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Plated via interposer

  • US 20050003171A1
  • Filed: 07/14/2004
  • Published: 01/06/2005
  • Est. Priority Date: 02/06/2003
  • Status: Abandoned Application
First Claim
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1. An interposer, for providing electrical connection between a contact of one electrical component and a contact of another electrical component:

  • an insulative planar layer with an upper surface and a lower surface, which defines a plurality of vias which penetrate said insulative planar layer;

    an interposer body, comprising an upper contact pad of copper positioned on said upper surface of said insulative planar sheet, with a plurality of connecting posts which fill said vias and which penetrate said insulative planar sheet and are contiguous with said upper contact pad, and contiguous with a lower contact pad of copper positioned on said lower surface of said insulative planar sheet, with said upper contact pad comprising one or more outer sidewalls and one or more inner sidewalls and a top contact surface, with said inner sidewalls defining a well, for centering contact with a contact ball, in which said insulative planer is not penetrated below said well.

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