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METHOD FOR HEAT ABSORPTION USING POLYOXYMETHYLENE POLYMER COMPOSITIONS

  • US 20050006621A1
  • Filed: 04/03/2003
  • Published: 01/13/2005
  • Est. Priority Date: 11/04/1997
  • Status: Active Grant
First Claim
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1. A method for dissipating heat away from a heat sensitive device exposed to a high temperature environment, the method comprising:

  • surrounding the heat sensitive device with a solid heat absorption composition comprising polyoxymethylene polymer and a catalyst, wherein said polyoxymethylene polymer undergoes endothermic decomposition directly from solid to gas when exposed to the high temperature environment, and wherein said composition absorbs heat from the high temperature environment during the endothermic decomposition of the polyoxymethylene polymer while remaining in a solid state and thereby dissipates heat away from the heat sensitive device.

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