Method, system, and apparatus for transfer of dies using a die plate having die cavities

• US 20050009232A1
• Filed: 06/14/2004
• Published: 01/13/2005
• Est. Priority Date: 06/12/2003
• Status: Active Grant

• Current Assignee: Symbol Technologies, LLC (Zebra Technologies Corporation)
• Original Assignee: Matrics Incorporated (Zebra Technologies Corporation)
• Inventors: Bandy, William R., Arneson, Michael R.
• Granted Patent: US 7,795,076 B2
• Time in Patent Office: Days
• US Class Current: 438/107
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/045 the record carrier being of the non-contact type, e.g. RFID, and being specially adapted for attachment to a disc, e.g. a CD or DVD
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 7/0095 Testing the sensing arrangement, e.g. testing if a magnetic card reader, bar code reader, RFID interrogator or smart card reader functions properly testing of electrical circuits G01R31/28
• CPC Class Codes: G11B 23/0021 discs
• CPC Class Codes: G11B 23/0042 with provision for auxiliary features sensing such features G11B17/00, G11B19/02
• CPC Class Codes: G11B 7/26 Apparatus or processes specially adapted for the manufacture of record carriers
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10S 438/976 : Temporary protective layer
• CPC Class Codes: Y10T 156/1075 : of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1142 : Changing dimension during delaminating [e.g., crushing, expanding, warping, etc.]
• CPC Class Codes: Y10T 156/1179 : with poking during delaminating [e.g., jabbing, etc.]
• CPC Class Codes: Y10T 156/1906 : Delaminating means responsive to feed or shape at delamination
• CPC Class Codes: Y10T 156/1978 : Delaminating bending means
• CPC Class Codes: Y10T 156/1983 : Poking delaminating means
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49798 : Dividing sequentially from leading end, e.g., by cutting or breaking
• CPC Class Codes: Y10T 29/49833 : Punching, piercing or reaming part by surface of second part
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53187 : Multiple station assembly apparatus
• CPC Class Codes: Y10T 29/5327 : Means to fasten by deforming
• CPC Class Codes: Y10T 29/53422 : by deforming

Abstract

A method, system, and apparatus for transfer of dies using a die plate having die cavities is described herein. The die plate has a planar body. The body has a plurality of cells or cavities which are open at the first surface of the body. Each cell has a hole extending from the bottom surface of the cell to a second surface of the body. A wafer or support structure can be positioned to be closely adjacent to each other. A suction can be applied to the second surface of the die plate so that a plurality of dies can be transferred into a plurality of cells of the die plate. The dies can subsequently be transferred from the die plate having die cavities to one or more destination substrates or surfaces, by a punching mechanism.

Claims

1. A method for transferring a plurality of integrated circuit dies from a wafer to a die receptacle structure, comprising:

(a) positioning the wafer and die receptacle structure to be closely adjacent to each other such that each die of a plurality of dies of the wafer is positioned adjacent to a corresponding cell of a plurality of cells in a first surface of the die receptacle structure;

(b) applying a suction at a second surface of the die receptacle structure so that at least a partial vacuum exists in each cell of the plurality of cells due to a hole in the second surface corresponding to each cell; and

(c) separating each die of the plurality of dies from the wafer so that each die is transferred into the corresponding cell of the plurality of cells by the applied suction.

2. The method of claim 1, wherein step (c) comprises:

sawing each die of the plurality of dies from the wafer.

3. The method of claim 1, further comprising:

(d) prior to step (a), applying an adhesive material in each cell of the plurality of cells.

4. The method of claim 3, wherein step (c) comprises:

separating each die of the plurality of dies from the wafer so that each die is transferred into the corresponding cell of the plurality of cells by the applied suction and adheres to the adhesive material of the corresponding cell.

5. The method of claim 1, further comprising:

(d) prior to step (a), applying an adhesive material to a surface of the wafer.

6. The method of claim 5, wherein step (c) comprises:

separating each die of the plurality of dies from the wafer so that each die is transferred into the corresponding cell of the plurality of cells by the applied suction, and the adhesive material adheres each die in the corresponding cell.

7. The method of claim 1, wherein step (c) comprises:

using a laser to separate each die of the plurality of dies from the wafer.

8. A method for transferring a plurality of integrated circuit dies that are attached to a support structure to a die receptacle structure, comprising:

(a) positioning the support structure and die receptacle structure to be closely adjacent to each other such that each die of a plurality of dies attached to the support structure is positioned adjacent to a corresponding cell of a plurality of cells in a first surface of the die receptacle structure;

(b) applying a suction at a second surface of the die receptacle structure so that at least a partial vacuum exists in each cell of the plurality of cells due to a hole in the second surface corresponding to each cell; and

(c) releasing each die of the plurality of dies from the support structure so that each die resides in the corresponding cell of the plurality of cells.

9. The method of claim 8, wherein portions of the die receptacle structure around cells are substantially sharp, wherein step (c) comprises:

allowing the applied suction to cause the sharp portions of the die receptacle structure to cut the support structure around each die of the plurality of dies, such that each die of the plurality of dies is separated from the support structure and is transferred into the corresponding cell of the plurality of cells by the applied suction.

10. The method of claim 9, wherein step (a) comprises:

positioning the support structure and die receptacle structure to be closely adjacent to each other such that a surface of the support structure that attaches the plurality of dies faces towards the die receptacle structure.

11. The method of claim 9, wherein step (a) comprises:

positioning the support structure and die receptacle structure to be closely adjacent to each other such that a surface of the support structure that attaches the plurality of dies faces away from the die receptacle structure.

12. The method of claim 8, further comprising:

(d) prior to step (a), applying an adhesive material in each cell of the plurality of cells.

13. The method of claim 12, wherein step (c) comprises:

separating each die of the plurality of dies from the support structure so that each die adheres to the adhesive material of the corresponding cell.

14. The method of claim 8, further comprising:

(d) prior to step (a), applying an adhesive material to a first surface of the support structure, wherein the first surface of the support structure is opposite a second surface of the support structure that attaches the plurality of dies.

15. The method of claim 14, wherein step (c) comprises:

separating each die of the plurality of dies from the support structure so that each die is transferred into the corresponding cell of the plurality of cells by the applied suction, and the adhesive material adheres each die in the corresponding cell.

16. The method of claim 8, wherein the support structure is an adhesive tape structure, further comprising:

(d) prior to step (a), attaching the plurality of dies to the adhesive tape structure.

17. The method of claim 16, wherein step (d) comprises:

attaching a wafer to the adhesive tape structure; and

separating the wafer into the plurality of dies on the adhesive tape.

18. The method of claim 16, wherein step (d) comprises:

attaching the plurality of dies to the adhesive tape structure such that pads of the plurality of dies face towards the adhesive tape structure.

19. The method of claim 16, wherein step (d) comprises:

attaching the plurality of dies to the adhesive tape structure such that pads of the plurality of dies face away from the adhesive tape structure.

20. A method for transferring a plurality of integrated circuit dies that are attached to a support structure to a die receptacle structure, comprising:

(a) positioning the support structure and die receptacle structure to be closely adjacent to each other such that each die of a plurality of dies attached to the support structure is positioned in a corresponding cell of a plurality of cells in a first surface of the die receptacle structure; and

(b) releasing each die of the plurality of dies from the support structure so that each die resides in the corresponding cell of the plurality of cells.

21. The method of claim 20, wherein step (b) comprises:

moving apart the support structure and die receptacle structure.

22. The method of claim 21, wherein step (a) comprises:

contacting each die of the plurality of dies to a surface of the corresponding cell so that an adhesive material adheres each die of the plurality of dies in the corresponding cell.

23. The method of claim 22, wherein said moving step comprises:

moving apart the support structure and die receptacle structure so that each die remains in the corresponding cell due to the adhesive material overcoming an adhesiveness of the support structure.

24. The method of claim 21, further comprising:

(c) applying a suction at a second surface of the die receptacle structure so that at least a partial vacuum exists in each cell of the plurality of cells due to a hole in the second surface corresponding to each cell.

25. The method of claim 24, wherein said moving step comprises:

moving apart the support structure and die receptacle structure so that each die remains in the corresponding cell due to the applied suction overcoming an adhesiveness of the support structure.

26. The method of claim 20, further comprising:

(c) prior to step (a), applying an adhesive material in each cell of the plurality of cells.

27. The method of claim 20, wherein a first surface of each die is attached to the support structure, further comprising:

(c) prior to step (a), applying an adhesive material to a second surface of each die of the plurality of dies.

28. The method of claim 23, wherein the support structure is a tape structure, wherein said moving step comprises:

peeling the support structure from the die receptacle structure.

29. A die receptacle structure, comprising:

a body having a first surface and a second surface, the body including a plurality of cells, each cell being open at the first surface of the body,

wherein each cell includes a hole extending from a bottom surface of the cell to the second surface of the body, the hole being open at the bottom surface of the cell and at the second surface of the body.

30. The die receptacle structure of claim 29, wherein the plurality of cells are substantially rectangular.

31. The die receptacle structure of claim 29, wherein each cell has dimensions greater than the dimensions of an integrated circuit die.

32. The die receptacle structure of claim 29, wherein each hole has a diameter less than the width of an integrated circuit die.

33. The die receptacle structure of claim 29, wherein the plurality of cells are arranged in an array defined by a plurality of rows and a plurality of columns of cells.

34. The die receptacle structure of claim 29, further comprising an adhesive material covering at least a portion of the bottom surface of each cell.

35. A method for transferring a plurality of integrated circuit dies from a wafer to a die receptacle structure, comprising:

(a) positioning the wafer and die receptacle structure to be closely adjacent to each other such that each die of a plurality of dies of the wafer is positioned adjacent to a corresponding cell of a plurality of cells in a first surface of the die receptacle structure;

(b) applying a positive pressure at a first surface of the wafer;

(c) applying a suction at a second surface of the die receptacle structure so that at least a partial vacuum exists in each cell of the plurality of cells due to a hole in the second surface of the die receptacle structure corresponding to each cell; and

(d) separating each die of the plurality of dies from the wafer so that each die is transferred into the corresponding cell of the plurality of cells by the applied suction.

36. The method of claim 35, further comprising:

(e) prior to step (a), applying an adhesive material in each cell of the plurality of cells.

37. The method of claim 36, wherein step (d) comprises:

separating each die of the plurality of dies from the wafer so that each die is transferred into the corresponding cell of the plurality of cells by the applied suction and adheres to the adhesive material of the corresponding cell.

38. The method of claim 35, further comprising:

(d) prior to step (a), applying an adhesive material to a surface of the wafer.

39. The method of claim 38, wherein step (d) comprises:

separating each die of the plurality of dies from the wafer so that each die is transferred into the corresponding cell of the plurality of cells by the applied suction, and the adhesive material adheres each die in the corresponding cell.

40. A method for transferring a plurality of integrated circuit dies that are attached to a support structure to a die receptacle structure, comprising:

(a) positioning the support structure and die receptacle structure to be closely adjacent to each other such that each die of a plurality of dies attached to the support structure is positioned adjacent to a corresponding cell of a plurality of cells in a first surface of the die receptacle structure;

(b) applying a positive pressure at a first surface of the wafer;

(c) applying a suction at a second surface of the die receptacle structure so that at least a partial vacuum exists in each cell of the plurality of cells due to a hole in the second surface of the die receptacle structure corresponding to each cell; and

(d) releasing each die of the plurality of dies from the support structure so that each die resides in the corresponding cell of the plurality of cells.

41. The method of claim 40, wherein portions of the die receptacle structure around cells are substantially sharp, wherein step (d) comprises:

allowing the applied suction and the positive pressure to cause the sharp portions of the die receptacle structure to cut the support structure around each die of the plurality of dies, such that each die of the plurality of dies is separated from the support structure and is transferred into the corresponding cell of the plurality of cells by the applied suction.

42. The method of claim 41, wherein step (a) comprises:

positioning the support structure and die receptacle structure to be closely adjacent to each other such that a surface of the support structure that attaches the plurality of dies faces towards the die receptacle structure.

43. The method of claim 41, wherein step (a) comprises:

positioning the support structure and die receptacle structure to be closely adjacent to each other such that a surface of the support structure that attaches the plurality of dies faces away from the die receptacle structure.

44. The method of claim 40, further comprising:

(e) prior to step (a), applying an adhesive material in each cell of the plurality of cells.

45. The method of claim 44, wherein step (c) comprises:

separating each die of the plurality of dies from the support structure so that each die adheres to the adhesive material of the corresponding cell.

46. The method of claim 40, further comprising:

(e) prior to step (a), applying an adhesive material to a first surface of the support structure, wherein the first surface of the support structure is opposite a second surface of the support structure that attaches the plurality of dies.

47. The method of claim 46, wherein step (d) comprises:

separating each die of the plurality of dies from the support structure so that each die is transferred into the corresponding cell of the plurality of cells by the applied suction and positive pressure, and the adhesive material adheres each die in the corresponding cell.

48. A system for transferring dies, comprising:

a die receptacle structure, comprising;

a body having a first surface and a second surface, the body including a plurality of cells, each cell being open at the first surface of the body,

wherein each cell includes a hole extending from a bottom surface of the cell to the second surface of the body, the hole being open at the bottom surface of the cell and at the second surface of the body.

49. The system of claim 48, further comprising:

a vacuum source.

50. The system of claim 49, further comprising:

a positive pressure source.

51. The system of claim 48, further comprising:

a pin plate that mounts at least one pin, wherein the at least one pin is used to pass through at least one corresponding hole of the plurality of holes to punch at least one corresponding die from the die receptacle structure.