Method and apparatus for forming capping film
First Claim
1. A method for forming a capping film for protecting a surface of interconnect metal, comprising:
- preparing a metal catalyst solution for electroless plating containing a metal element nobler than interconnect metal and having dissolved oxygen concentration of 7 ppm or less;
bringing said metal catalyst solution into contact with a surface of the interconnect metal to form a metal catalyst layer on the surface of the interconnect metal; and
performing electroless to form a capping film on the surface of the interconnect metal.
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Accused Products
Abstract
A capping film serving as an interconnect protective film formed on a surface of interconnect metal on a semiconductor substrate is formed after forming a catalyst layer for electroless plating under low oxygen concentration condition. A method for forming a capping film for protecting a surface of interconnect metal includes preparing a metal catalyst solution containing a metal element nobler than interconnect metal and having dissolved oxygen concentration of 7 ppm or less, bringing said metal catalyst solution into contact with a surface of interconnect metal to form a metal catalyst layer on the surface of the interconnect metal, and performing electroless plating to form a capping film on the surface of the interconnect metal.
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Citations
11 Claims
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1. A method for forming a capping film for protecting a surface of interconnect metal, comprising:
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preparing a metal catalyst solution for electroless plating containing a metal element nobler than interconnect metal and having dissolved oxygen concentration of 7 ppm or less;
bringing said metal catalyst solution into contact with a surface of the interconnect metal to form a metal catalyst layer on the surface of the interconnect metal; and
performing electroless to form a capping film on the surface of the interconnect metal. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An apparatus for forming a capping film for protecting a surface of interconnect metal, comprising:
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a catalyst-imparting unit for bringing a metal catalyst solution for electroless plating containing a metal element nobler than interconnect metal into contact with a surface of the interconnect metal and forming a metal catalyst layer on the surface of the interconnect metal; and
a plating unit for forming a capping film on the surface of the interconnect metal by electroless plating;
wherein said catalyst-imparting unit has a device configured to supply and discharge the metal catalyst solution and said plating unit has a device configured to supply and discharge a plating solution;
at least said catalyst-imparting unit is placed in a housing which limits an inflow of outer air;
said catalyst-imparting unit comprises a deaeration device configured to deaerate the metal catalyst solution; and
said housing for said catalyst-imparting unit comprises a low oxygen concentration device configured to replace an atmosphere in said housing with an inert gas or a low oxygen concentration gas. - View Dependent Claims (9, 10, 11)
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Specification