Microelectronic package within cylindrical housing

• US 20050007736A1
• Filed: 07/10/2003
• Published: 01/13/2005
• Est. Priority Date: 07/10/2003
• Status: Active Grant

• Current Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Original Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Inventors: Stoica, Vladimir, Glovatsky, Andrew Z.
• Granted Patent: US 7,180,736 B2
• Time in Patent Office: Days
• US Class Current: 361/688
• CPC Class Codes: H05K 7/1434 for electronics exposed to high gravitational force; Cylindrical housings
• CPC Class Codes: H05K 7/20163 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Abstract

A microelectronic package comprises microelectronic assemblies and a housing having a cylindrical outer wall. The microelectronic assemblies include electronic components mounted on a substrate and are affixed to support surfaces of the inner wall of the housing. The housing is preferably formed of semi-cylindrical sections that are joined along axial edges. The housing includes one or more axial channels interposed between the outer wall and the inner wall for conveying coolant gas. In this manner, the housing provides more uniform thermal dissipation of heat generated by the microelectronic assemblies during operation, despite variations in the thickness between the cylindrical outer wall and the support surfaces, which are preferably planar.

Claims

1. A microelectronic package comprising:

a housing comprising an outer wall cylindrical about an axis and an inner wall defining a central compartment, said inner wall comprising at least one assembly support surface that is parallel to the axis, said housing further comprising at least one axial channel interposed between the outer wall and the inner wall; and

a microelectronic assembly affixed to the assembly support surface.

2. The microelectronic package of claim 1 wherein the inner wall is non-concentric with the outer wall.

3. The microelectronic package of claim 1 wherein the support surface is planar.

4. The microelectronic package of claim 1 wherein the inner wall comprises first and second assembly support surfaces that are planar and parallel to the axis, and wherein the microelectronic package comprises a first microelectronic assembly affixed to the first assembly support surface, a second microelectronic assembly affixed to the second assembly support surface, and a flexible interconnect connecting the first microelectronic assembly and the second microelectronic assembly.

5. The microelectronic package of claim 1 wherein the channel is adapted for conveying cooling gas through the housing.

6. The microelectronic package of claim 1 wherein the housing comprises a first section having first axial edges and a second section having second axial edges joined to the first axial edges.

7. The microelectronic package of claim 6 wherein the first section comprises a semi-cylindrical wall and wherein the second section comprises a semi-cylindrical wall.

8. The microelectronic package of claim 1 wherein the housing is formed by a metal extrusion.

9. The microelectronic package of claim 1 wherein the housing is formed of a metal casting.

10. The microelectronic package of claim 1 wherein the housing is received in a tubular casing.

11. The microelectronic package of claim 1 wherein the support surface is a curve having a radius of curvature less than the radius of the outer wall.