Industrial microdeposition system for polymer light emitting diode displays , printed circuit boards and the like
First Claim
1. A microdeposition system for depositing precise amounts of fluid material onto a substrate, comprising:
- a microdeposition head that includes a plurality of spaced nozzles;
a positioning device that controls a position of said microdeposition head relative to said substrate; and
a controller including a positioning module that communicates with said positioning device and that generates position control signals for said positioning device, and a nozzle firing module that communicates with said microdeposition head and that selectively generates nozzle firing commands that fire said nozzles to form droplets that define features of an electrical device.
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Accused Products
Abstract
A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller (22) includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head (50) and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.
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Citations
62 Claims
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1. A microdeposition system for depositing precise amounts of fluid material onto a substrate, comprising:
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a microdeposition head that includes a plurality of spaced nozzles;
a positioning device that controls a position of said microdeposition head relative to said substrate; and
a controller including a positioning module that communicates with said positioning device and that generates position control signals for said positioning device, and a nozzle firing module that communicates with said microdeposition head and that selectively generates nozzle firing commands that fire said nozzles to form droplets that define features of an electrical device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of microdepositing precise amounts of fluid material onto a substrate, comprising:
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providing a microdeposition head that includes a plurality of spaced nozzles;
controlling a position of said microdeposition head relative to said substrate; and
generating nozzle firing commands to fire said nozzles to form droplets that define features of an electrical device. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A microdeposition system for depositing precise amounts of fluid material onto a substrate, comprising:
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a microdeposition head that includes a plurality of spaced nozzles;
a positioning device that controls a position of said microdeposition head relative to said substrate; and
a controller including a positioning module that communicates with said positioning device and that generates position control signals for said positioning device, a nozzle firing module that communicates with said microdeposition head and that selectively generates nozzle firing commands, and a waveform generator that is capable of adjusting nozzle firing waveforms for each of said nozzles that fire said nozzles to form droplets that define features on said substrate. - View Dependent Claims (47, 48)
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49. A microdeposition system for depositing precise amounts of fluid material onto a substrate, comprising:
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a microdeposition head that includes a plurality of spaced nozzles;
a positioning device that controls a position and a pitch of said microdeposition head relative to said substrate; and
a controller including a positioning module that communicates with said positioning device and that generates position control signals for said positioning device, and a nozzle firing module that communicates with said microdeposition head and that selectively generates nozzle firing commands that fire said nozzles to form droplets that define features on said substrate. - View Dependent Claims (50, 51, 52)
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53. A microdeposition system for depositing precise amounts of fluid material onto a substrate, comprising:
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a microdeposition head that includes a plurality of spaced nozzles;
a positioning device that controls a position of said microdeposition head relative to said substrate; and
a controller including a positioning module that communicates with said positioning device and that generates position control signals for said positioning device, and a nozzle firing module that communicates with said microdeposition head and that selectively generates nozzle firing commands that fire said nozzles to form droplets that define features on said substrate, wherein said controller generates an over-clocking signal that improves feature resolution. - View Dependent Claims (54, 55, 56, 57)
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58. A microdeposition system for depositing precise amounts of fluid material onto a substrate, comprising:
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a microdeposition head that includes a plurality of spaced nozzles;
a positioning device that controls a position of said microdeposition head relative to said substrate;
a controller including a positioning module that communicates with said positioning device and that generates position control signals for said positioning device, and a nozzle firing module that communicates with said microdeposition head and that selectively generates nozzle firing commands that fire said nozzles to form droplets that define features on said substrate;
a first camera that generates digital images of said droplets; and
a droplet analysis module that uses optical character recognition to analyze at least one of shape, size, position and speed of said droplet and that adjusts at least one nozzle firing parameter based on a droplet analysis.
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60. The microdeposition system of claim 59 wherein said nozzle firing parameters include at least one of timing, amplitude, duration, rise slope and fall slope.
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61. The microdeposition system of claim 59 wherein a device that is produced by said microdeposition is one of a polymer light emitting diode, a light panel, and a printed circuit board.
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62. The microdeposition system of claim 59 wherein said droplets form at least one of a light emitter, an electrical conductor, an electrical trace, an insulator, a capacitor and a resistor.
Specification