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Microelectronic package within cylindrical housing

  • US 20050007736A1
  • Filed: 07/10/2003
  • Published: 01/13/2005
  • Est. Priority Date: 07/10/2003
  • Status: Active Grant
First Claim
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1. A microelectronic package comprising:

  • a housing comprising an outer wall cylindrical about an axis and an inner wall defining a central compartment, said inner wall comprising at least one assembly support surface that is parallel to the axis, said housing further comprising at least one axial channel interposed between the outer wall and the inner wall; and

    a microelectronic assembly affixed to the assembly support surface.

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