Sensor design and process

• US 20050000082A1
• Filed: 07/21/2004
• Published: 01/06/2005
• Est. Priority Date: 03/17/1999
• Status: Active Grant

• Current Assignee: Input/Output Incorporated
• Original Assignee: Input/Output Incorporated
• Inventors: Fung, Bing-Fai, Simon, Philip, Yu, Duli, Schmidt, Martin A., Marsh, James L., Goldberg, Howard D., Selvakumar, Arjun, Ip, Matthew
• Granted Patent: US 6,945,110 B2
• Time in Patent Office: Days
• US Class Current: 29/595
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/08 with conversion into electric or magnetic values
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01V 1/047 Arrangements for coupling the generator to the ground
• CPC Class Codes: G01V 1/053 for generating transverse waves
• CPC Class Codes: G01V 1/104 using explosive charges G01V1/157 takes precedence
• CPC Class Codes: G01V 1/181 Geophones
• CPC Class Codes: G01V 1/38 specially adapted for water-covered areas G01V1/28 takes precedence
• CPC Class Codes: Y10T 29/49007 Indicating transducer

Abstract

An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

Claims

1-12. -12. (cancelled)

13. A method of fabricating a sensor element, comprising:

using a first process to fabricate a measurement mass wafer for detecting acceleration, the measurement mass wafer including a mass housing having a cavity, and a spring mass assembly positioned within the cavity;

fabricating a top cap wafer using the first process;

fabricating a bottom cap wafer using the first process;

bonding the top cap wafer to a side of the measurement mass wafer using a bonding process;

bonding the bottom cap wafer to another side of the measurement mass wafer using the bonding process; and

making one or more dicing cuts at predetermined locations on the sensor element.

14. The method of claim 13 further comprising etching a surface of the measurement mass wafer, applying a metal layer on the etched surface, and molding the metal layer to form a stiction-reducing electrode pattern.

15. The method of claim 13, wherein fabricating the measurement mass wafer further includes fabricating a passage for venting air from the cavity.

16. The method of claim 13, wherein fabricating the top cap wafer further comprises forming a press frame recess in the top cap wafer.

17. The method of claim 13, wherein fabricating the bottom cap wafer further comprises forming a press frame recess in the bottom cap wafer.

18. The method of claim 15, wherein the passage comprises a V-shaped groove.

19. The method of claim 13, wherein the dicing cuts penetrate through the top cap wafer, the bottom cap wafer, and at least partially through the measurement mass wafer.

20. The method of claim 13, wherein the top cap wafer includes a balanced metal pattern on an upper surface of the top cap wafer.

21. The method of claim 13, wherein the bottom cap wafer includes a balanced metal pattern on a lower surface of the bottom cap wafer.

22. The method of claim 13, wherein the spring-mass assembly comprises springs.

23. The method of claim 22, wherein the springs include an etch-stop layer on one or more surfaces of the springs.

24. The method of claim 13, wherein the measurement mass wafer includes one or more mass contact pads;

and wherein the dicing cuts are made through the top cap wafer to expose the mass contact pads on the measurement mass wafer.

25. The method of claim 13, wherein the measurement mass wafer includes one or more mass contact pads;

and wherein the dicing cuts are made through the bottom cap wafer to expose the mass contact pad on the measurement mass wafer.

26. The method of claim 13, wherein the measurement mass includes one or more mass contact pads and the dicing cuts are made:

through the top cap wafer to expose the mass contact pads on the measurement mass wafer; and

through the bottom cap wafer to expose the mass contact pads on the measurement mass wafer.

27. The method of claim 15, wherein the dicing cuts are made through the top cap wafer and the bottom cap wafer and into the measurement mass wafer, stopping at a predetermined distance from the passage within the measurement mass wafer.

28. The method of claim 27 further comprising opening the passage after the dicing cuts are made to open an air vent to the passage.

29. The method of claim 28 further comprising a second process to expose the passage within the measurement mass wafer, wherein air is removed from the cavity through the passage to create a low pressure environment in the cavity, and wherein the passage is sealed to maintain the low pressure environment within the cavity.

30. The method of claim 28, further comprising packaging the sensor element in a sensor housing and using a vacuum process to remove substantially all air from the sensor housing during packaging to create a low pressure environment within the sensor housing;

wherein air is removed from the accelerometer though the passage during the vacuum process; and

wherein the sensor housing is sealed to maintain the low pressure environment.

31-37. -37. (cancelled)