Apparatus and method for controlled application of reactive vapors to produce thin films and coatings
First Claim
1. An apparatus for vapor deposition of coatings having a thickness ranging from about 5 Å
- to about 1,000 Å
, where at least one precursor used for formation of said coating exhibits a vapor pressure below about 150 Torr at a temperature of 25°
C., the apparatus comprising;
at least one precursor container in which said at least one precursor, in the form of a liquid or a solid, is placed;
at least one precursor vapor reservoir for holding vapor of said at least one precursor;
at least one device which controls precursor vapor flow from said precursor container into said precursor vapor reservoir;
a pressure sensor in communication with said precursor vapor reservoir;
a process controller which receives data from said pressure sensor, compares said data with a desired nominal vapor reservoir pressure, and sends a signal to a device which controls vapor flow from said precursor container into said precursor vapor reservoir, to prevent further vapor flow into said precursor vapor reservoir when said desired nominal pressure is reached;
a device which controls precursor vapor flow into said precursor vapor reservoir upon receipt of a signal from said first process controller;
a process chamber for vapor deposition of said coating on a substrate present in said process chamber; and
a device which controls precursor vapor flow into said process chamber upon receipt of a signal from said process controller.
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Abstract
A vapor phase deposition method and apparatus for the application of thin layers and coatings on substrates. The method and apparatus are useful in the fabrication of electronic devices, micro-electromechanical systems (MEMS), Bio-MEMS devices, micro and nano imprinting lithography, and microfluidic devices. The apparatus used to carry out the method provides for the addition of a precise amount of each of the reactants to be consumed in a single reaction step of the coating formation process. The apparatus provides for precise addition of quantities of different combinations of reactants during a single step or when there are a number of different individual steps in the coating formation process. The precise addition of each of the reactants in vapor form is metered into a predetermined set volume at a specified temperature to a specified pressure, to provide a highly accurate amount of reactant.
89 Citations
25 Claims
-
1. An apparatus for vapor deposition of coatings having a thickness ranging from about 5 Å
- to about 1,000 Å
, where at least one precursor used for formation of said coating exhibits a vapor pressure below about 150 Torr at a temperature of 25°
C., the apparatus comprising;
at least one precursor container in which said at least one precursor, in the form of a liquid or a solid, is placed;
at least one precursor vapor reservoir for holding vapor of said at least one precursor;
at least one device which controls precursor vapor flow from said precursor container into said precursor vapor reservoir;
a pressure sensor in communication with said precursor vapor reservoir;
a process controller which receives data from said pressure sensor, compares said data with a desired nominal vapor reservoir pressure, and sends a signal to a device which controls vapor flow from said precursor container into said precursor vapor reservoir, to prevent further vapor flow into said precursor vapor reservoir when said desired nominal pressure is reached;
a device which controls precursor vapor flow into said precursor vapor reservoir upon receipt of a signal from said first process controller;
a process chamber for vapor deposition of said coating on a substrate present in said process chamber; and
a device which controls precursor vapor flow into said process chamber upon receipt of a signal from said process controller. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
- to about 1,000 Å
-
11. A method for vapor-phase deposition of coatings, where at least one precursor used for formation of said coating exhibits a vapor pressure below about 150 Torr at a temperature of 25°
- C., the method comprising;
a) providing a processing chamber in which said coating is vapor deposited;
b) providing at least one precursor exhibiting a vapor pressure below about 150 Torr at a temperature of 25°
C.;
c) transferring vapor of said precursor to a precursor vapor reservoir in which said precursor vapor accumulates;
d) accumulating a nominal amount of said precursor vapor required for said vapor phase coating deposition; and
e) adding said nominal amount of said precursor vapor to said processing chamber in which said coating is being deposited. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
- C., the method comprising;
Specification