Integrated circuit incorporating wire bond inductance

• US 20040266059A1
• Filed: 06/30/2003
• Published: 12/30/2004
• Est. Priority Date: 06/30/2003
• Status: Active Grant

• Current Assignee: Zarbana Digital Fund LLC (Intellectual Ventures LLC)
• Original Assignee: Seven Generations Energy Ltd.
• Inventors: Wight, James Stuart, Grundlingh, Johan M.
• Granted Patent: US 7,342,300 B2
• Time in Patent Office: Days
• US Class Current: 438/106
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15173 : in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

The invention relates to the field of electronics, more particularly to the wire bonds incorporated into an integrated circuit package such as a quad flat pack, a ball grid array or hybrid style module. The present invention takes the normally undesirable wire bond inductance and uses it in an operational circuit where positive inductance is required. The circuit in which the wire bond inductance is used is located primarily in the integrated circuit die housed in the integrated circuit package, but may also include off-die components. In one example, a wire bond is used as the required series inductance in a discrete circuit impedance inverter which consists of two shunt-to-ground negative inductances and one series positive inductance. One of the negative inductances is located on-die, while the other is located off-die.

Claims

1. An integrated circuit package comprising:

(a) an integrated circuit die having at least one circuit etched thereon; and

(b) a housing containing said integrated circuit die,

wherein said integrated circuit die is electrically coupled to said housing using at least one wire bond; and

wherein said wire bond(s) has (have) an inductance associated therewith; and

wherein said wire bond inductance is used to facilitate operation of said at least one circuit.

6. The integrated circuit package of claim 1 wherein said at least one of circuit is an impedance inverter.

9. The integrated circuit package of claim 1 wherein said at least one of circuit is a discrete filter.

12. The integrated circuit package of claim 1 wherein said at least one circuit comprises on-die and off-die components.

2. A method of providing inductance to facilitate operation of a circuit contained in an integrated circuit package comprising making available wire bond inductance to said circuit.

4. The method of claims 2 wherein said circuit is contained in an integrated circuit die housed in said integrated circuit package.

7. The method of claim 2 wherein said circuit is an impedance inverter.

10. The method of claim 2 wherein said circuit is a discrete filter.

13. The method of claim 2 said circuit comprises on-die and off die components.

3. The use of wire bond inductance in an integrated circuit package to facilitate operation of a circuit contained in an integrated circuit package.

5. A use as claimed in claim 3 wherein said circuit is contained in an integrated circuit die housed in said integrated circuit package.

8. The use of claim 3 wherein said circuit is an impedance inverter.

11. The use of claim 3 wherein said circuit is a discrete filter.