Surface mount antenna, and an antenna element mounting method

• US 20050001768A1
• Filed: 05/21/2004
• Published: 01/06/2005
• Est. Priority Date: 05/29/2003
• Status: Active Grant

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Sekiguchi, Masami, Kaneko, Masayasu
• Granted Patent: US 7,034,752 B2
• Time in Patent Office: Days
• US Class Current: 343/700.MS
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence

Abstract

A surface mount antenna is configured by mounting on a board a dielectric material on which electrodes are provided, wherein an antenna element comprises the electrodes having a ground electrode and a feed electrode, and a ground mount pattern connected to the ground electrode of the electrode and a feed mount pattern connected to the feed electrode of the electrode are formed on the board with a predetermined distance in-between. A frequency is adjusted by changing impedance by varying a pattern width of a portion connecting a ground electrode of the electrodes and a GND pattern of a ground side of the board, and an impedance matching is performed by changing capacitance based on dielectric constant of the board by varying area of a surface of a feed pattern at a position where a feed electrode of the electrodes and a feed side of the board are in opposing relation.

Claims

1. A surface mount antenna configured by mounting on a board a dielectric material on which electrodes are provided, characterized in that:

said electrodes are formed to have a ground electrode and a feed electrode; and

a ground mount pattern connected to the ground electrode of said electrodes and a feed mount pattern connected to the feed electrode of said electrodes are formed on said board with a predetermined distance between them;

wherein

an utilized frequency is adjusted by changing an impedance by varying a pattern width of a portion connecting the ground electrode of the electrodes and a GND pattern of a ground side of the board; and

an impedance matching is performed by changing a capacitance based on a dielectric constant of the board by varying an area of a surface of a feed pattern at a position where the feed electrode of the electrodes and a feed side of the board are in opposing relation to each other.

2. The surface mount antenna as cited in claim 1, wherein:

said feed mount pattern is provided at a backside of the board.

3. The surface mount antenna as cited in claim 1, wherein:

said dielectric material is formed to be a rectangular solid shape; and

said electrodes are formed to include a right bottom face, a right side face of the feed electrode, a top face, a left side face, and left bottom face of the ground electrode so as to cover surfaces of the rectangular solid shaped dielectric material by said electrode.

4. An antenna element mounting method, when an antenna element formed by forming electrodes on surfaces of a dielectric material is mounted on a board, comprising the steps of:

adjusting an utilized frequency by changing an impedance by varying a pattern width of a portion connecting a ground electrode of said electrodes and a GND pattern of a ground side of the board; and

performing an impedance matching by changing a capacitance based on a dielectric constant of the board by varying an area of a surface of a feed pattern at a position where a feed electrode of the electrodes and a feed side of the board are in opposing relation to each other.

5. The antenna element mounting method as cited in claim 4, wherein:

said feed pattern is provided at a backside of the board.

6. The antenna element mounting method as cited in claim 4, wherein:

said dielectric material is formed to be a rectangular solid shape; and

said electrodes are formed to include a right bottom face of the feed electrode, a right side face, a top face, a left side face, and left bottom face of the ground electrode so as to cover surfaces of the rectangular solid shaped dielectric material by said electrodes.