MEMS RF switch module including a vertical via

• US 20040264152A1
• Filed: 06/25/2003
• Published: 12/30/2004
• Est. Priority Date: 06/25/2003
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Chou, Tsung-Kuan Allen, Heck, John M., Hayden, Joseph S. III
• Granted Patent: US 7,170,155 B2
• Time in Patent Office: Days
• US Class Current: 361/767
• CPC Class Codes: B81B 2201/018 Switches not provided for in B81B2201/014 - B81B2201/016
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 1/5805 Connections to printed circuits for slide switches H01H15/005; for tumbler switches H01H23/006
• CPC Class Codes: H01L 2224/16 of an individual bump connector

Abstract

An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.

Claims

1. An apparatus, comprising:

a Micro-electromechanical System (MEMS) module including at least one MEMS device;

at least one contact mounted to a bottom of the MEMS module; and

at least one via to pass vertically through a portion of the MEMS module to electrically couple the at least one MEMS device to the contact.

2. The apparatus of claim 1 wherein the at least one MEMS device comprises a MEMS RF switch array including at least one switch.

3. The apparatus of claim 1 wherein the MEMS module includes an input terminal, an output terminal, and an actuation terminal each electrically coupled to the at least one MEMS device.

4. The apparatus of claim 3 wherein the input terminal is electrically coupled to a first via of the at least one via, the output terminal is electrically coupled to a second via of the at least one via, and the actuation terminal is electrically coupled to a third via of the at least one via.

5. The apparatus of claim 4 wherein the first via is electrically coupled to the first contact, the second via is electrically coupled to a second contact mounted to the bottom of the MEMS module, and the third via is electrically coupled to a third contact mounted to the bottom of the MEMS module.

6. The apparatus of claim 1, further comprising a trace ring to couple the at least one MEMS device to a first via of the at least one via.

7. The apparatus of claim 6 wherein the trace ring surrounds at least a portion of the at least one MEMS device to allow a signal to transit the MEMS module using a second via of the at least one via without crossing the trace ring.

8. The apparatus of claim 1, further comprising a seal ring to couple a first section to a second section of the MEMS module.

9. The apparatus of claim 1, further comprising a printed circuit board (PCB) coupled to the contact.

10. A Micro-electromechanical System (MEMS) Radio Frequency (RF) switch module, comprising:

a MEMS die including an RF switch array;

a cap section coupled to the MEMS die, the cap section including at least one vertical via to pass through the cap section.

11. The MEMS RF switch module of claim 10 wherein the cap section is coupled to the MEMS die by a seal ring.

12. The MEMS RF switch module of claim 10 wherein the cap section comprises Silicon.

13. The MEMS RF switch module of claim 10 wherein the cap section comprises a ceramic material.

14. The MEMS RF switch module of claim 10 wherein the MEMS die comprises:

an input terminal electrically coupled to the RF switch array and to a first vertical via of the at least one vertical via;

an output terminal electrically coupled to the RF switch array and to a second vertical via of the at least one vertical via; and

an actuation terminal electrically coupled to the RF switch array and to a third vertical via of the at least one vertical via.

15. The MEMS RF switch module of claim 14 wherein the MEMS die comprises a second RF switch array electrically coupled to a second input terminal and to a second actuation terminal, the second RF switch array electrically coupled to the output terminal.

16. The MEMS RF switch module of claim 10, further comprising a trace ring to electrically couple a first vertical via of the at least one vertical via to the RF switch array.

17. The MEMS RF switch module of claim 16 wherein the trace ring surrounds at least a portion of the RF switch array to allow a signal to enter or exit the MEMS RF switch module by way of a second vertical via of the at least one vertical via without crossing the trace ring.

18. The MEMS RF switch module of claim 10, further comprising a printed circuit board (PCB) electrically coupled to the RF switch array by way of the at least one vertical via.

19. A system, comprising:

a printed circuit board (PCB);

a Micro-electromechanical System (MEMS) Radio Frequency (RF) switch module coupled to the PCB, the MEMS RF switch module comprising;

an RF switch array; and

at least one vertical via to electrically couple the RF switch array to the PCB; and

an amplifier electrically coupled to the MEMS RF switch module.

20. The system of claim 19 wherein the system is a wireless device.

21. The system of claim 19 wherein the MEMS RF switch module to switch from a first RF band to a second RF band to transmit an RF signal by the system.

22. The system of claim 19 wherein the MEMS RF switch module comprises a trace ring to electrically couple the RF switch array to a first vertical via of the at least one vertical via, the trace ring surrounding at least a portion of the RF switch array to allow a signal to transit the MEMS RF switch module using a second vertical via of the at least one vertical via without crossing the trace ring.

23. A method, comprising:

receiving a Radio Frequency (RF) signal at a Micro-electromechanical System (MEMS) Radio Frequency (RF) switch module through a first vertical via of the MEMS RF switch module, the first vertical via electrically coupled to an RF switch array of the MEMS RF switch module;

transiting the RF signal through at least one switch of the RF switch array; and

outputting the RF signal from the MEMS RF switch module.

24. The method of claim 23 wherein outputting the RF signal comprises outputting the RF signal through a second vertical via of the MEMS RF switch module, the second vertical via electrically coupled to the RF switch array.

25. The method of claim 23, further comprising receiving an actuation signal at the MEMS RF switch module to actuate the at least one switch.

26. The method of claim 25 wherein receiving the actuation signal comprises receiving the actuation signal through a third vertical via of the MEMS RF switch module, the third vertical via electrically coupled to the RF switch array.