Glass package that is hermetically sealed with a frit and method of fabrication
First Claim
1. A glass package comprising:
- a first glass plate;
a second glass plate; and
a frit made from glass that was doped with at least one transition metal and a coefficient of thermal expansion (CTE) lowering filler, wherein said frit was heated by a irradiation source in a manner that caused said frit to melt and form a hermetic seal which connects said first glass plate to said second glass plate.
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Accused Products
Abstract
A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.
217 Citations
67 Claims
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1. A glass package comprising:
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a first glass plate;
a second glass plate; and
a frit made from glass that was doped with at least one transition metal and a coefficient of thermal expansion (CTE) lowering filler, wherein said frit was heated by a irradiation source in a manner that caused said frit to melt and form a hermetic seal which connects said first glass plate to said second glass plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for manufacturing a hermetically sealed glass package, said method comprising the steps of:
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providing a first glass plate;
providing a second glass plate;
depositing a frit made from glass doped with at least one transition metal and a coefficient of thermal expansion (CTE) lowering filler onto said second glass plate; and
heating said frit in a manner that would cause said frit to soften and form a hermetic seal which connects said first glass plate to said second glass plate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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- 26. An organic light emitting diode device having at least one organic light emitting diode located between two plates connected to one another by a hermetic seal formed from a frit that was heated by an irradiation source in a manner that caused said frit to melt and form the hermetic seal while at the same time avoiding thermal degradation of said at least one organic light emitting diode, wherein said frit is a glass that was doped with at least one transition metal and a coefficient of thermal expansion (CTE) lowering filler.
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31. An organic light emitting diode display comprising:
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a first substrate plate;
at least one organic light emitting diode;
a second substrate plate; and
a frit made from glass that was doped with at least one transition metal and a coefficient of thermal expansion (CTE) lowering filler, wherein said frit was heated by an irradiation source in a manner that caused said frit to soften and form a hermetic seal which connects said first substrate plate to said second substrate plate and also protects said at least one organic light emitting diode located between said first substrate plate and said second substrate plate. - View Dependent Claims (32, 33, 34, 35, 36)
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37. A method for manufacturing an organic light emitting diode device, said method comprising the steps of:
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providing a first substrate plate;
providing a second substrate plate;
depositing a frit made from glass doped with at least one transition metal and a coefficient of thermal expansion (CTE) lowering filler onto one of said substrate plates; and
depositing at least one organic light emitting diode onto one of said substrate plates; and
heating and then cooling said frit in a manner that would cause said frit to melt and form a hermetic seal which connects said first substrate plate to said second substrate plate and also protects said at least one organic light emitting diode. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50)
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- 51. A frit made from glass that was doped with at least one transition metal and a coefficient of thermal expansion (CTE) lowering filler.
Specification