forth in claim 33, wherein

said surface structure measurement apparatus measures the dimension of the surface structure using a test workpiece having a structure simpler than that of a workpiece to be a product.

37. A method for processing a workpiece, comprising:

a surface structure measurement step of measuring using Scatterometry a dimension of a surface structure of the workpiece before an etching processing;

a processing condition setting step of setting a processing condition at the time of an etching processing based on the measurement result of the dimension of the surface structure so that the surface structure of the workpiece after the etching processing has a desired dimension; and

thereafter, an etching step of performing an etching processing for the workpiece under the set processing condition.

38. The processing method as set forth in claim 37, wherein:

correlation data between the processing condition at the time of the etching processing and an elimination amount of the surface structure of the workpiece by the etching processing is obtained in advance; and

said processing condition setting step sets the processing condition based on the measurement result of the dimension of the surface structure and the correlation data.

39. The processing method as set forth in claim 37, wherein

said processing condition setting step sets the processing condition so that dimensions at least in two dimensional directions of the surface structure after the etching processing are desired dimensions.

40. The processing method as set forth in claim 37, wherein

said processing condition setting step sets a plurality of processing conditions at the time of the etching processing.

41. The processing method as set forth in claim 40, wherein

said processing condition setting step sets:

an etching processing time based on the measurement result of the dimension of the surface structure so that a dimension in a depth direction in the surface structure after the etching processing is a desired dimension; and

a supply flow rate of an etching gas based on the set etching processing time so that a dimension in a horizontal direction in the surface structure after the etching processing is a desired dimension.

42. A system for processing a workpiece, comprising:

an etching processing apparatus for performing an etching processing for the workpiece;

a surface structure measurement apparatus for measuring using Scatterometry a dimension of a surface structure of the workpiece before the etching processing; and

a control apparatus for setting a processing condition at the time of the etching processing based on the measurement result of the dimension of the surface structure so that the surface structure of the workpiece after the etching processing has a desired dimension.

43. The processing system as set forth in claim 42, wherein

said control apparatus stores correlation data between the processing condition at the time of the etching processing and an elimination amount of the surface structure of the workpiece by the etching processing;

and

said control apparatus sets the processing condition based on the measurement result of the dimension of the surface structure and the correlation data.

44. The processing system as set forth in claim 42, wherein

said control apparatus sets the processing condition so that dimensions at least in two dimensional directions of the surface structure after the etching processing are desired dimensions.

45. The processing system as set forth in claim 42, wherein

said control apparatus sets a plurality of processing conditions at the time of the etching processing.

46. The processing system as set forth in claim 45, wherein

said control apparatus sets:

an etching processing time based on the measurement result of the dimension of the surface structure so that a dimension in a depth direction in the surface structure after the etching processing is a desired dimension; and

a supply flow rate of an etching gas based on the set etching processing time so that a dimension in a horizontal direction in the surface structure after the etching processing is a desired dimension.