Method of fabrication of an infrared radiation detector and infrared detector device
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Abstract
A method of fabricating an infrared detector, a method of controlling the stress in a polycrystalline SiGE layer and an infrared detector device is disclosed. The method of fabricating includes the steps of forming a sacrificial layer on a substrate; patterning said sacrificial layer; establishing a layer consisting essentially of polycrystalline SiGe on said sacrificial layer; depositing an infrared absorber on said polycrystalline SiGe layer; and thereafter removing the sacrificial layer. The method of controlling the stress in a polycrystalline SiGe layer deposited on a substrate is based on varying the deposition pressure. The infrared detector device comprises an active area and an infrared absorber, wherein the active area comprises a polycrystalline SiGe layer, and is suspended above a substrate.
61 Citations
37 Claims
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1-20. -20. (canceled)
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21. A method of controlling an internal stress in a polycrystalline silicon-germanium layer deposited on a substrate, the method comprising:
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selecting a deposition pressure that is at or below atmospheric pressure; and
selecting a deposition temperature that is no greater than 700°
C.;
wherein the deposition pressure and the deposition temperature are selected so as to achieve an internal stress in the silicon-germanium layer that is within a predetermined range. - View Dependent Claims (25, 26, 27, 28)
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22-24. -24. (canceled)
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29. A method of depositing a silicon-germanium layer, the method comprising:
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depositing a sacrificial layer on a substrate;
depositing a silicon-germanium layer on said sacrificial layer; and
removing at least a portion of said sacrificial layer from under said silicon-germanium layer. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37)
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Specification