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Integrated photonic circuits with vertical connections

  • US 20040264833A1
  • Filed: 06/26/2003
  • Published: 12/30/2004
  • Est. Priority Date: 06/26/2003
  • Status: Active Grant
First Claim
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1. An integrated photonic device comprising:

  • a substrate;

    a photonic circuit etched onto said substrate;

    a cladding layer positioned on said substrate, said cladding layer having a refractive index different from said circuit; and

    an angled implantation disposed in said cladding layer, said angle implantation optically connecting said photonic circuit with an outer surface of said cladding layer.

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