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Substrate support having dynamic temperature control

  • US 20040261721A1
  • Filed: 06/30/2003
  • Published: 12/30/2004
  • Est. Priority Date: 06/30/2003
  • Status: Active Grant
First Claim
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1. A substrate support useful in a reaction chamber of a plasma processing apparatus, the substrate support comprising:

  • a ceramic member;

    a metallic heat transfer member overlying the ceramic member, the heat transfer member having a maximum thickness of about ¼

    inch, the heat transfer member including at least one flow passage through which a liquid can be circulated to heat and/or cool the heat transfer member; and

    an electrostatic chuck overlying the heat transfer member, the electrostatic chuck having a support surface for supporting a substrate in a reaction chamber of a plasma processing apparatus.

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