Method and apparatus for forming capping film

• US 20050009340A1
• Filed: 07/07/2004
• Published: 01/13/2005
• Est. Priority Date: 07/07/2003
• Status: Abandoned Application

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Yokota, Hiroshi, Shimoyama, Masashi, Saijo, Yasuhiko, Takagi, Daisuke, Wang, Xinming, Tashiro, Akihiko
• Application Number:
  US10/885,108
• Publication Number:
  US 20050009340A1
• Time in Patent Office: Days
• US Class Current: 438/687
• CPC Class Codes: C23C 18/1855 by mechanical pretreatment, e.g. grinding, sanding
• CPC Class Codes: C23C 18/1893 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: H01L 21/288 from a liquid, e.g. electrolytic deposition
• CPC Class Codes: H01L 21/76849 the layer being positioned on top of the main fill metal
• CPC Class Codes: H01L 21/76874 for electroless plating

Abstract

A capping film serving as an interconnect protective film formed on a surface of interconnect metal on a semiconductor substrate is formed after forming a catalyst layer for electroless plating under low oxygen concentration condition. A method for forming a capping film for protecting a surface of interconnect metal includes preparing a metal catalyst solution containing a metal element nobler than interconnect metal and having dissolved oxygen concentration of 7 ppm or less, bringing said metal catalyst solution into contact with a surface of interconnect metal to form a metal catalyst layer on the surface of the interconnect metal, and performing electroless plating to form a capping film on the surface of the interconnect metal.

Claims

1. A method for forming a capping film for protecting a surface of interconnect metal, comprising:

preparing a metal catalyst solution for electroless plating containing a metal element nobler than interconnect metal and having dissolved oxygen concentration of 7 ppm or less;

bringing said metal catalyst solution into contact with a surface of the interconnect metal to form a metal catalyst layer on the surface of the interconnect metal; and

performing electroless to form a capping film on the surface of the interconnect metal.

2. A method according to claim 1, wherein said interconnect metal comprises copper or copper alloy, and said metal element nobler than the interconnect metal comprises at least one of metal element selected from gold, silver, and platinum group metals.

3. A method according to claim 1, wherein an apparatus used for the step for forming the metal catalyst layer on the surface of the interconnect metal is placed in an atmosphere in which oxygen concentration is lower than oxygen concentration in the normal atmosphere.

4. A method according to claim 1, wherein formation of the metal catalyst layer is performed by replacement reaction of metal of the interconnect metal with metal catalyst.

5. A method according to claim 1, wherein said metal catalyst solution which dissolves palladium in inorganic acid or organic acid or a mixed solvent of inorganic acid and organic acid is used for forming said metal catalyst layer.

6. A method according to claim 1, wherein said capping film comprises a film containing at least one component selected from CoWP, NiP, NiB, CoP, NiWP, NiCoP, CoWB, NiWB, CoMoP, CoMoB and CoB.

7. A method according to claim 1, wherein a step before the step for forming the metal catalyst layer on the surface of the interconnect metal comprises a planarization step of an interconnect substrate by a wet process, and oxygen concentration of an atmosphere between units used for said planarization step and the step for forming the metal catalyst layer on the surface of the interconnect metal and within said units is lower than that of the normal atmosphere.

8. An apparatus for forming a capping film for protecting a surface of interconnect metal, comprising:

a catalyst-imparting unit for bringing a metal catalyst solution for electroless plating containing a metal element nobler than interconnect metal into contact with a surface of the interconnect metal and forming a metal catalyst layer on the surface of the interconnect metal; and

a plating unit for forming a capping film on the surface of the interconnect metal by electroless plating;

wherein said catalyst-imparting unit has a device configured to supply and discharge the metal catalyst solution and said plating unit has a device configured to supply and discharge a plating solution;

at least said catalyst-imparting unit is placed in a housing which limits an inflow of outer air;

said catalyst-imparting unit comprises a deaeration device configured to deaerate the metal catalyst solution; and

said housing for said catalyst-imparting unit comprises a low oxygen concentration device configured to replace an atmosphere in said housing with an inert gas or a low oxygen concentration gas.

9. An apparatus according to claim 8, wherein said deaeration device lowers dissolved oxygen concentration in the metal catalyst solution to 7 ppm or less.

10. An apparatus according to claim 8, wherein said interconnect metal comprises copper, said metal catalyst comprises palladium, and said capping film comprises a film containing at least one component selected from CoWP and NiP.

11. An apparatus according to claim 8, further comprising a planarization unit coupled to said apparatus for forming said capping film, said planarization unit being configured to planarize an interconnect substrate by a wet process;

wherein said planarization unit, said catalyst-imparting unit, and said plating unit and spaces between said units are disposed in a housing which limits an inflow of outer air, and said housing comprises a low oxygen concentration device configured to replace an atmosphere in said housing with an inert gas or a low oxygen concentration gas.