Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices
First Claim
1. A Micro-Electro-Mechanical System (MEMS) comprising in combination:
- a substrate comprising a base;
a micro-machine coupled to the substrate; and
a cover coupled to the substrate, the cover mounted over the micro-machine, wherein the cover and the micro-machine are coupled to the substrate by forming at least one bond between the cover and the substrate and between the micro-machine and the substrate, wherein the cover, the micro-machine, and the substrate each have mating surfaces at which the at least one bond may be formed, and wherein the at least one bond is formed by;
depositing a first layer of material on a first mating surface, wherein the first layer of material is selected from the group consisting of gold and tin;
depositing a second layer of material on a second mating surface, wherein the second layer of material is selected from the group consisting of indium and lead; and
pressing the first layer of material to the second layer of material, thereby forming an alloy to serve as the at least one bond between the mating surfaces of the cover and the substrate and between the mating surfaces of the micro-machine and the substrate.
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Abstract
A method of bonding and packaging components of Micro-Electro-Mechanical Systems (MEMS) and MEMS based devices using a Solid-Liquid InterDiffusion (SLID) process is provided. A micro-machine is bonded to a micro-machine chip using bonding materials. A layer of chromium is first deposited onto surfaces of the micro-machine and the micro-machine chip followed by a layer of gold. Subsequently, a layer of indium is deposited between the layers of gold, and the surface of the micro-machine is pressed against the surface of the micro-machine chip forming a gold-indium alloy to serve as a bond between the micro-machine and the micro-machine chip. In addition, a cover is bonded to the micro-machine chip in the same manner providing a hermetic seal for the MEMS based device.
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Citations
20 Claims
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1. A Micro-Electro-Mechanical System (MEMS) comprising in combination:
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a substrate comprising a base;
a micro-machine coupled to the substrate; and
a cover coupled to the substrate, the cover mounted over the micro-machine, wherein the cover and the micro-machine are coupled to the substrate by forming at least one bond between the cover and the substrate and between the micro-machine and the substrate, wherein the cover, the micro-machine, and the substrate each have mating surfaces at which the at least one bond may be formed, and wherein the at least one bond is formed by;
depositing a first layer of material on a first mating surface, wherein the first layer of material is selected from the group consisting of gold and tin;
depositing a second layer of material on a second mating surface, wherein the second layer of material is selected from the group consisting of indium and lead; and
pressing the first layer of material to the second layer of material, thereby forming an alloy to serve as the at least one bond between the mating surfaces of the cover and the substrate and between the mating surfaces of the micro-machine and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A Micro-Electro-Mechanical System (MEMS) comprising:
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a substrate having a mating surface; and
a micro-machine having a mating surface and being coupled to the substrate by forming a bond between the micro-machine and the substrate, wherein the bond is formed by;
depositing a first layer of mating material on the mating surface of the substrate;
depositing a first layer of bonding material on the first layer of mating material, wherein the first layer of bonding material is selected from the group consisting of gold and tin;
depositing a second layer of mating material on the mating surface of the micro-machine; and
depositing a second layer of bonding material on the second layer of mating material, wherein the second layer of bonding material is selected from the group consisting of indium and lead; and
pressing the micro-machine to the substrate, thereby forming an alloy to serve as the bond between the mating surfaces of the substrate and the micro-machine. - View Dependent Claims (19, 20)
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Specification