Manufacturing method of semiconductor device

• US 20050009302A1
• Filed: 02/05/2004
• Published: 01/13/2005
• Est. Priority Date: 02/06/2003
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Ochiai, Isao, Wakui, Motoaki, Eyal, Ron, Shetrit, Gil
• Granted Patent: US 7,064,046 B2
• Time in Patent Office: Days
• US Class Current: 438/464
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304

Abstract

The invention provides an algorithm for aligning a rotating blade in a dicing process of partially dicing a wafer attached to a substrate. A width of a cut groove and distance between pads in the cut groove are detected by a recognition camera. Based on a result of this detection, alignment data Δy which is distance between a centerline of the width of the cut groove and a real centerline are calculated. Based on a difference between the distance of the pads in the cut groove and a target value of the distance, data Δz on alignment in a depth direction of the cut groove is calculated. The rotating blade is aligned by using the alignment data Δy and Δz.

Claims

1. A method of manufacturing a semiconductor device, comprising:

providing a wafer comprising a predetermined dicing line region and a pair of pads that are formed on a front surface of the wafer so that part of each of the pads is disposed in the dicing line region;

attaching a first substrate to the front surface of the wafer;

attaching a second substrate to a back surface of the wafer;

forming a cut groove from a surface of the second substrate by moving a blade along the dicing line region so as to expose an end portion of each of the pads in the cut groove;

irradiating the cut groove with detection light;

measuring a width of the cut groove by detecting light reflected from opposing upper end portions of the cut groove;

measuring a distance between the two pads by detecting light reflected from the exposed end portions of the two pads; and

aligning the blade based on a result of the measuring of the width, the distance or both the width and the distance so that a center line of the cut groove is located at a center line of the predetermined dicing line region and that a depth of the cut groove is a predetermined depth.

2. The method of claim 1, wherein the blade is aligned in a horizontal direction based on a distance between the centerline of the cut groove and the centerline of the dicing line region.

3. The method of claim 1, wherein the blade is aligned in a vertical direction based on the distance between the two pads.

4. The method of claim 1, wherein the light reflected from the opposing upper end portions of the cut groove or from the exposed end portions of the two pads is detected by a recognition camera.

5. A method of manufacturing a semiconductor device, comprising:

providing a wafer comprising a predetermined dicing line region and a pad that is formed on a front surface of the wafer so that part of the pad is disposed in the dicing line region;

attaching a first substrate to the front surface of the wafer;

attaching a second substrate to a back surface of the wafer;

forming a cut groove from a surface of the second substrate by moving a blade along the dicing line region so as to expose an end portion of the pad in the cut groove;

irradiating the cut groove with detection light;

determining a position of a centerline of the cut groove by detecting light reflected from opposing upper end portions of the cut groove;

determining a distance between the centerline of the cut groove and the pad by detecting light reflected from the exposed end portion of the pad and by using the determined position of the centerline of the cut groove; and

aligning the blade based on a result of the determining of the position, the distance or both the position and the distance so that the center line of the cut groove is located at a center line of the predetermined dicing line region and that a depth of the cut groove is a predetermined depth.

6. The method of claim 5, wherein the blade is aligned in a horizontal direction based on a distance between the centerline of the cut groove and the centerline of the dicing line region.

7. The method of claim 5, wherein the blade is aligned in a vertical direction based on the distance between the centerline of the cut groove and the pad.

8. The method of claim 5, wherein the light reflected from the opposing upper end portions of the cut groove or from the exposed end portion of the pad is detected by a recognition camera.

9. A method of manufacturing a semiconductor device, comprising:

providing a wafer comprising a predetermined dicing line region and a pad that is formed on a front surface of the wafer so that part of the pad is disposed in the dicing line region;

attaching a substrate to the front surface of the wafer;

forming a cut groove from a back surface of the wafer by moving a blade along the dicing line region so as to expose an end portion of the pad in the cut groove;

irradiating the cut groove with detection light;

determining a position of a centerline of the cut groove by detecting light reflected from opposing upper end portions of the cut groove;

determining a distance between the centerline of the cut groove and the pad by detecting light reflected from the exposed end portion of the pad and by using the determined position of the centerline of the cut groove; and

aligning the blade based on a result of the determining of the position, the distance or both the position and the distance so that the center line of the cut groove is located at a center line of the predetermined dicing line region and that a depth of the cut groove is a predetermined depth.

10. The method of claim 9, wherein the blade is aligned in a horizontal direction based on a distance between the centerline of the cut groove and the centerline of the dicing line region.

11. The method of claim 9, wherein the blade is aligned in a vertical direction based on the distance between the centerline of the cut groove and the pad.

12. The method of claim 9, wherein the light reflected from the opposing upper end portions of the cut groove or from the exposed end portion of the pad is detected by a recognition camera.