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Wafer level packaging for optoelectronic devices

  • US 20040264866A1
  • Filed: 10/24/2001
  • Published: 12/30/2004
  • Est. Priority Date: 10/25/2000
  • Status: Active Grant
First Claim
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1. An optical device package comprising:

  • a) a substrate having an upper surface, a distal end, a proximal end, and at least one longitudinally extending notch;

    b) a frame mounted to the substrate the frame including a band-like member surrounding an open area and having at least one recessed portion; and

    , c) at least one optical fiber positioned within the at least one longitudinally extending notch and disposed through the recessed portion of the frame.

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