Method and system for fan fold packaging
First Claim
Patent Images
1. An electronic component assembly, comprising:
- a flexible printed circuit;
a first component electronically coupled with the flexible printed circuit;
a second component electronically coupled with the flexible printed circuit, the flexible printed circuit folded to position the components in generally mutually facing relation; and
, an inter-component thermal management device disposed between the components, in thermal relation with the components, for removing or stabilizing thermal energy from the components during operation.
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Accused Products
Abstract
An electronic component assembly includes a flexible printed circuit, and further includes two components disposed on the flexible printed circuit, having electrical connections with the flexible printed circuit. The flexible layer is folded so that the components face each other and a thermal management device is disposed between the components. The thermal management device may be glued by a thermally conducting adhesive or otherwise held in a stable arrangement, in order to remove the heat generated from the components.
40 Citations
36 Claims
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1. An electronic component assembly, comprising:
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a flexible printed circuit;
a first component electronically coupled with the flexible printed circuit;
a second component electronically coupled with the flexible printed circuit, the flexible printed circuit folded to position the components in generally mutually facing relation; and
,an inter-component thermal management device disposed between the components, in thermal relation with the components, for removing or stabilizing thermal energy from the components during operation. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An electronic component assembly, comprising:
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a flexible printed circuit;
a first modular section formed on the flexible printed circuit, comprising;
a first component electronically coupled with the flexible printed circuit;
a second component electronically coupled with the flexible printed circuit, the flexible printed circuit folded to position the components in generally mutually facing relation; and
,an inter-component thermal management device disposed between the components, in thermal relation with the components, for removing or stabilizing thermal energy from the components during operation;
a second modular section comprising;
a first component electronically coupled with the flexible printed circuit;
a second component electronically coupled with the flexible printed circuit, the flexible printed circuit folded to position the components in generally mutually facing relation; and
,a further inter-component thermal management device disposed between the components, in thermal relation with the components, for removing or stabilizing thermal energy from the components during operation, the flexible printed circuit being folded to form a stack of the modular sections. - View Dependent Claims (9, 10, 11, 12)
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13. An electronic component assembly, comprising:
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a flexible printed circuit;
a plurality of modular sections formed on the flexible printed circuit, each modular section comprising;
a first component electronically coupled with the flexible printed circuit;
a second component electronically coupled with the flexible printed circuit, the flexible printed circuit folded to position the components in generally mutually facing relation; and
,an inter-component thermal management device disposed between the components, in thermal relation with the components, for removing or stabilizing thermal energy from the components during operation, the flexible printed circuit being folded to form a stack of the modular sections. - View Dependent Claims (14, 15, 16)
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- 17. The electronic component assembly of claim i3, the assembly further comprising at least one second thermal management device thermally connected to at least one of the inter-component or the inter-layer thermal management devices.
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19. A method of manufacturing an electronic component assembly comprising:
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disposing a first electronic component on a first side of a flexible printed circuit;
disposing a second electronic component on the first side of the flexible printed circuit;
folding the flexible printed circuit to bring the components into generally mutually facing relation; and
disposing an inter-component thermal management device between the components to remove or stabilize thermal energy from the components during operation. - View Dependent Claims (20, 21, 22, 23, 24, 25)
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26. A method of manufacturing an electronic component assembly comprising:
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disposing a first electronic component of a first modular section on a first side of a flexible printed circuit;
disposing a second electronic component of the first modular section on the first side of the flexible printed circuit;
disposing a first electronic component of a second modular section on the first side of a flexible printed circuit;
disposing a second electronic component of the second modular section on the first side of the flexible printed circuit;
folding the flexible printed circuit to bring the components of the first modular section into generally mutually facing relation and the second modular section into generally mutually facing relation; and
disposing a first inter-component thermal management device between the components of the first modular section and disposing a second inter-component thermal management device between the components of the second modular section to remove or stabilize heat from the components during operation. - View Dependent Claims (27, 28, 29, 30)
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31. A method of manufacturing an electronic component assembly comprising:
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disposing a plurality of first electronic components on a first side of a flexible printed circuit, each of the first electronic components corresponding to a respective modular sections;
disposing a plurality of second electronic components on the first side of the flexible printed circuit, each of the second electronic components corresponding to the respective modular sections, so that each modular section comprises first and second electronic components;
folding the flexible printed circuit to bring the first and second components of the respective modular sections into generally mutually facing relation, thereby forming a stack of modular sections; and
disposing an inter-component thermal management device between the components of each modular section to remove or stabilize heat from the components during operation. - View Dependent Claims (32, 33, 34, 35, 36)
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Specification