Method, system, and apparatus for authenticating devices during assembly

• US 20050007252A1
• Filed: 06/14/2004
• Published: 01/13/2005
• Est. Priority Date: 06/12/2003
• Status: Active Grant

• Current Assignee: Symbol Technologies, LLC (Zebra Technologies Corporation)
• Original Assignee: Matrics Incorporated (Zebra Technologies Corporation)
• Inventors: Bandy, William R., Arneson, Michael R.
• Granted Patent: US 7,276,388 B2
• Time in Patent Office: Days
• US Class Current: 340/572.100
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/045 the record carrier being of the non-contact type, e.g. RFID, and being specially adapted for attachment to a disc, e.g. a CD or DVD
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 7/0095 Testing the sensing arrangement, e.g. testing if a magnetic card reader, bar code reader, RFID interrogator or smart card reader functions properly testing of electrical circuits G01R31/28
• CPC Class Codes: G11B 23/0021 discs
• CPC Class Codes: G11B 23/0042 with provision for auxiliary features sensing such features G11B17/00, G11B19/02
• CPC Class Codes: G11B 7/26 Apparatus or processes specially adapted for the manufacture of record carriers
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10S 438/976 : Temporary protective layer
• CPC Class Codes: Y10T 156/1075 : of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1142 : Changing dimension during delaminating [e.g., crushing, expanding, warping, etc.]
• CPC Class Codes: Y10T 156/1179 : with poking during delaminating [e.g., jabbing, etc.]
• CPC Class Codes: Y10T 156/1906 : Delaminating means responsive to feed or shape at delamination
• CPC Class Codes: Y10T 156/1978 : Delaminating bending means
• CPC Class Codes: Y10T 156/1983 : Poking delaminating means
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49798 : Dividing sequentially from leading end, e.g., by cutting or breaking
• CPC Class Codes: Y10T 29/49833 : Punching, piercing or reaming part by surface of second part
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53187 : Multiple station assembly apparatus
• CPC Class Codes: Y10T 29/5327 : Means to fasten by deforming
• CPC Class Codes: Y10T 29/53422 : by deforming

Abstract

Methods and systems for authenticating the operation of electronic devices, such as RFID tags are provided. In accordance with the method, a web of substrates having a plurality of devices attached thereto are received. The operation of a first set of the plurality of devices is authenticated. If it is determined that one or more devices is not operating properly, the location of each device is determined. The web of substrates is then moved incrementally to expose a second set of the plurality of devices. Each device that does not operate properly is indicated by applying ink to the substrate containing the device or by removing the device.

Claims

1. A method for authenticating the operation of a plurality of devices, comprising:

(A) receiving a web having a plurality of substrates and a wafer having a plurality of dies;

(B) transferring dies to substrates of the web to form a plurality of devices; and

(C) authenticating the operation of a device of the plurality of devices.

2. The method of claim 1, further comprising:

(D) repeating step (C) for the remaining devices in the plurality of devices.

3. The method of claim 1, further comprising the step of:

(D) if the operation of the device does not authenticate properly in step (C), identifying a location of the device.

4. The method of claim 3, further comprising:

(E) repeating steps (C) and (D) for the remaining devices in the plurality of devices.

5. The method of claim 1, further comprising:

(D) if the operation of the device does not authenticate properly in step (C), indicating the device as defective.

6. The method of claim 3, further comprising:

(E) if the operation of the device does not authenticate properly in step (C), indicating the device as defective.

7. The method of claim 5, wherein step (D) comprises:

applying ink to the substrate containing the defective device.

8. The method of claim 5, wherein step (D) comprises:

storing the location information associated with the defective device.

9. The method of claim 6, wherein step (E) comprises:

applying ink to the substrate containing the defective device.

10. The method of claim 6, wherein step (E) comprises:

storing location information associated with the defective device.

11. The method of claim 3, further comprising:

tracking the location of each device during movement of the web.

12. The method of claim 11, wherein the step of identifying the location of the device comprises:

determining an identification number associated with the device; and

using the identification number to access tracked location information associated with the device.

13. The method of claim 3, wherein the step of identifying the location of the device comprises:

determining an identification number associated with the device; and

calculating location information.

14. The method of claim 13, wherein the step of calculating location information comprises:

determining the location of the device on the web of substrates using the identification number;

determining the time when the device was transferred;

using the difference between the current time and the time when the device was transferred to identify the present location of the device in the system.

15. The method of claim 13, wherein the step of calculating location information comprises:

determining the location of the device on the web of substrates using the identification number;

determining a count when the device was transferred;

using the difference between a present count and the count when the device was transferred to identify the present location of the device in the system.

16. The method of claim 1, wherein the plurality of devices are RFID tags.

17. The method of claim 16, wherein step (C) comprises:

performing a far field read of the RFID tag of the plurality of RFID tags being authenticated.

18. The method of claim 17, further comprising:

(D) identifying which RFID tags in the plurality of devices being authenticated did not respond to the far field read.

19. The method of claim 1, where step (A) comprises:

receiving a web of substrates having a width of a single substrate.

20. The method of claim 1, where step (A) comprises:

receiving a web of substrates having a width of multiple substrates.

21. A system for authenticating the operation of a plurality of devices, comprising:

a die transfer module that transfers a plurality of dies to a plurality of substrates on a web of substrates, at least one die per substrate, to form a plurality of devices;

a substrate conveyor system that incrementally moves the web of substrates; and

a device authentication module, wherein the device authentication module includes logic that authenticates the operation of a plurality of devices.

22. The system of claim 21, further comprising:

logic that identifies the location of a die.

23. The system of claim 21 further comprising:

an inker.

24. A method for authentication of a plurality of radio frequency identification (RFID) tags, comprising:

(A) receiving a web of substrates;

(B) attaching a die to each substrate of a plurality of substrates of the web to form a plurality of RFID tags;

(C) using an antenna to perform a far field read of each RFID tag of the plurality of RFID tags;

(D) indicating which of the plurality of RFID tags do not respond to the far field read.

25. The method of claim 24, wherein step (A) comprises:

receiving a web of substrates having a width of a single substrate.

26. The method of claim 24, wherein step (A) comprises:

receiving a web of substrates having a width of multiple substrates.

27. The method of claim 24, wherein step (D) comprises:

inking at least one RFID tag of the plurality of RFID tags that does not respond to the far field read.

28. The method of claim 24, wherein step (D) comprises:

storing a position in the web of at least one RFID tag of the plurality of RFID tags that does not respond to the far field read.

29. A method for authenticating the operation of a device, comprising:

(A) receiving a web of substrates;

(B) receiving a wafer;

(C) transferring a die from the wafer to a substrate of the web to form a device;

(D) tracking movement of the device with the web;

(E) testing the device;

(F) if the device fails the test of step (E), using said tracking to indicate the device in the web has failed.

30. The method of claim 29, wherein said tracking comprises:

storing a first time at which the device is formed.

31. The method of claim 30, wherein step (F) comprises:

storing a second time at which the device is determined to have failed the test of step (E); and

determining a location of the device based on the first time and the second time.

32. The method of claim 31, wherein step (F) further comprises:

marking the determined location of the device in the web to indicate the device has failed.

33. The method of claim 29, wherein said tracking comprises:

storing a position in the web at which the device is formed.

34. The method of claim 33, wherein step (F) comprises:

storing a number of increments of the movement of the web until the device is determined to have failed the test of step (E); and

determining a location of the device based on the stored position and the stored increments of the movement of the web.

35. The method of claim 34, wherein step (F) further comprises:

marking the determined location of the device in the web to indicate the device has failed.

36. The method of claim 29, further comprising:

(G) repeating steps (C)-(F) for a plurality of dies of the wafer.