Insulative covering of probe tips
First Claim
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1. A method of determining terminals of a semiconductor die to contact during test, said method comprising:
- selecting a first subset of said terminals not to contact during testing of said die;
covering with an electrically insulative material tip(s) of a first subset of probes corresponding to said first subset of terminals, wherein said first subset of probes composes a plurality of probes corresponding to ones of said terminals;
bringing said plurality of probes into contact with said ones of said terminals of said die; and
verifying testing of said die.
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Abstract
An insulative material is applied to one or more selected probe tips to disable those probes, and the probes are brought into contact with a semiconductor die. One or more tests are run on the die to verify sufficient testing of the die without the disabled probes. The process may be repeated with other probes disabled to determine which probes need not be used in testing the die.
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Citations
18 Claims
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1. A method of determining terminals of a semiconductor die to contact during test, said method comprising:
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selecting a first subset of said terminals not to contact during testing of said die;
covering with an electrically insulative material tip(s) of a first subset of probes corresponding to said first subset of terminals, wherein said first subset of probes composes a plurality of probes corresponding to ones of said terminals;
bringing said plurality of probes into contact with said ones of said terminals of said die; and
verifying testing of said die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A probing device comprising:
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a substrate;
a plurality of probes disposed on said substrate, said probes comprising tips disposed to contact terminals of a die to be tested; and
insulative material covering one of said tips. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification