Semiconductor device
First Claim
1. A semiconductor device, comprising:
- an upper substrate on which a plurality of through holes are formed;
a lower substrate; and
a plurality of semiconductor substrates provided between said upper substrate and said lower substrate, said plurality of semiconductor substrates forming a fixed electrode and a variable electrode, and each having a potential drawing portion, abutting on said through holes to draw potentials, wherein one of said plurality of semiconductor substrates is so formed as to surround a periphery of a region between said upper substrate and said lower substrate, like an outer peripheral frame, the others of said plurality of semiconductor substrates are disposed, being surrounded by an inner periphery of said outer peripheral frame formed by said one semiconductor substrate, and said potential drawing portion of said one semiconductor substrate is formed at a corner portion thereof and an area of said corner portion of said one semiconductor substrate including said potential drawing portion is almost equal to or less than an area of each of said potential drawing portions of said other semiconductor substrates.
1 Assignment
0 Petitions
Accused Products
Abstract
A first semiconductor substrate (3) is so formed as to surround a periphery of a region between an upper substrate (1) and a lower substrate (11) like an outer peripheral frame, a potential drawing portion (31) of the first semiconductor substrate (3) is formed at a corner portion thereof and an area of the corner portion of the first semiconductor substrate (3) including the potential drawing portion (31) is made equal to or less than an area of each of potential drawing portions (36a, 36b, 40) of other semiconductor substrates (5, 7, 9), to achieve reduction in chip size. A conductive layer is formed on a surface of the upper substrate (1) or the like and the conductive layer is fixed to a fixed voltage such as a ground potential. This conductive layer or the like shields the semiconductor substrates against disturbance such as proximity of other substances, static electricity or radio wave hindrance.
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Citations
9 Claims
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1. A semiconductor device, comprising:
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an upper substrate on which a plurality of through holes are formed;
a lower substrate; and
a plurality of semiconductor substrates provided between said upper substrate and said lower substrate, said plurality of semiconductor substrates forming a fixed electrode and a variable electrode, and each having a potential drawing portion, abutting on said through holes to draw potentials, wherein one of said plurality of semiconductor substrates is so formed as to surround a periphery of a region between said upper substrate and said lower substrate, like an outer peripheral frame, the others of said plurality of semiconductor substrates are disposed, being surrounded by an inner periphery of said outer peripheral frame formed by said one semiconductor substrate, and said potential drawing portion of said one semiconductor substrate is formed at a corner portion thereof and an area of said corner portion of said one semiconductor substrate including said potential drawing portion is almost equal to or less than an area of each of said potential drawing portions of said other semiconductor substrates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification