Optical module, method of manufacturing the same, optical communication device and electronic device using the same

• US 20050002618A1
• Filed: 05/13/2004
• Published: 01/06/2005
• Est. Priority Date: 05/27/2003
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Miyamae, Akira, Nagasaka, Kimio
• Granted Patent: US 7,160,035 B2
• Time in Patent Office: Days
• US Class Current: 385/88
• CPC Class Codes: G02B 6/4212 the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4231 with intermediate elements, e.g. rods and balls, between the elements
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83001 involving a temporary auxiliary member not forming part of the bonding apparatus
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12043 Photo diode

Abstract

The invention provides an optical module that can reduce its cost. An optical module to which an optical fiber is detachably inserted, includes: a substrate with an aperture to which the optical fiber is inserted; a flexible printed circuit board disposed on one surface of the substrate and including: a base member with an opening in a corresponding location to the aperture; an interconnection layer disposed on at least one surface of the base member); and a connection section including a part of the interconnection layer exposed through the opening; and an optical element disposed within the opening of the flexible printed circuit board, and connected to the connection section, the optical element performing one of transmission and reception of an optical signal with the optical fiber.

Claims

1. An optical module to detachably connect to an optical fiber, the optical module comprising:

a substrate with an aperture in which the optical fiber is inserted;

a flexible printed circuit board disposed on one surface of the substrate, the flexible printed circuit board including;

a base member with an opening in a corresponding location to the aperture;

an interconnection layer disposed on at least one surface of the base member; and

a connection section including a part of the interconnection layer exposed through the opening; and

an optical element disposed within the opening of the flexible printed circuit board and connected to the connection section, the optical element performing one of transmission and reception of an optical signal with the optical fiber.

2. The optical module according to claim 1, further comprising an alignment member interposed between an area defined by the aperture and the optical element, the alignment member suppressing dispersion of the optical signal.

3. The optical module according to claim 1, further comprising a seal member to tightly seal the optical element.

4. The optical module according to claim 3, the seal member and the alignment member being made of the same material.

5. The optical module according to claim 1, the flexible printed circuit board including a microstrip line.

8. An optical communication device, comprising:

the optical module according to claim 1.

9. An electronic device, comprising:

the optical module according to claim 1.

6. An optical module for use with a component, the optical module comprising:

a substrate with an aperture in which the component is disposed;

a flexible printed circuit board disposed on one surface of the substrate, the flexible printed circuit board including;

a base member with an opening in a corresponding location to the aperture;

an interconnection layer disposed on at least one surface of the base member; and

a connection section including a part of the interconnection layer exposed through the opening; and

an optical element disposed inside the aperture and within the opening of the flexible printed circuit board and connected to the connection section, the optical element performing one of transmission and reception of an optical signal through the flexible printed circuit board.

7. An optical module, comprising:

a substrate having translucency;

a flexible printed circuit board disposed on one surface of the substrate, the optical module including;

a base member with an opening;

an interconnection layer disposed on at least one surface of the base member; and

a connection section including a part of the interconnection layer exposed through the opening; and

an optical element disposed within the opening of the flexible printed circuit board and connected to the connection section, the optical element performing one of transmission and reception of an optical signal through the flexible printed circuit board and the substrate.

10. A method of manufacturing an optical module to detachably connect to an optical fiber, the method comprising:

boring an aperture in a substrate in which the optical fiber is inserted;

mounting a flexible printed circuit board on one side of the substrate, the flexible printed circuit board including a base member with an opening, an interconnection layer disposed on at least one surface of the base member, and a connection section including a part of the interconnection layer exposed through the opening, so that the opening corresponds to the aperture; and

disposing an optical element in the opening of the flexible printed circuit board to be connected to the connection section, the optical element performing one of transmission and reception of an optical signal with the optical fiber.

12. The method according to claim 10, further comprising forming an alignment member between an area defined by the aperture and the optical element, the alignment member suppressing dispersion of the optical signal.

13. The method according to claim 10, further comprising forming a sealing member so that the sealing member covers the optical element.

11. A method of manufacturing an optical module to detachably connect to an optical fiber, the method comprising:

boring a plurality of apertures in a substrate, the optical fiber being inserted in each of the apertures;

mounting a flexible printed circuit board on one side of the substrate, the flexible printed circuit board including a base member with a plurality of openings, an interconnection layer disposed on at least one surface of the base member, and connection sections each including a part of the interconnection layer exposed through one of the openings, so that each of the openings corresponds to a respective one of the apertures;

disposing an optical element in each of the openings of the flexible printed circuit board to be connected to one of the connection sections, the optical element performing one of transmission and reception of an optical signal with the optical fiber; and

dividing the substrate into predetermined areas, each corresponding to a respective one of the apertures.

14. A method of manufacturing an optical module, comprising:

boring an aperture in a substrate in which a component is disposed;

mounting a flexible printed circuit board on one side of the substrate, the flexible printed circuit board including a base member with an opening, an interconnection layer disposed on at least one surface of the base member, and a connection section including a part of the interconnection layer exposed through the opening, so that the opening corresponds to the aperture; and

disposing an optical element inside the aperture and in the opening of the flexible printed circuit board to be connected to the connection section thereof so that one of a light emission surface and a light reception surface thereof faces the flexible printed circuit board, the optical element performing one of transmission and reception of an optical signal.

15. A method of manufacturing an optical module, comprising:

providing a substrate having translucency;

mounting a flexible printed circuit board on one side of the substrate, the flexible printed circuit board including a base member with an opening, an interconnection layer disposed on at least one surface of the base member, and a connection section including a part of the interconnection layer exposed through the opening; and

disposing an optical element in the opening of the flexible printed circuit board to be connected to the connection section thereof so that one of a light emission surface and a light reception surface thereof faces the flexible printed circuit board, the optical element performing one of transmission and reception of an optical signal.