Transparent conductive oxides

• US 20050000794A1
• Filed: 05/20/2004
• Published: 01/06/2005
• Est. Priority Date: 05/23/2003
• Status: Active Grant

• Current Assignee: Demaray LLC
• Original Assignee: Demaray LLC
• Inventors: Demaray, Richard E., Narasimhan, Mukundan
• Granted Patent: US 8,728,285 B2
• Time in Patent Office: Days
• US Class Current: 204/192.100
• CPC Class Codes: C23C 14/0036 Reactive sputtering
• CPC Class Codes: C23C 14/0042 Controlling partial pressure or flow rate of reactive or inert gases with feedback of measurements
• CPC Class Codes: C23C 14/086 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: H01B 13/0026 Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal

Abstract

A method of deposition of a transparent conductive film from a metallic target is presented. A method of forming a transparent conductive oxide film according to embodiments of the present invention include depositing the transparent conductive oxide film in a pulsed DC reactive ion process with substrate bias, and controlling at least one process parameter to affect at least one characteristic of the conductive oxide film. The resulting transparent oxide film, which in some embodiments can be an indium-tin oxide film, can exhibit a wide range of material properties depending on variations in process parameters. For example, varying the process parameters can result in a film with a wide range of resistive properties and surface smoothness of the film.

Claims

1. A method of forming a transparent conductive oxide film, comprising:

depositing the transparent conductive oxide film in a pulsed DC reactive ion process with substrate bias; and

controlling at least one process parameter to provide at least one characteristic of the conductive oxide film at a particular value.

2. The method of claim 1, wherein controlling at least one process parameter includes controlling the oxygen partial pressure.

3. The method of claim 1, wherein the transparent conductive oxide film includes indiuim-tin oxide.

4. The method of claim 1, wherein the at least one characteristic includes sheet resistance.

5. The method of claim 1, wherein the at least one characteristic includes film roughness.

6. The method of claim 5, wherein the transparent conductive oxide film includes an indium-tin oxide film and the film roughness is characterized by R_a less than about 10 nm with Rms of less than about 20 nm.

7. The method of claim 4, wherein the bulk resistance can be varied between about 2×

10<sup>−

4</sup> micro-ohms-cm to about 0.1 micro-ohms-cm.

8. The method of claim 1, wherein the at least one process parameter includes a power supplied to a target.

9. The method of claim 1, wherein the at least one process parameter includes an oxygen partial pressure.

10. The method of claim 1, wherein the at least one process parameter includes bias power.

11. The method of claim 1, wherein the at least one process parameter includes deposition temperature.

12. The method of claim 1, wherein the at least one process parameter includes an argon partial pressure.

13. The method of claim 1, further including supplying a metallic target.

14. The method of claim 1, further including supplying a ceramic target.

15. The method of claim 1, wherein the transparent conductive oxide film is doped with at least one rare-earth ions.

16. The method of claim 15, wherein the at least one rare-earth ions includes erbium.

17. The method of claim 15, wherein the at least one rare-earth ions includes cerium.

18. A method of depositing a transparent conductive oxide film on a substrate, comprising:

placing the substrate in a reaction chamber;

adjusting power to a pulsed DC power supply coupled to a target in the reaction chamber;

adjusting an RF bias power coupled to the substrate;

adjusting gas flow into the reaction chamber; and

providing a magnetic field at the target in order to direct deposition of the transparent conductive oxide film on the substrate in a pulsed-dc biased reactive-ion deposition process, wherein the transparent conductive oxide film exhibits at least one particular property.

19. The method of claim 18, wherein at least one particular property of the transparent conductive oxide film is determined by parameters of the pulsed-dc biased reactive ion deposition process.

20. The method of claim 19, wherein the at least one particular property includes resistivity of the transparent conductive oxide film.

21. The method of claim 19, wherein the transparent conductive oxide film includes an indium-tin oxide film.

22. The method of claim 19, wherein the parameters include oxygen partial pressure.

23. The method of claim 19, wherein the parameters include bias power.

24. The method of claim 18, wherein the target can include at least one rare-earth ions.

25. The method of claim 24, wherein the at least one rare-earth ions includes erbium.

26. The method of claim 24, wherein the at least one rare-earth ion includes cerbium.