Freeform substrates and devices
First Claim
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1. A method for maximizing package density in an IMD, comprising:
- creating a free formed substrate shaped with curved edge contours to conform to interior edges of a body of the implantable medical device; and
forming integrated circuits on the free formed substrate to maximize use of unused portions of the substrate.
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Abstract
An implantable medical device substrate is free form cut to the shape of the interior of the device. The free form shape allows more efficient use of not only the interior space of the device but also of the substrate itself. Integrated circuit components are formed to fit the shape of the substrate, freeing areas in the device for additional components, or allowing the device to be made smaller through a maximized use of the available space-volume.
22 Citations
5 Claims
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1. A method for maximizing package density in an IMD, comprising:
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creating a free formed substrate shaped with curved edge contours to conform to interior edges of a body of the implantable medical device; and
forming integrated circuits on the free formed substrate to maximize use of unused portions of the substrate. - View Dependent Claims (2)
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3. A method of making a freeform silicon substrate for an IMD, comprising:
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cutting a substrate to a shape of a body of an implantable medical device; and
forming integrated circuit components on the substrate - View Dependent Claims (4, 5)
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Specification