Industrial microdeposition system for polymer light emitting diode displays , printed circuit boards and the like

• US 20040261700A1
• Filed: 08/18/2004
• Published: 12/30/2004
• Est. Priority Date: 06/01/2001
• Status: Active Grant

• Current Assignee: Ulvac Incorporated
• Original Assignee: Litrex Corporation (Ulvac Incorporated)
• Inventors: Albertalli, David, Edwards, Charles O., Bielich, Howard Walter, Bruner, Scott R., Middleton, James
• Granted Patent: US 7,270,712 B2
• Time in Patent Office: Days
• US Class Current: 118/679
• CPC Class Codes: B25B 11/005 Vacuum work holders
• CPC Class Codes: B29C 64/112 using individual droplets, e.g. from jetting heads
• CPC Class Codes: B29C 64/188 involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control surface shaping B29C59/00; after-treatment of articles without altering their shape B29C71/00
• CPC Class Codes: B41J 2/04 generating single droplets or particles on demand
• CPC Class Codes: B41J 2/04505 aiming at correcting alignment
• CPC Class Codes: B41J 2/04506 aiming at correcting manufacturing tolerances
• CPC Class Codes: B41J 2/0451 for detecting failure, e.g. clogging, malfunctioning actuator
• CPC Class Codes: B41J 2/04558 detecting presence or properties of a dot on paper
• CPC Class Codes: B41J 2/0456 detecting drop size, volume or weight
• CPC Class Codes: B41J 2/04573 Timing; Delays
• CPC Class Codes: B41J 2/04575 controlling heads of acoustic type
• CPC Class Codes: B41J 2/04581 controlling heads based on piezoelectric elements
• CPC Class Codes: B41J 2/04588 using a specific waveform
• CPC Class Codes: B41J 2/0459 Height of the driving signal being adjusted
• CPC Class Codes: B41J 2/04591 Width of the driving signal being adjusted
• CPC Class Codes: B41J 2/04593 Dot-size modulation by changing the size of the drop
• CPC Class Codes: B41J 2/04596 Non-ejecting pulses
• CPC Class Codes: B41J 2202/04 Heads using conductive ink
• CPC Class Codes: B41J 2202/09 Ink jet technology used for manufacturing optical filters
• CPC Class Codes: B41J 3/407 for marking on special material
• CPC Class Codes: B41J 3/543 : with multiple inkjet print heads B41J2/17503, B41J2/2103 take precedence
• CPC Class Codes: H01L 21/67103 : mainly by conduction
• CPC Class Codes: H01L 21/6715 : Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence
• CPC Class Codes: H01L 21/67248 : Temperature monitoring
• CPC Class Codes: H01L 21/6838 : with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H05K 1/0269 : for visual or optical inspection
• CPC Class Codes: H05K 2201/09918 : Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 3/0008 : for aligning or positioning of tools relative to the circuit board H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015
• CPC Class Codes: H05K 3/125 : by ink-jet printing

Abstract

A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller (22) includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head (50) and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.

Claims

1. A microdeposition system for depositing precise amounts of fluid material onto a substrate, comprising:

a microdeposition head that includes a plurality of spaced nozzles;

a positioning device that controls a position of said microdeposition head relative to said substrate; and

a controller including a positioning module that communicates with said positioning device and that generates position control signals for said positioning device, and a nozzle firing module that communicates with said microdeposition head and that selectively generates nozzle firing commands that fire said nozzles to form droplets that define features of an electrical device.

2. The microdeposition system of claim 1 wherein said electrical device is one of a polymer light emitting diode, a light panel, and a printed circuit board.

3. The microdeposition system of claim 1 wherein when said fluid material dries on said substrate, said dried fluid material forms at least one of a light emitter, an electrical conductor, an electrical trace, an insulator, a capacitor and a resistor.

4. The microdeposition system of claim 1 further comprising a head assembly that is connected to said head, wherein said head positioning module adjusts a pitch of said head by rotating said head assembly.

5. The microdeposition system of claim 4 wherein said controller generates an over-clocking signal that increases feature resolution.

6. The microdeposition system of claim 5 wherein said nozzle firing module adjusts timing of said nozzle firing commands using said over-clocking signal to compensate for changes to said pitch.

7. The microdeposition system of claim 1 further comprising:

a first camera that generates digital images of said droplets; and

a droplet analysis module that uses optical character recognition to analyze at least one of shape, size, position and speed of said droplet and that adjusts at least one nozzle firing parameter.

8. The microdeposition system of claim 7 wherein said nozzle firing parameters include at least one of timing, amplitude, duration, rise slope and fall slope.

9. The microdeposition system of claim 4 wherein said positioning device includes:

a rotating motor adjusts a pitch of said head assembly; and

a rotational sensor that communicates with said controller and that generates a rotation position signal based said pitch of said microdeposition head.

10. The microdeposition system of claim 9 wherein said positioning device further includes:

a first lateral motor that moves said microdeposition head assembly along a first axis; and

a first position sensor that communicates with said controller and that generates a first position signal based on a position of said microdeposition head on said first axis.

11. The microdeposition system of claim 10 wherein said positioning device further includes:

a second lateral motor that moves said substrate along a second axis that is generally perpendicular to said first axis; and

a second position sensor that communicates with said controller and that generates a second position signal based on a position of said substrate on a second axis.

12. The microdeposition system of claim 1 further comprising a substrate positioning device that selectively engages said substrate during microdeposition.

13. The microdeposition system of claim 12 wherein said substrate positioning device engages said substrate using a vacuum.

14. The microdeposition system of claim 13 further comprising a temperature controller that controllably adjusts a temperature of said substrate.

15. The microdeposition system of claim 1 further comprising an ultraviolet source that directs ultraviolet light onto said substrate to cure deposited fluid material.

16. The microdeposition system of claim 4 wherein said head assembly includes a second microdeposition head with a second plurality of nozzles.

17. The microdeposition system of claim 1 wherein said nozzles of said microdeposition head form a row and are spaced uniformly.

18. The microdeposition system of claim 1 wherein said nozzles of said microdeposition head include:

a diaphragm;

a piezo transducer that modulates said diaphragm;

rigid walls;

a nozzle plate including a nozzle opening; and

a fluid channel formed between said rigid walls, said diaphragm, and said nozzle plate, wherein when said nozzle firing commands are received, an acoustic wave is generated that fires said droplets from said nozzle opening.

19. The microdeposition system of claim 1 wherein said microdeposition head is selected from the group consisting of thermal microdeposition heads, bubble microdeposition heads, continuous drop microdeposition heads, piezo tranducer valves, and microelectromechanical valves.

20. The microdeposition system of claim 4 further comprising:

a second microdeposition head located on said head assembly;

a first actuator for adjusting a position of said microdeposition head; and

a second actuator for adjusting a position of said second microdeposition head.

21. The microdeposition system of claim 1 further comprising a waveform generator that allows adjustment of at least one nozzle firing waveform for each of said nozzles.

22. The microdeposition system of claim 1 wherein said waveform generator includes a selector that selects one of a plurality of nozzle firing waveforms for each of said nozzles based on operating conditions of said nozzle.

23. The microdeposition system of claim 4 further comprising a laser that is mounted on one of said head assembly and a laser head assembly and that is used to increase feature resolution.

24. A method of microdepositing precise amounts of fluid material onto a substrate, comprising:

providing a microdeposition head that includes a plurality of spaced nozzles;

controlling a position of said microdeposition head relative to said substrate; and

generating nozzle firing commands to fire said nozzles to form droplets that define features of an electrical device.

25. The method of claim 24 wherein said electrical device is one of a polymer light emitting diode, a light panel, and a printed circuit board.

26. The method of claim 24 wherein when said fluid material dries on said substrate, said dried fluid material forms at least one of a light emitter, an electrical conductor, an electrical trace, an insulator, a capacitor and a resistor.

27. The method of claim 24 further comprising:

mounting said head on a head assembly; and

adjusting pitch by rotating said head assembly.

28. The method of claim 27 further comprising generating an over-clocking signal to improve feature resolution.

29. The method of claim 28 further comprising adjusting timing of said nozzle firing commands using said over-clocking signal to compensate for changes to said pitch.

30. The method of claim 24 further comprising:

generating digital images of said droplets;

using optical character recognition to analyze at least one of shape, size, position and speed of said droplet; and

adjusting at least one nozzle firing parameter based on a droplet analysis.

31. The method of claim 30 wherein said nozzle firing parameters include at least one of timing, amplitude, duration, rise slope and fall slope.

32. The method of claim 27 further comprising:

rotating said head assembly; and

generating a rotation position signal based on a rotational position of said microdeposition head.

33. The method of claim 32 further comprising:

moving said microdeposition head assembly along a first axis; and

generating a first position signal based on a position of said microdeposition head on said first axis.

34. The method of claim 33 further comprising:

moving said substrate along a second axis that is generally perpendicular to said first axis; and

generating a second position signal based on a position of said substrate on a second axis.

35. The method of claim 24 further comprising engaging said substrate during microdeposition.

36. The method of claim 35 wherein said engaging step employs vacuum.

37. The method of claim 36 further comprising adjusting a temperature of said substrate.

38. The method of claim 24 further comprising directing ultraviolet light onto said substrate to cure deposited fluid material.

39. The method of claim 27 further comprising providing a second microdeposition head with a second plurality of nozzles on said head assembly.

40. The method of claim 24 wherein said nozzles of said microdeposition head form a row and are spaced uniformly.

41. The method of claim 24 wherein said microdeposition head is selected from the group consisting of thermal microdeposition heads, bubble microdeposition heads, continuous drop microdeposition heads, piezo tranducer valves, and microelectromechanical valves.

42. The method of claim 27 further comprising:

providing a second microdeposition head located on said head assembly;

providing a first actuator for adjusting a position of said microdeposition head; and

providing a second actuator for adjusting a position of said second microdeposition head.

43. The method of claim 24 further comprising allowing adjustment of at least one nozzle firing waveform for each of said nozzles.

44. The method of claim 24 further comprising selecting one of a plurality of nozzle firing waveforms for each of said nozzles based on operating conditions of said nozzle.

45. The method of claim 27 further comprising using a laser to increase feature resolution.

46. A microdeposition system for depositing precise amounts of fluid material onto a substrate, comprising:

a microdeposition head that includes a plurality of spaced nozzles;

a positioning device that controls a position of said microdeposition head relative to said substrate; and

a controller including a positioning module that communicates with said positioning device and that generates position control signals for said positioning device, a nozzle firing module that communicates with said microdeposition head and that selectively generates nozzle firing commands, and a waveform generator that is capable of adjusting nozzle firing waveforms for each of said nozzles that fire said nozzles to form droplets that define features on said substrate.

47. The microdeposition system of claim 46 wherein a device that is produced by said microdeposition system is one of a polymer light emitting diode, a light panel, and a printed circuit board.

48. The microdeposition system of claim 46 wherein said droplets form at least one of a light emitter, an electrical conductor, an electrical trace, an insulator, a capacitor and a resistor.

49. A microdeposition system for depositing precise amounts of fluid material onto a substrate, comprising:

a microdeposition head that includes a plurality of spaced nozzles;

a positioning device that controls a position and a pitch of said microdeposition head relative to said substrate; and

a controller including a positioning module that communicates with said positioning device and that generates position control signals for said positioning device, and a nozzle firing module that communicates with said microdeposition head and that selectively generates nozzle firing commands that fire said nozzles to form droplets that define features on said substrate.

50. The microdeposition system of claim 49 further comprising a waveform generator that is capable of adjusting nozzle firing waveforms for each of said nozzles.

51. The microdeposition system of claim 49 wherein a device that is produced by said microdeposition system is one of a polymer light emitting diode, a light panel, and a printed circuit board.

52. The microdeposition system of claim 49 wherein said droplets material dries on said substrate, said dried fluid material forms at least one of a light emitter, an electrical conductor, an electrical trace, an insulator, a capacitor and a resistor.

53. A microdeposition system for depositing precise amounts of fluid material onto a substrate, comprising:

a microdeposition head that includes a plurality of spaced nozzles;

a positioning device that controls a position of said microdeposition head relative to said substrate; and

a controller including a positioning module that communicates with said positioning device and that generates position control signals for said positioning device, and a nozzle firing module that communicates with said microdeposition head and that selectively generates nozzle firing commands that fire said nozzles to form droplets that define features on said substrate, wherein said controller generates an over-clocking signal that improves feature resolution.

54. The microdeposition system of claim 53 wherein said nozzle firing module adjusts a timing of said nozzle firing commands using said over-clocking signal to compensate for changes to said pitch.

55. The microdeposition system of claim 53 further comprising a waveform generator that is capable of adjusting nozzle firing waveforms for each of said nozzles.

56. The microdeposition system of claim 53 wherein a device that is produced by said microdeposition system is one of a polymer light emitting diode, a light panel, and a printed circuit board.

57. The microdeposition system of claim 53 wherein said droplets form at least one of a light emitter, an electrical conductor, an electrical trace, an insulator, a capacitor and a resistor.

58. A microdeposition system for depositing precise amounts of fluid material onto a substrate, comprising:

a microdeposition head that includes a plurality of spaced nozzles;

a positioning device that controls a position of said microdeposition head relative to said substrate;

a controller including a positioning module that communicates with said positioning device and that generates position control signals for said positioning device, and a nozzle firing module that communicates with said microdeposition head and that selectively generates nozzle firing commands that fire said nozzles to form droplets that define features on said substrate;

a first camera that generates digital images of said droplets; and

a droplet analysis module that uses optical character recognition to analyze at least one of shape, size, position and speed of said droplet and that adjusts at least one nozzle firing parameter based on a droplet analysis.

60. The microdeposition system of claim 59 wherein said nozzle firing parameters include at least one of timing, amplitude, duration, rise slope and fall slope.

61. The microdeposition system of claim 59 wherein a device that is produced by said microdeposition is one of a polymer light emitting diode, a light panel, and a printed circuit board.

62. The microdeposition system of claim 59 wherein said droplets form at least one of a light emitter, an electrical conductor, an electrical trace, an insulator, a capacitor and a resistor.