Temperature-homogenizing device

• US 20050006083A1
• Filed: 01/13/2004
• Published: 01/13/2005
• Est. Priority Date: 07/02/2003
• Status: Active Grant

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Hsu, Jui-Yuan, Chen, Yin-Yuan, Wu, Wen-Ching
• Granted Patent: US 7,066,244 B2
• Time in Patent Office: Days
• US Class Current: 165/185
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20436 Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
• CPC Class Codes: H05K 7/20481 characterised by the material composition exhibiting specific thermal properties

Abstract

A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.

Claims

1. A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of said electronic device, said temperature-homogenizing device comprising:

a first and a second higher thermally conductive layers; and

a first lower thermally conductive layer disposed between said first and said second higher thermally conductive layers, and made of a material or a medium having a higher thermal conductivity than each of said first and said second higher thermally conductive layers, such that said heat is homogeneously distributed throughout said first and said second higher thermally conductive layers at a higher thermal conduction rate and transferred through said first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on said housing.

2. The temperature-homogenizing device according to claim 1 wherein each of said first and said second higher thermally conductive layers is made of a material or medium selected from a group consisting of copper, aluminum and graphite.

3. The temperature-homogenizing device according to claim 2 wherein said first and said second higher thermally conductive layers are made of an identical material or medium.

4. The temperature-homogenizing device according to claim 1 wherein said first lower thermally conductive layer is made of a material or medium selected from a group consisting of general purpose plastic, glass and air.

5. The temperature-homogenizing device according to claim 1 further comprising a second lower thermally conductive layer adjacent to said first higher thermally conductive layer but opposed to said first lower thermally conductive layer.

6. The temperature-homogenizing device according to claim 1 further comprising a second lower thermally conductive layer adjacent to said second higher thermally conductive layer but opposed to said first lower thermally conductive layer.

7. The temperature-homogenizing device according to claim 6 wherein said second lower thermally conductive layer is made of a material or medium selected from a group consisting of general purpose plastic, glass and air.

8. The temperature-homogenizing device according to claim 7 wherein said first and said second lower thermally conductive layers are made of an identical material or medium.

9. The temperature-homogenizing device according to claim 8 further comprising a third lower thermally conductive layer imbedded into one of said first higher thermally conductive layer, said first lower thermally conductive layer, said second higher thermally conductive layer and said second lower thermally conductive layer and disposed in the vicinity of said electronic component so as to slow down the thermal conduction rate in the vertical direction.

10. The temperature-homogenizing device according to claim 9 wherein when said third lower thermally conductive layer is imbedded into one of said first and said second lower thermally conductive layers, said third lower thermally conductive layer has a lower thermal conductivity than that of each of said first and said second lower thermally conductive layer.

11. The temperature-homogenizing device according to claim 10 wherein said third lower thermally conductive layer is an air layer.

12. The temperature-homogenizing device according to claim 9 wherein when said third lower thermally conductive layer is imbedded into one of said first and said second higher thermally conductive layers, said first, said second and said third lower thermally conductive layers are made of an identical material or medium.

13. The temperature-homogenizing device according to claim 12 wherein said third lower thermally conductive layer is made of a material or medium selected from a group consisting of general purpose plastic, glass and air.

14. The temperature-homogenizing device according to claim 1 further comprising a plurality of pillars disposed in said first lower thermally conductive layer so as to adjust the thermal conduction rate in the vertical direction.

15. The temperature-homogenizing device according to claim 14 wherein said plurality of pillars have equal height.

16. The temperature-homogenizing device according to claim 14 wherein said plurality of pillars are made of a material or medium selected from a group consisting of copper, aluminum and graphite.

17. The temperature-homogenizing device according to claim 16 wherein said plurality of pillars, said first and said higher thermally conductive layers are made of and identical material or medium.

18. The temperature-homogenizing device according to claim 1 wherein at lease a recess portion is provided on said first higher thermally conductive layer, and a fourth lower thermally conductive layer is provided on said recess portion so as to slow down the thermal conduction rate in the vertical direction.

19. The temperature-homogenizing device according to claim 18 wherein said fourth and said first lower thermally conductive layers are made of an identical material or medium.

20. The temperature-homogenizing device according to claim 1 wherein a portion of said first higher thermally conductive layer is in contact with or in the vicinity of said electronic components.